公开(公告)号：US20100281862A1

公开(公告)日：2010-11-11

申请号：US12810932

申请日：2008-07-30

申请人： Keiichi Shiraishi ,  Takanori Teshima ,  Takuma Ashida ,  Takanori Nishijima ,  Shinji Nomura

发明人： Keiichi Shiraishi ,  Takanori Teshima ,  Takuma Ashida ,  Takanori Nishijima ,  Shinji Nomura

IPC分类号： F02D23/00 ,  F02B33/40

CPC分类号： F02B37/007 ,  F02B37/001 ,  F02B37/002 ,  F02B37/16 ,  F02B37/22 ,  F02B37/225 ,  Y02T10/144

摘要： In a marine diesel engine equipped with a plurality of turbochargers, when the turbochargers are switched from single operation to parallel operation or from parallel operation to single operation, surging in the turbocharger to be started or stopped is prevented. The marine diesel engine includes an exhaust pipe (L2) via which an exhaust manifold (6) mounted on an engine body (2) communicates with a turbine part (4a), a turbine inlet valve (10) connected somewhere in the exhaust pipe (L2), a supply pipe (L4) via which a compressor part (4b) communicates with a supply manifold (7) mounted on the engine body (2), a check valve (11) that is connected somewhere in the supply pipe (L4) and that becomes open when the outlet pressure of the compressor part (4b) reaches or exceeds the outlet pressure of a compressor part (3b); an air vent pipe (L9) having one end thereof connected somewhere in the supply pipe (L4) between the compressor part (4b) and the check valve (11), and an air vent valve (12) connected somewhere in the air vent pipe (L9).

摘要翻译： 在配备有多个涡轮增压器的船用柴油发动机中，当涡轮增压器从单一操作切换到并联运行或从并联运行到单次运转时，防止涡轮增压器中的起动或停止的喘振。 船用柴油发动机包括排气管（L2），安装在发动机主体（2）上的排气歧管（6）通过该排气管与涡轮部分（4a）连通，涡轮进口阀（10）连接在排气管的某处 L2），压缩机部（4b）与安装在发动机主体（2）上的供给歧管（7）连通的供给管（L4），连接在供给管（L4）的某处的止回阀 ），并且当压缩机部分（4b）的出口压力达到或超过压缩机部分（3b）的出口压力时变为开启; 其一端连接在压缩机部4b和止回阀11之间的供给管L4的某处的排气管L9，以及排气阀12， （L9）。

公开(公告)号：US20080295516A1

公开(公告)日：2008-12-04

申请号：US11631519

申请日：2005-10-26

申请人： Takanori Teshima ,  Keiichi Shiraishi ,  Koichiro Imakiire ,  Yoshitsugu Aono

发明人： Takanori Teshima ,  Keiichi Shiraishi ,  Koichiro Imakiire ,  Yoshitsugu Aono

IPC分类号： F02G3/00

CPC分类号： F02B39/00 ,  F01D25/145 ,  F01D25/24 ,  F01D25/243 ,  F01D25/26 ,  F02C6/12 ,  F05D2220/40

摘要： An axial flow type exhaust gas turbine supercharger (TC) enabling maintainability to be secured by easily attaching/detaching an inner casing, capable of solving problems in thermal expansion and an increase in weight which make its design difficult, and formed to rotate a coaxial compressor with a shaft output provided by the expansion of exhaust gas led into an axial flow turbine (20). The exhaust gas turbine supercharger comprises a gas inlet casing (25) of double structure in which an inner casing (21) and an outer casing (22) formed separately from each other are formed integrally with each other by bolting and a space formed between both casings (21) and (22) forms an exhaust gas flow passage (24) leading the exhaust gas to a turbine nozzle (23). The exhaust gas flow passage (24) is formed all around the periphery of the turbine in the rotating direction and the inner casing (21) is formed detachable in the axial direction.

