公开(公告)号：US07927927B2

公开(公告)日：2011-04-19

申请号：US09928737

申请日：2001-08-13

Applicant: Son Ky Quan ,  Samuel L. Coffman ,  Bruce Reid ,  Keith E. Nelson ,  Deborah A. Hagen

Inventor： Son Ky Quan ,  Samuel L. Coffman ,  Bruce Reid ,  Keith E. Nelson ,  Deborah A. Hagen

IPC: H01L21/332

CPC classification number: H01L23/24 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).

Abstract translation: 半导体封装衬底（11）具有基本相同的封装位置阵列（13,14,16和21）。 封装位置（13,14,16和21）的整个阵列由密封剂（19）覆盖。 单个包装部位（13,14,16和21）通过锯切通过密封剂（19）和下面的半导体封装衬底（11）而被分割。

公开(公告)号：US4725388A

公开(公告)日：1988-02-16

申请号：US011510

申请日：1987-02-06

Applicant: Keith E. Nelson ,  Claude C. Crawford

Inventor： Keith E. Nelson ,  Claude C. Crawford

IPC: B01L3/00 ,  G01N21/03 ,  G01N21/64 ,  G01N33/53 ,  C09K11/00

CPC classification number: B01L3/5085 ,  G01N21/03 ,  G01N33/5304 ,  G01N21/64

Abstract: A vessel for holding at least one test sample to be measured for its fluorescence, wherein the vessel is formed from a material having a native fluorescence, and wherein the vessel is provided with a barrier which blocks penetration or at least reduces the extent of penetration of an exciting light into the vessel's fluorescable material to prevent fluorescent excitation of the vessel or at least reduces the extent to which the vessel is fluorescently excited when exposed to an exciting light during the fluorometric measurement.

Abstract translation: 用于保持至少一个要测量的测试样品用于其荧光的容器，其中所述容器由具有天然荧光的材料形成，并且其中所述容器设置有阻挡穿透或至少减小穿透程度的屏障 令人兴奋的光进入血管的荧光材料，以防止血管荧光激发，或至少减少在荧光测量期间暴露于激发光时血管荧光激发的程度。

公开(公告)号：US6093972A

公开(公告)日：2000-07-25

申请号：US304152

申请日：1999-05-03

Applicant: Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

Inventor： Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311

Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is then cured to form a polymeric encapsulant (38) that encapsulates the integrated circuit die (12).

Abstract translation: 形成微电子封装（10）并且包括通过多个焊料凸块互连（16）附接到衬底（14）以形成预组件（18）的集成电路管芯（12）。 集成电路管芯（12）具有面向衬底（14）并与间隔开的间隙（22）的有效面（20）。 集成电路管芯（12）还包括与有源面（20）相对的背面（24）。 衬底（14）包括管芯附接区域（26）和围绕集成电路管芯（12）的周围区域（28）。 焊料凸点互连（16）跨越间隙（22）延伸并连接集成电路管芯（12）和衬底（14）。 模具（30）围绕预组件（18）设置，使得模具（30）与衬底（14）配合以限定围绕集成电路管芯（12）的模腔（32）。 模具（30）具有包括周围区域（28）的模制表面（34）和面向背面（24）并与其间隔开的模具表面（34）。 聚合物前体（36）被分配到模腔（32）中并且抵靠模制表面（34）和背面（24）形成。 聚合物前体（36）然后被固化以形成封装集成电路管芯（12）的聚合密封剂（38）。

公开(公告)号：US5973337A

公开(公告)日：1999-10-26

申请号：US917121

申请日：1997-08-25

Applicant: James H. Knapp ,  Dwight L. Daniels ,  Keith E. Nelson ,  Brian A. Webb

Inventor： James H. Knapp ,  Dwight L. Daniels ,  Keith E. Nelson ,  Brian A. Webb

IPC: H01L23/28 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L23/315 ,  H01L23/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8547 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107

Abstract: A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top surface and solder pads (13) on a bottom surface. An optoelectronic component (24) is mounted on the semiconductor receiving area (17) and encapsulated with the optically transmissive material (29, 31). Solder balls (18) are formed on the solder pads (13).

