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公开(公告)号：US5284226A
公开(公告)日：1994-02-08
申请号：US971300
申请日：1992-11-04
CPC分类号： F16C29/005 , B66B7/025 , B66F9/02 , F16C29/045 , F16C29/048
摘要： A carriage guiding post in a transfer lifter, is a four-sided support post of an approximately square shape in cross section the support post having carriage guiding rail recesses provided in three of the four sides thereof, and a counter weight guiding rail track provided on the remaining side of the support post, the carriage guiding rail recesses and the counter weight guiding rail all extend continuously throughout the length of the support post, wherein the counter weight guiding rail track is a rib projecting from a central region of the side of the support post and extends lengthwise thereof, the rib having an approximately isosceles triangle shaped cross section.
摘要翻译： 在转移升降机中的托架导柱是横截面为大致正方形的四面支撑柱，支撑柱具有设置在其四个侧面中的三个侧面中的托架导轨凹槽，以及设置在其上的平衡重导轨轨道 支撑柱的剩余侧，托架导轨凹槽和配重导轨全部在支撑柱的整个长度上连续延伸，其中，配重导轨轨道是从中心区域突出的肋， 支撑柱并纵向延伸，肋具有大致等腰三角形的横截面。
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2.发明授权Master slice type semiconductor integrated circuit having 2 or more I/O cells per connection pad 失效每个连接焊盘具有2个以上I / O单元的主分片式半导体集成电路
公开(公告)号：US4942317A
公开(公告)日：1990-07-17
申请号：US351001
申请日：1989-05-12
IPC分类号： H01L21/822 , H01L21/82 , H01L23/528 , H01L27/04 , H01L27/118 , H03K19/173
CPC分类号： H03K19/1735 , H01L23/5286 , H01L24/06 , H01L27/11898 , H01L2224/05554 , H01L2924/14
摘要： An internal logic block is arranged in a chip body, and I/O cells and pads are arranged in a peripheral portion of the chip body. Three I/O cells are arranged for each pad.
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公开(公告)号：USD672875S1
公开(公告)日：2012-12-18
申请号：US29398000
申请日：2011-07-25
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公开(公告)号：US20070251721A1
公开(公告)日：2007-11-01
申请号：US11733689
申请日：2007-04-10
IPC分类号： H05K1/00
CPC分类号： H01L23/49894 , C08L63/00 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L23/562 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15311 , H01L2924/16195 , H05K1/0271 , H05K3/4676 , H05K2201/0133 , Y10T428/31522
摘要： In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.
摘要翻译： 在半导体器件中，封装基板的最上层配线层由温度为10〜30℃时断裂伸长率为20％以上，杨氏模量为1GPa以下的绝缘材料形成。 材料含有与环氧树脂或环氧树脂固化剂反应的反应性弹性体; 环氧树脂; 环氧树脂固化剂; 和具有双键和羟基，羧基或其它极性基团的交联苯乙烯 - 丁二烯橡胶。 因此，可以提供一种半导体器件，其具有其中与温度循环相关的连接可靠性高并且绝缘层和化学镀铜层之间的粘附性也高的布线板。
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公开(公告)号：US20160145048A1
公开(公告)日：2016-05-26
申请号：US15009396
申请日：2016-01-28
摘要： A slat conveyor has a plurality of slat bodies supported between a pair of left and right driving endless turning bodies by concentric horizontal support shafts and has a pair of front and rear guide rollers supported to a guide rail laid on each of upper and lower horizontal path sections. A U-turn guiding mechanism at both ends includes the guide rollers, a slat body posture controlling rotating body, and a drive mechanism for the rotating body. The rotating body has the same turning radius as that of the horizontal support shaft on a U-turn path section, and includes an engaging portion for positioning and turning the guide rollers. The drive mechanism drives the rotating body such that the engaging portion is turned in the same direction and at the same speed as the turning speed of the horizontal support shaft on the U-turn path section.