摘要翻译： 一种轴流式排气涡轮增压器（TC），其能够通过容易地安装/拆卸内壳来确保维护性，能够解决热膨胀问题和重量增加，这使得其设计变得困难，并且形成为使同轴压缩机 其中轴输出由引导到轴流涡轮机（20）中的废气的膨胀而提供。 废气涡轮增压器包括双重结构的气体入口壳体（25），其中彼此分开形成的内壳体（21）和外壳体（22）通过螺栓连接形成为一体，并且在两者之间形成空间 外壳（21）和（22）形成排气流向通道（24），排气流向涡轮喷嘴（23）。 排气流路（24）沿旋转方向形成在涡轮机的周边的周围，内壳体（21）沿轴向形成为可拆卸的。

公开(公告)号：US10079226B2

公开(公告)日：2018-09-18

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： H01L23/36 ,  H01L25/11 ,  H01L23/473 ,  H05K7/20 ,  H01L23/40

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

公开(公告)号：US20120119347A1

公开(公告)日：2012-05-17

申请号：US13357690

申请日：2012-01-25

申请人： Kuniaki MAMITSU ,  Takanori Teshima

发明人： Kuniaki MAMITSU ,  Takanori Teshima

IPC分类号： H01L23/36

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US4418311A

公开(公告)日：1983-11-29

申请号：US338056

申请日：1982-01-08

申请人： Koshi Torii ,  Toshinori Maruyama ,  Yoshio Akita ,  Takanori Teshima

发明人： Koshi Torii ,  Toshinori Maruyama ,  Yoshio Akita ,  Takanori Teshima

IPC分类号： H02J7/14 ,  H02J7/16 ,  H02J7/24

CPC分类号： H02J7/166 ,  H02J7/1461

摘要： In a battery charge indicating system, there are provided detecting means of an npn-transistor for detecting a closed condition of an ignition switch, and switching means of a pnp-transistor for supplying a base current to a driving transistor in response to an output of the detecting means, so that the driving transistor is made conductive when the ignition switch is closed and a generator is not generating its output. The emitter of the pnp-transistor is connected to a battery not through a current supply terminal for a voltage regulator, whereby even when the current supply terminal is accidentally disconnected from the regulator, the driving transistor is made conductive so that an indicating lamp is activated to indicate that the generator is not in the operation condition.

摘要翻译： 在电池充电指示系统中，提供了用于检测点火开关的闭合状态的npn晶体管的检测装置，以及用于响应于输出的输出向驱动晶体管提供基极电流的pnp晶体管的开关装置 检测装置，使得当点火开关闭合并且发电机不产生其输出时，驱动晶体管导通。 pnp晶体管的发射极不通过用于电压调节器的电流源端子而连接到电池，由此即使当电流供应端子与调节器意外断开时，驱动晶体管导通，使得指示灯被激活 以指示发电机不处于运行状态。

公开(公告)号：US07468318B2

公开(公告)日：2008-12-23

申请号：US11702498

申请日：2007-02-06

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

IPC分类号： H01L21/4763

CPC分类号： H01L24/33 ,  H01L23/482 ,  H01L23/485 ,  H01L23/488 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/04941 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a mold type semiconductor device is provided. The device includes a semiconductor chip having a semiconductor part and a metallic member connecting to the chip via a conductive layer and a connecting member. The method includes: forming the semiconductor part on a semiconductor substrate so that a cell portion is provided; forming the conductive layer on the substrate; forming a first resist layer to cover a part of the conductive layer corresponding to the cell portion; etching the conductive layer with the first resist layer as a mask so that a first conductive layer is provided; removing the first resist layer and forming a second conductive layer to cover a surface and an edge of the first conductive layer. The second conductive layer has a Young's modulus equal to or larger than the semiconductor substrate.

摘要翻译： 提供了一种用于制造模具型半导体器件的方法。 该器件包括具有半导体部件和通过导电层和连接部件与芯片连接的金属部件的半导体芯片。 该方法包括：在半导体衬底上形成半导体部分以便提供电池部分; 在所述基板上形成所述导电层; 形成第一抗蚀剂层以覆盖对应于所述电池单元部分的所述导电层的一部分; 用第一抗蚀剂层作为掩模蚀刻导电层，从而提供第一导电层; 去除第一抗蚀剂层并形成第二导电层以覆盖第一导电层的表面和边缘。 第二导电层的杨氏模量等于或大于半导体衬底。

公开(公告)号：US20060096299A1

公开(公告)日：2006-05-11

申请号：US11262764

申请日：2005-11-01

申请人： Kuniaki Mamitsu ,  Takanori Teshima

发明人： Kuniaki Mamitsu ,  Takanori Teshima

IPC分类号： F25B21/02 ,  H01L35/28

CPC分类号： H01L25/117 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/473 ,  H01L25/115 ,  H01L2224/40137 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K7/20927 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

