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    Method of manufacturing a wiring board by utilizing electro plating
    3.
    发明授权
    Method of manufacturing a wiring board by utilizing electro plating 有权
    利用电镀制造布线板的方法

    公开(公告)号：US07347949B2

    公开(公告)日：2008-03-25

    申请号：US11146235

    申请日：2005-06-07

    申请人： Hiroshi Miyagawa ,  Takaaki Karasawa ,  Hideyuki Wakabayashi

    发明人： Hiroshi Miyagawa ,  Takaaki Karasawa ,  Hideyuki Wakabayashi

    IPC分类号： H01B13/00

    CPC分类号： H05K3/243 ,  H05K3/0052 ,  H05K3/108 ,  H05K3/426 ,  H05K3/427 ,  H05K2203/0361 ,  H05K2203/0542

    摘要： A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electroless plating layers (19) are formed on both sides of an insulating substrate (1), which are covered with metallic foils (17) in advance, on which first electro plating layers (21) are formed; wiring patterns are formed by etching so as not to extend to the end edge of the substrate; second electroless plating layers (41) are formed on all of the surfaces of the substrate; a plating resist pattern (43) is formed so that only a predetermined portion of the wiring patterns is exposed; a second electro plating layer (27, 29) is formed on the predetermined portion of the wiring patterns by supplying an electric power from the second electroless plating layers; the plating resist pattern and the second electroless plating layers are removed; and a solder resist (45) is formed so that predetermined portions of the wiring patterns are exposed.

    摘要翻译： 一种利用电镀制造布线板的方法，其特征在于：当利用电镀在基板上形成布线图形时，不需要的部分不残留在布线图案上。 该方法包括：首先在绝缘基板（1）的两侧形成第一化学镀层（19），绝缘基板（1）预先被金属箔（17）覆盖，其上形成有第一电镀层（21） 通过蚀刻形成布线图案，以便不延伸到基板的端边缘; 在基板的所有表面上形成第二无电镀层（41） 形成电镀抗蚀剂图案（43），使得只有布线图案的预定部分露出; 通过从第二化学镀层供给电力，在布线图案的预定部分上形成第二电镀层（27,29）; 去除电镀抗蚀剂图案和第二无电镀层; 并且形成阻焊剂（45），使得布线图案的预定部分露出。

    Pipeline computer dividing a variable-length data-handling instruction into fixed-length data-handling instructions
    5.
    发明授权
    Pipeline computer dividing a variable-length data-handling instruction into fixed-length data-handling instructions 失效
    管线计算机将可变长度数据处理指令分为固定长度的数据处理指令

    公开(公告)号：US06502187B1

    公开(公告)日：2002-12-31

    申请号：US09440134

    申请日：1999-11-15

    申请人： Hiroshi Miyagawa

    发明人： Hiroshi Miyagawa

    IPC分类号： G06F9312

    CPC分类号： G06F9/30043 ,  G06F9/3016 ,  G06F9/3017 ,  G06F9/3836 ,  G06F9/384 ,  G06F9/3855 ,  G06F9/3857

    摘要： The present invention provides a pipelined computer which processes variable-length data without using branch instructions for speedy execution of a variable-length data-handling software instruction. Upon receiving a variable-length data-handling instruction from an instruction supply unit 1, an instruction division unit 2 divides the instruction into a plurality of derived micro instructions that handle fixed-length data. A reservation station 5 sends the derived micro instructions to an execution unit 6 and a redundant instruction detection unit 9 in a sequence in which the derived micro instructions were generated during the division. The redundant instruction detection unit 9 monitors the remaining derived micro instructions. An instruction deletion control unit 8 deletes redundant micro instructions in the reservation station 5. An instruction end operation unit 7 sets the state of the redundant derived micro instructions in the reorder buffer 4 to “execution completed state”.

    摘要翻译： 本发明提供了一种流水线计算机，其处理可变长度数据而不使用用于快速执行可变长度数据处理软件指令的分支指令。 指令分割单元2从指令提供单元1接收到可变长度的数据处理指令时，将该指令划分为处理固定长度数据的多个导出的微指令。 保留站5以分割之后产生导出的微指令的顺序将派生的微指令发送到执行单元6和冗余指令检测单元9。 冗余指令检测单元9监视剩余的导出的微指令。 指令删除控制单元8删除保留站5中的冗余微指令。指令结束操作单元7将重排序缓冲器4中的冗余导出微指令的状态设置为“执行完成状态”。

    OBJECT GRASPING CONTROL METHOD AND APPARATUS
    8.
    发明申请
    OBJECT GRASPING CONTROL METHOD AND APPARATUS 有权
    对象控制方法和装置

