公开(公告)号：US20110227218A1

公开(公告)日：2011-09-22

申请号：US13116623

申请日：2011-05-26

申请人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： H01L23/498

CPC分类号： H01L23/147 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/48 ,  H01L33/486 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/85455 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.

摘要翻译： 在用于封装的硅衬底中，设置有通孔，其中填充有用于容纳电子器件的芯片的空腔的底表面的通孔到衬底的背面。 在空腔的底面侧的贯通电极的端部具有与形成包括电子器件的芯片的电路的布线的连接部。 用于封装的硅衬底的特征在于，（1）包括薄膜布线作为布线，并且连接部分被连接到薄膜布线的导体加强和/或（2）引线接合部分被包括为 通过在空腔的底面侧引线接合贯通电极的端部而形成布线和连接部。

公开(公告)号：US07960820B2

公开(公告)日：2011-06-14

申请号：US12265203

申请日：2008-11-05

申请人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： H01L23/14

CPC分类号： H01L33/04 ,  B81B2207/012 ,  B81C1/0023 ,  B81C2203/031 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0107 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2224/05599

摘要： A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates.

摘要翻译： 一种半导体封装件，其中电子器件芯片设置在通过堆叠多个硅衬底而构成的硅衬底堆叠产品的空腔中。

公开(公告)号：US07838897B2

公开(公告)日：2010-11-23

申请号：US11673818

申请日：2007-02-12

申请人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

发明人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

IPC分类号： H01L29/267 ,  H01L29/16

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  Y10T29/49002 ,  Y10T83/04 ,  H01L2224/05599

摘要： The invention provides a light-emitting device 10 including a light-emitting element 12 and a substrate 11 where the light-emitting element 12 is arranged, characterized in that a housing part 28 housing the light-emitting element 12 and having a shape that is tapered upward from the substrate 11 and a metal frame 15 surrounding the light-emitting element 12 and including the side face 28A of the housing part 28 made into a almost mirror-polished surface are provided on the substrate 11.

摘要翻译： 本发明提供一种发光装置10，其包括发光元件12和布置有发光元件12的基板11，其特征在于，容纳发光元件12的壳体部28，其形状为 在基板11上设置有从基板11向上方逐渐变细的金属框架15和包围发光元件12的金属框架15，并且将金属框架15包括在壳体部件28的侧面28A上，该壳体部件28被形成为近似镜面抛光的表面。

公开(公告)号：US07795140B2

公开(公告)日：2010-09-14

申请号：US12247496

申请日：2008-10-08

申请人： Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/44

CPC分类号： H01L21/486 ,  H01L21/76898 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/18301

摘要： A method of manufacturing a substrate, includes: (a) forming the through hole by etching the silicon substrate from a first surface of the silicon substrate by a Bosch process; (b) forming a thermal oxide film such that the thermal oxide film covers the first surface of the silicon substrate, a second surface of the silicon substrate opposite to the first surface, and a surface of the silicon substrate corresponding to a side surface of the through hole, by thermally oxidizing the silicon substrate where the through hole is formed; (c) removing the thermal oxide film; (d) forming an insulating film such that the insulating film covers the first and second surfaces of the silicon substrate and the surface of the silicon substrate corresponding to the side surface of the through hole; and (e) forming the through electrode in the through hole on which the insulating film is formed.

摘要翻译： 一种制造衬底的方法，包括：（a）通过使用Bosch工艺从硅衬底的第一表面上蚀刻硅衬底形成通孔; （b）形成热氧化膜，使得热氧化膜覆盖硅衬底的第一表面，与第一表面相对的硅衬底的第二表面和与衬底的侧表面相对应的硅衬底的表面 通孔，通过热氧化形成通孔的硅衬底; （c）去除热氧化膜; （d）形成绝缘膜，使得所述绝缘膜覆盖所述硅衬底的所述第一表面和所述第二表面以及所述硅衬底的与所述通孔的侧表面相对应的表面; 和（e）在其上形成有绝缘膜的通孔中形成通孔。

公开(公告)号：US07794112B2

公开(公告)日：2010-09-14

申请号：US11984930

申请日：2007-11-26

申请人： Mitsutoshi Higashi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Akinori Shiraishi

发明人： Mitsutoshi Higashi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Akinori Shiraishi

IPC分类号： F21V1/00

CPC分类号： F21V11/16 ,  F21K9/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2924/16195

摘要： It is a lighting apparatus 10 that has a light emitting element 16, a light emitting element housing 15 having a concave portion 28 that accommodates the light emitting element 16, and an optically transparent member 18 that airproofs a space B formed by the concave portion 28 and transmits light emitted from the light emitting element 16. The concave portion 28 is shaped to become wider toward the optically transparent member 18 from the bottom surface 28A of the concave portion 28. The lighting apparatus 10 is provided with a light shielding member 12 for shielding a part of light emitted from the light emitting element 16 is provided on the optically transparent member 18.