摘要翻译： 半导体器件至少包括半导体模块，该半导体模块包括半导体芯片，与半导体芯片热连接的散热器和用于将半导体芯片和散热片覆盖和密封的密封构件，以暴露热辐射表面 散热器。 辐射表面由制冷剂冷却。 在密封构件的一部分上形成有制冷剂流过制冷剂路径的开口。

公开(公告)号：US07009284B2

公开(公告)日：2006-03-07

申请号：US10302146

申请日：2002-11-22

申请人： Yoshimi Nakase ,  Takanori Teshima ,  Yukinori Migitaka

发明人： Yoshimi Nakase ,  Takanori Teshima ,  Yukinori Migitaka

IPC分类号： H01L23/495

CPC分类号： H01L23/42 ,  H01L23/4338 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided between first radiation block and cooling block. The press-fitting of the substrate unit is performed by a second radiation block which is screwed to push the first radiation block toward the cooling block. A high thermal-conductive radiation material is disposed at the interfaces between each of the insulation substrates and each of the blocks to keep adhesiveness therebetween.

公开(公告)号：US06946730B2

公开(公告)日：2005-09-20

申请号：US10787164

申请日：2004-02-27

申请人： Takanori Teshima

发明人： Takanori Teshima

IPC分类号： B29C45/14 ,  B29L31/34 ,  H01L21/56 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/433 ,  H01L23/48 ,  H01L23/36 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L24/33 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor chip generating heat, a pair of heat sinks, which face each other, to conduct heat from both surfaces of the chip, a pair of compressible insulating sheets, and a mold resin covering the chip, the heat sinks, and the sheets such that the sheets are exposed from the surface of the resin. The mold resin is prevented from covering the outer surfaces of the heat sinks, which are pressed by mold parts, and breakage of the chip is avoided during molding. The plates are insulated by the sheets, so no dedicated insulating sheets for the heat sinks are needed after the device is completed.

摘要翻译： 半导体器件包括产生热的半导体芯片，一对彼此面对的散热片，以从芯片的两个表面，一对可压缩绝缘片和覆盖芯片的模具树脂，散热片， 并且片材使得片材从树脂的表面露出。 防止模制树脂覆盖被模具部件挤压的散热器的外表面，并且在模制期间避免了芯片的断裂。 这些板被片材绝缘，因此在器件完成后，不需要用于散热器的专用绝缘片。

公开(公告)号：US20050073042A1

公开(公告)日：2005-04-07

申请号：US10802720

申请日：2004-03-18

申请人： Naohiko Hirano ,  Takanori Teshima

发明人： Naohiko Hirano ,  Takanori Teshima

IPC分类号： H01L23/40 ,  H01L23/433 ,  H01L23/473 ,  H01L23/34

CPC分类号： H01L23/4338 ,  H01L23/473 ,  H01L2224/32245 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor package is fixed with the fixed type cooler, but variable with the transformable type cooler. The transformable type cooler includes a transformable member of a metal thin plate covering a coolant chamber. The semiconductor module includes a sandwiching mechanism causing the fixed type cooler to be pressed toward the transformable type cooler. Fastening adjustment screws of the sandwiching mechanism causes a pressing frame to approach a cooler body of the transformable type cooler. Therefore, the semiconductor package is pressed via the fixed type cooler while the transformable member is slightly transformed. This enhances a degree of contact between the semiconductor package and transformable member via an insulating member.

摘要翻译： 半导体模块包括固定型和可变形型冷却器以及夹在冷却器之间的扁平半导体封装。 半导体封装的相对位置关系用固定式冷却器固定，但是可变形冷却器是可变的。 可变形型冷却器包括覆盖冷却剂室的金属薄板的可变形构件。 半导体模块包括使固定式冷却器朝向可变形型冷却器按压的夹持机构。 夹紧机构的紧固调节螺钉使得压框接近可变形式冷却器的较冷体。 因此，通过固定式冷却器对半导体封装进行压制，而可变形构件稍微变形。 这通过绝缘构件增强了半导体封装和可变形构件之间的接触程度。