    公开(公告)号：US20110074171A1

    公开(公告)日：2011-03-31

    申请号：US12892748

    申请日：2010-09-28

    申请人： Keisuke Maehara ,  Hiroshi Miyagawa

    发明人： Keisuke Maehara ,  Hiroshi Miyagawa

    IPC分类号： B25J9/10 ,  G06F19/00 ,  B25J15/00

    CPC分类号： B25J9/1612 ,  B25J9/1679 ,  G05B2219/39487 ,  G05B2219/39543

    摘要： An object grasping control method, in which an object grasping control apparatus grasps a plurality of graspable members using a grasping unit, includes recognizing at least one of a shape, position, and attitude of each of the plurality of graspable members, setting, based on at least of one of the shape, position, and attitude of each of the plurality of graspable members, an attitude range as a graspable attitude range in which each of the plurality of graspable members and the grasping unit do not interfere with each other for each of the plurality of graspable members, and setting, as a grasping target to be grasped by the grasping unit, a graspable member, among the plurality of graspable members, the set graspable attitude range of which is greater than a predetermined threshold value.

    摘要翻译： 一种物体抓持控制方法，其中物体抓持控制装置使用抓握单元抓握多个可抓握构件，包括识别多个可抓握构件中的每一个的形状，位置和姿态中的至少一个，基于 至少所述多个所述可抓握构件的形状，位置和姿态中的至少一个，作为所述多个所述可抓握构件和所述把持单元中的每一个彼此不干扰的可握持姿态范围的姿态范围， 并且将所述可抓握姿势范围大于预定阈值的所述可抓握构件中的可握持构件设置为由所述把持单元抓握的把持对象。

    Endurance testing apparatus
    9.
    发明申请
    Endurance testing apparatus 有权

    公开(公告)号：US20060219024A1

    公开(公告)日：2006-10-05

    申请号：US11392867

    申请日：2006-03-30

    申请人： Masaaki Kato ,  Maiko Futamura ,  Hiroshi Miyagawa

    发明人： Masaaki Kato ,  Maiko Futamura ,  Hiroshi Miyagawa

    IPC分类号： G01B7/16

    CPC分类号： G01N3/56 ,  G01N2203/0005 ,  G01N2203/0037 ,  G01N2203/0242

    摘要： An endurance testing apparatus, which is for performing an endurance test of a contacting/separating portion in which a first member and a second member repeats contacting with and separating from each other, has a contact load generator and a testing medium fluid supply means. The contact load generator reciprocates the second member relative to the first member to generate a contact load acting between the first member and the second member repeatedly. The testing medium fluid supply means supplies a testing medium fluid to the contacting/separating portion to expose the first member and the second member to the testing medium fluid.

    Method of manufacturing a wiring board by utilizing electro plating
    10.
    发明申请
    Method of manufacturing a wiring board by utilizing electro plating 有权
    利用电镀制造布线板的方法

    公开(公告)号：US20060016779A1

    公开(公告)日：2006-01-26

    申请号：US11146235

    申请日：2005-06-07

    申请人： Hiroshi Miyagawa ,  Takaaki Karasawa ,  Hideyuki Wakabayashi

    发明人： Hiroshi Miyagawa ,  Takaaki Karasawa ,  Hideyuki Wakabayashi

    IPC分类号： H01B13/00

    CPC分类号： H05K3/243 ,  H05K3/0052 ,  H05K3/108 ,  H05K3/426 ,  H05K3/427 ,  H05K2203/0361 ,  H05K2203/0542

    摘要： A method of manufacturing a wiring board by utilizing electro plating characterized in that: when a wiring pattern is formed on the board by utilizing electro plating, an unnecessary portion does not remain on the wiring pattern. The method comprises: first electroless plating layers (19) are formed on both sides of an insulating substrate (1), which are covered with metallic foils (17) in advance, on which first electro plating layers (21) are formed; wiring patterns are formed by etching so as not to extend to the end edge of the substrate; second electroless plating layers (41) are formed on all of the surfaces of the substrate; a plating resist pattern (43) is formed so that only a predetermined portion of the wiring patterns is exposed; a second electro plating layer (27, 29) is formed on the predetermined portion of the wiring patterns by supplying an electric power from the second electroless plating layers; the plating resist pattern and the second electroless plating layers are removed; and a solder resist (45) is formed so that predetermined portions of the wiring patterns are exposed.

    摘要翻译： 一种利用电镀制造布线板的方法，其特征在于：当利用电镀在基板上形成布线图形时，不需要的部分不残留在布线图案上。 该方法包括：首先在绝缘基板（1）的两侧形成第一化学镀层（19），绝缘基板（1）预先被金属箔（17）覆盖，其上形成有第一电镀层（21） 通过蚀刻形成布线图案，以便不延伸到基板的端边缘; 在基板的所有表面上形成第二无电镀层（41） 形成电镀抗蚀剂图案（43），使得只有布线图案的预定部分露出; 通过从第二化学镀层供给电力，在布线图案的预定部分上形成第二电镀层（27,29）; 去除电镀抗蚀剂图案和第二无电镀层; 并且形成阻焊剂（45），使得布线图案的预定部分露出。