摘要:
A binder composition is disclosed, which comprises:(A) a copolymer emulsion which contains as its essential ingredients vinyl acetate, ethylene, and a monomer represented by the formula (1): ##STR1## wherein R.sub.1 is H or CH.sub.3 ; and R.sub.2 is H or an alkyl group having not more than 5 carbon atoms, the proportions of the respective ingredients being within the range of 55-96.5/3-40/0.5-5 on a weight basis;(B) a formaldehyde-free nitrogen-containing glyoxal resin;(C) a metal salt catalyst; and optionally(D) a higher alcohol sulfuric acid ester-based surfactant.Nonwoven fabrics and impregnated papers using the binder composition are also disclosed. The binder composition exhibits not only high resistance to water and solvents but also low residual free formaldehyde level, with an improvement in foamability being optionally attainable.
摘要:
When the coating object area is positioned on the suction table, the film is stopped and is mounted on the suction table, and is further provided with tension in the longitudinal direction to eliminate slacks or the like, but, curl is caused in the both side end regions in the coating object area. Therefore, the coating object area is mounted on the suction table, and at the same time, the curl correction bars disposed on the both sides of the suction table are moved to the curled portions of the coating object area, and then the curled portions are pressed against the suction surface of the suction table to thereby perform the curl correction. Further, in the coating process with the UV-curing coating material, the UV light from the UV light source formed integrally with the coating head is applied to cure the material. In the vacuum suction section, as the destination, the bubbles or the like in the coating head are sucked. When the suction of the coating head is not performed, the UV shutter is moved by the suction section air cylinder to block the suction port of the vacuum suction section. Thus, the inside of the vacuum suction section is shielded from the UV light.
摘要:
A semiconductor device includes a lead frame having an element support and a lead portion. The lead frame has an area from the element support to inner leads of the lead portion, which is formed flat. First and second semiconductor elements are stacked in order on a lower surface of the lead frame. Electrode pads of the first semiconductor element are connected to the inner leads via first metal wires. Ends of the first metal wires, which are connected to the first semiconductor element, are embedded in the second adhesive layer of the second semiconductor element.
摘要:
A film paid out from a feed side film roll is conveyed so that an application target area of the film is located on a suction table in an application portion. Image-capturing cameras are disposed so as to be adjacent to ink-jet application heads so that one application head and one image-capturing camera are integrated with each other in terms of position of installation to form one application head unit portion. Each application head unit portion is moved above the suction table by a three-dimensionally movable XYZ-direction driving unit. A position where application will be performed next is image-captured by each of the image-capturing cameras in advance during the applying operation due to each of the application heads. A result of image capturing by each of the image-capturing cameras is processed by an image processing unit.
摘要:
A continuous pore elastomer featured by being made of a polyurethane, having a three dimensional network pore structure of which skeletons have an average thickness of 20 μm or less and 80% or more of the skeletons have a thickness within the range of 2 to 20 μm, having an apparent density of 0.2 to 0.4 g/cm3, containing a surfactant with a HLB value of 8 or more, and being capable of absorbing water instantly;a process for producing the continuous pore elastomer, comprising a step of extracting out the pore generation agent from the molding with water; anda water-absorbing roller and a swab obtained by using the continuous pore elastomer.
摘要翻译:由具有三维网状孔结构的聚氨酯制成的连续孔弹性体,其骨架的平均厚度为20μm以下,骨架的80%以上的厚度为2〜20μm的范围 ,表观密度为0.2〜0.4g / cm 3,含有HLB值为8以上的表面活性剂,并且能够瞬间吸收水分; 一种连续孔弹性体的制造方法,其特征在于,包括用水从成型体中提取孔产生剂的工序; 以及通过使用连续孔弹性体获得的吸水辊和棉签。
摘要:
A method in which a thin continuous film for conveying a base plate put on the film and another thin continuous film stuck to the main surface of the plate are automatically cut out along the contour of the plate, wherein a cutter is moved to one end of each edge of the plate from an optional position distant from the edge and is thereafter moved to the other end of the edge from another optional position distant from the edge, and movement of the cutter is performed with regard to all the edges of the plate sequentially.
摘要:
According to one embodiment, a semiconductor storage device is provided with a memory chip including a storage circuit, a controller chip that controls a memory chip, and a substrate having a first surface and a second surface opposing one another, on the first surface of which the controller chip is mounted. Further, the semiconductor storage device is provided with an external connection terminal formed on the second surface of the substrate, and resin that encapsulates the memory chip, the controller chip, and the substrate, includes a third surface and a fourth surface opposing one another, and has a predetermined mark directly printed only on the fourth surface that is adjacent to the second surface of the substrate.
摘要:
There is a need to provide a microcomputer capable of eliminating an external terminal for endian selection. Flash memory includes a user boot area for storing a program executed in user boot mode and corresponding endian information and a user area for storing a program executed in user mode and corresponding endian information. A data transfer circuit reads endian information stored in the user boot area or the user area in accordance with operation mode and supplies the endian information to a CPU before reset release of the CPU. Accordingly, an external terminal for endian selection can be eliminated.
摘要:
A semiconductor chip is divided into a first semiconductor region surrounded by pads and a region outside the pads. A memory is arranged at the region outside the pads. A memory arranged in the first semiconductor region and the memory arranged outside the pads are coupled to a bus interface unit via separate memory buses and a selector. The selector is driven by two phase, non-overlapping clock signals. A semiconductor integrated circuit device is provided that can easily accommodate for modification in the memory capacity of the memory and that can transfer signal/data at high speed with a low power consumption, irrespective of modification in bus interconnection length.