摘要翻译： 板条输送机具有通过同心的水平支撑轴支撑在一对左右驱动环形转动体之间的多个板条体，并且具有一对前后导向辊，该导向辊支撑在布置在上下水平路径上的导轨上 部分。 两端的U形转向引导机构包括导向辊，板条体姿态控制旋转体以及旋转体的驱动机构。 旋转体具有与U形转弯路径部分上的水平支撑轴相同的转动半径，并且包括用于定位和转动导向辊的接合部分。 驱动机构驱动旋转体，使得接合部分以与U形转弯路径部分上的水平支撑轴的转动速度相同的方向和相同的速度转动。
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公开(公告)号：US20130036828A1
公开(公告)日：2013-02-14
申请号：US13642599
申请日：2011-04-12
申请人： Yukari Kaga , Isamu Iida , Fumio Okada , Masahiro Ishibashi
发明人： Yukari Kaga , Isamu Iida , Fumio Okada , Masahiro Ishibashi
CPC分类号： G01N3/32 , G01N2203/0005 , G01N2203/0016
摘要： Provided is a fixing jig including: a base configured to be mounted to a load axis of a fatigue testing device and including an accommodating recess portion for accommodating a portion to be held of a test piece; a pressing member disposed so as to be supported in the accommodating recess portion and configured to come into surface contact with an end surface of the test piece; and an insert nut configured to be threadedly engaged with a male screw portion of the portion to be held of the test piece. The fixing jig further includes a fastening flange including a hole portion for loosely inserting the test piece therethrough and a flange portion configured to come into contact with the insert nut, for holding the test piece in the accommodating recess portion via the insert nut so that the end surface of the test piece is pressed against the pressing member supported by the base.
摘要翻译： 提供一种固定夹具，其包括：基座，被构造成安装在疲劳试验装置的负载轴上，并且包括容纳凹部，用于容纳要被保持的试验片的部分; 按压构件，其设置成被支撑在所述容纳凹部中并且构造成与所述测试件的端面进行表面接触; 以及插入螺母，其被构造成与待保持的所述测试件的所述部分的外螺纹部分螺纹接合。 固定夹具还包括紧固凸缘，该紧固凸缘包括用于松动地插入测试件的孔部分以及构造成与插入螺母接触的凸缘部分，用于经由插入螺母将测试件保持在容纳凹部中， 将测试件的端面压靠在由基座支撑的按压部件上。
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公开(公告)号：US6012474A
公开(公告)日：2000-01-11
申请号：US850895
申请日：1997-07-24
申请人： Masaki Takamoto , Shinichi Nakao , Masahiro Ishibashi , Yoshitaka Ina , Yoshikazu Yokoi , Masao Hayakawa
发明人： Masaki Takamoto , Shinichi Nakao , Masahiro Ishibashi , Yoshitaka Ina , Yoshikazu Yokoi , Masao Hayakawa
CPC分类号： G05D7/0635 , Y10T137/0396 , Y10T137/7759 , Y10T137/7761
摘要： A control circuit (20) of a mass flow control device (1) retains the relation (Cd=f(ReTH)) between the Reynolds number and the actual discharge coefficient of a sonic nozzle (13) in the area where the Reynolds number is small. In such an area, the sonic nozzle can be used as a variable mass flow element for controlling mass flow rate. If a pressure Pu and a temperature Tu of an upstream fluid of the sonic nozzle 13 are detected, the theoretical mass flow rate QmTH and the theoretical Reynolds number ReTH can be calculated; since the actual discharge coefficient Cd can be calculated by the above relationship Cd=f(ReTH) based on the calculated Reynolds number, the actual mass flow rate Qm can be calculated based on the relation of Qm=Cd.multidot.QmTH. In the control circuit 20, in order to obtain the predetermined mass flow rate Qm, the upstream fluid pressure Pu and temperature Tu of the sonic nozzle are obtained based on the above relationship, and a variable valve (12) is driven so that the mass flow rate may have this value. Since the properties of the sonic nozzle can be made full use of, it is possible to control trace amounts of mass flow rate with extremely high accuracy.