摘要翻译： 它是具有发光元件16，具有容纳发光元件16的凹部28的发光元件壳体15的照明装置10以及对由凹部28形成的空间B进行空气隔绝的光学透明构件18 并且透射从发光元件16发射的光。凹部28从凹部28的底面28A朝向光学透明构件18变宽。照明装置10设置有遮光构件12， 屏蔽从发光元件16发射的光的一部分设置在光学透明构件18上。

公开(公告)号：US07508057B2

公开(公告)日：2009-03-24

申请号：US11892069

申请日：2007-08-20

申请人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： H01L23/06

CPC分类号： B81B7/007 ,  B81B2207/012 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side of the silicon substrate; an electronic component mounted on the electrode post and having a connection terminal connected to the top end of the electrode post; and a cap package unit joined onto a periphery of the silicon package unit, and constructing a housing portion in which the electronic component is housed to be hermetically sealed.

摘要翻译： 本发明的电子部件装置包括：具有如下结构的硅封装单元，其中设置在硅基板上的通孔与连接到贯通电极的电极柱直立设置在硅衬底的上侧; 安装在所述电极柱上并具有连接到所述电极柱的顶端的连接端子的电子部件; 以及连接到所述硅封装单元的周边上的盖封装单元，以及构成容纳所述电子部件的壳体部分以进行气密密封。

公开(公告)号：US07488094B2

公开(公告)日：2009-02-10

申请号：US11644977

申请日：2006-12-26

申请人： Kei Murayama ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi

发明人： Kei Murayama ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Naoyuki Koizumi ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi ,  Yuichi Taguchi

IPC分类号： F21V5/00

CPC分类号： H01L33/58 ,  H01L24/97 ,  H01L33/507 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor device made by mounting a light emitting element on a substrate, where an optically-transparent cover with a flat plate shape is installed on the light emitting element and a groove part for suppressing reflection of light emission of the light emitting element is formed in the cover.

摘要翻译： 通过将发光元件安装在基板上而制成的半导体器件，其中在发光元件上安装有平板形状的光学透明盖，并且形成用于抑制发光元件的发光反射的槽部 封面。

公开(公告)号：US20080123344A1

公开(公告)日：2008-05-29

申请号：US11773155

申请日：2007-07-03

申请人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Kei Murayama ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Mitsutoshi Higashi

IPC分类号： F21V15/01 ,  F21V7/04 ,  H01J9/02

CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/3025 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device housing having a concave part is provided therein for housing a light emitting device. Side surfaces of the concave part are each configured to be a perpendicular surface that is substantially perpendicular to a bottom surface of the concave part, and other side surfaces are each configured to be an inclined surface for reflecting light from the light emitting device toward above the light emitting device.

摘要翻译： 在其中设置有具有凹部的发光器件壳体，用于容纳发光器件。 凹部的侧面分别构成为大致垂直于凹部的底面的垂直面，其他侧面各自构成为将来自发光元件的光向上方倾斜的倾斜面 发光装置。

公开(公告)号：US20080029852A1

公开(公告)日：2008-02-07

申请号：US11882568

申请日：2007-08-02

申请人： Kei Murayama ,  Yuichi Taguchi ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Mitsutoshi Higashi

发明人： Kei Murayama ,  Yuichi Taguchi ,  Naoyuki Koizumi ,  Masahiro Sunohara ,  Akinori Shiraishi ,  Mitsutoshi Higashi

IPC分类号： H01L29/02 ,  H01L21/46

CPC分类号： H01L23/055 ,  B81B2207/012 ,  B81C1/0023 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a laminated substrate formed by laminating a plurality of semiconductor substrates, a concave part formed in the laminated substrate, and a semiconductor element mounted in the concave part. A method of manufacturing a semiconductor device includes a first step of forming a laminated substrate by laminating a plurality of semiconductor substrates, a second step of forming a concave part by etching the laminated substrate, and a third step of mounting a semiconductor element in the concave part.

摘要翻译： 半导体器件包括通过层叠多个半导体衬底，形成在层叠衬底中的凹部和安装在凹部中的半导体元件而形成的层叠衬底。 一种制造半导体器件的方法包括：通过层叠多个半导体衬底形成层叠衬底的第一步骤，通过蚀刻层叠衬底形成凹部的第二步骤，以及将半导体元件安装在凹部中的第三步骤 部分。

公开(公告)号：US20070194712A1

公开(公告)日：2007-08-23

申请号：US11700761

申请日：2007-02-01

申请人： Akinori Shiraishi ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  H01L24/97 ,  H01L33/44 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a semiconductor device 100, a light emitting device 102 is mounted on a substrate 101. A light reflection preventing film 130 for preventing a reflection of a light is formed on an upper surface of the light emitting device 102. Moreover, a plate-shaped cover 103 formed of a glass having a light transparency is disposed above the light emitting device 102, and a light reflection preventing film 140 for preventing a reflection of a light is also formed on an upper surface of the cover 103.

摘要翻译： 在半导体装置100中，发光装置102安装在基板101上。 在发光装置102的上表面上形成用于防止光反射的光反射防止膜130。 此外，由发光元件102的上方配置由具有透光性的玻璃构成的板状的盖103，在盖103的上表面也形成防止光反射的防光膜140 。