摘要翻译： 质量流量控制装置（1）的控制电路（20）保持雷诺数与声波喷嘴（13）的实际排放系数之间的关系（Cd = f（ReTH））在雷诺数为 小。 在这样的区域中，声波喷嘴可以用作用于控制质量流量的可变质量流量元件。 如果检测到声波喷嘴13的上游流体的压力Pu和温度Tu，则可以计算理论质量流量QmTH和理论雷诺数ReTH; 由于可以根据计算的雷诺数根据上述关系Cd = f（ReTH）来计算实际的放电系数Cd，所以可以基于Qm = CdxQmTH的关系来计算实际的质量流量Qm。 在控制电路20中，为了获得预定质量流量Qm，基于上述关系得到声波喷嘴的上游流体压力Pu和温度Tu，并且驱动可变阀（12），使得质量 流量可能有这个值。 由于可以充分利用声波喷嘴的特性，所以可以极高精度地控制痕量的质量流量。
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8.发明授权公开(公告)号：US08058565B2
公开(公告)日：2011-11-15
申请号：US11568111
申请日：2005-04-15
CPC分类号： H01L23/10 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L23/49894 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/16195 , H05K1/0271 , H05K1/112 , H05K3/205 , H05K3/4007 , H05K3/4644 , H05K2201/0314 , H05K2201/10674 , H05K2203/1536 , Y10T29/49124
摘要： In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), and solder bumps (7) are connected to the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) via the solder bumps (7). The uppermost wiring layer of the package board (2) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.
摘要翻译： 在半导体装置（1）中，设置多层布线层的封装基板（2），在封装基板的最上层布线层（矩阵状）配置多个安装基板（5） 2），并且焊料凸块（7）连接到安装焊盘（5）。 通过焊锡凸块（7）将半导体芯片（9）安装在封装板（2）上。 封装基板（2）的最上层布线层由温度为10〜30℃的杨氏模量为1GPa以下的树脂材料形成，断裂伸长率为50％以上。
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9.发明授权Insulation material of reactive elastomer, epoxy resin, curing agent and crosslinked rubber 失效活性弹性体，环氧树脂，固化剂和交联橡胶的绝缘材料公开(公告)号：US07981963B2
公开(公告)日：2011-07-19
申请号：US11733689
申请日：2007-04-10
CPC分类号： H01L23/49894 , C08L63/00 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L23/562 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15311 , H01L2924/16195 , H05K1/0271 , H05K3/4676 , H05K2201/0133 , Y10T428/31522
摘要： In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.
摘要翻译： 在半导体器件中，封装基板的最上层配线层由温度为10〜30℃时断裂伸长率为20％以上，杨氏模量为1GPa以下的绝缘材料形成。 材料含有与环氧树脂或环氧树脂固化剂反应的反应性弹性体; 环氧树脂; 环氧树脂固化剂; 和具有双键和羟基，羧基或其它极性基团的交联苯乙烯 - 丁二烯橡胶。 因此，可以提供一种半导体器件，其具有其中与温度循环相关的连接可靠性高并且绝缘层和化学镀铜层之间的粘合性也高的布线板。
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10.发明申请公开(公告)号：US20070274060A1
公开(公告)日：2007-11-29
申请号：US11568111
申请日：2005-04-15
IPC分类号： H05K7/02
CPC分类号： H01L23/10 , H01L21/563 , H01L23/49816 , H01L23/49838 , H01L23/49894 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15311 , H01L2924/16195 , H05K1/0271 , H05K1/112 , H05K3/205 , H05K3/4007 , H05K3/4644 , H05K2201/0314 , H05K2201/10674 , H05K2203/1536 , Y10T29/49124
摘要： In a semiconductor device (1), a package board (2) is provided in which a plurality of wiring layers are layered, a plurality of mounting pads (5) arranged in a matrix are provided to the uppermost wiring layer of the package board (2), and solder bumps (7) are connected to the mounting pads (5). A semiconductor chip (9) is mounted on the package board (2) via the solder bumps (7). The uppermost wiring layer of the package board (2) is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.
摘要翻译： 在半导体装置（1）中，设置多层布线层的封装基板（2），在封装基板的最上层布线层（矩阵状）配置多个安装基板（5） 2），并且焊料凸块（7）连接到安装焊盘（5）。 通过焊锡凸块（7）将半导体芯片（9）安装在封装板（2）上。 封装基板（2）的最上层布线层由温度为10〜30℃的杨氏模量为1GPa以下的树脂材料形成，断裂伸长率为50％以上。
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