Abstract translation: 耦合到球栅阵列基板（11）并由光学透射材料（29,31）封装的半导体器件（10）。 球栅阵列基板（11）在顶表面上具有导电互连（14）和半导体接收区（17）以及底表面上的焊盘（13）。 光电子部件（24）安装在半导体接收区域（17）上并用光学透射材料（29,31）封装。 在焊盘（13）上形成焊球（18）。

公开(公告)号：US4501970A

公开(公告)日：1985-02-26

申请号：US433825

申请日：1982-10-12

Applicant: Keith E. Nelson

Inventor： Keith E. Nelson

IPC: G01N21/64

CPC classification number: G01N21/6452 ,  G01N2021/6476 ,  G01N2201/0446

Abstract: A sensitive frontal approach fluorometer which is suitable for measuring the fluorescence of samples in open top microtest wells and which has an optical system for (a) directing an exciting light downwardly into the well's open top to fluorescently excite the sample and (b) detecting the sample's emitted light which passes upwardly through the well's open top.

Abstract translation: 一种灵敏的正面进场荧光计，适合于测量开顶微测井中样品的荧光，并且具有光学系统，用于（a）将激发光向下引导到井的开口顶部以荧光激发样品，以及（b）检测 样品发出的光向上通过井的开放顶部。

公开(公告)号：US5900669A

公开(公告)日：1999-05-04

申请号：US886100

申请日：1997-06-30

Applicant: James H. Knapp ,  Keith E. Nelson ,  Les Ticey ,  Kevin J. Foley

Inventor： James H. Knapp ,  Keith E. Nelson ,  Les Ticey ,  Kevin J. Foley

IPC: H01L23/31 ,  H05K3/28 ,  H05K3/34 ,  H01L23/28

CPC classification number: H01L23/3121 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/284 ,  H05K3/3452 ,  Y10T29/49144

Abstract: A substrate having a vent (20) and a method of forming the vent (20). A substrate (11) has conductive traces (14) and a semiconductor chip attach pad (17) on a top surface and conductive traces (12) and a bonding pad (13) on the bottom surface. A masking layer (18) is formed over the substrate (11) and openings are formed in the masking layer (18) to expose the conductive traces (14) and a semiconductor chip attach pad (17). The vent (20) is formed in the masking layer (18). A semiconductor chip (31) is mounted to the semiconductor chip attach pad (17). During a step of encapsulating the semiconductor chip (31) with a mold compound, the vent (20) provides pressure relief.

Abstract translation: 具有通气口（20）的基板和形成通气孔（20）的方法。 衬底（11）在顶表面上具有导电迹线（14）和半导体芯片附接焊盘（17）以及底表面上的导电迹线（12）和接合焊盘（13）。 掩模层（18）形成在衬底（11）上，并且在掩模层（18）中形成开口以暴露导电迹线（14）和半导体芯片附接焊盘（17）。 通气孔（20）形成在掩模层（18）中。 半导体芯片（31）安装到半导体芯片附接垫（17）。 在用模具化合物封装半导体芯片（31）的步骤期间，通气孔（20）提供压力释放。

公开(公告)号：US3993075A

公开(公告)日：1976-11-23

申请号：US644162

申请日：1975-12-24

Applicant: Wayne F. Lisenbee ,  Keith E. Nelson

Inventor： Wayne F. Lisenbee ,  Keith E. Nelson

IPC: A61B18/02 ,  F25D3/10 ,  A61B17/36

CPC classification number: A61B18/02 ,  F25D3/107 ,  A61B2018/00041

Abstract: A small, disposable cryosurgical probe having a self-contained liquid refrigerant supply can be operated in either a freeze mode or a defrost mode. During the freeze mode the refrigerant is conducted from the supply to the probe tip as a two phase fluid so that the probe can freeze tissue for a relatively long period with a limited refrigerant supply. To facilitate detaching the probe tip from tissue, a button on the probe is depressed which switches the probe to its defrost mode of operation wherein room temperature liquid refrigerant is conducted directly from the supply to the probe tip thereby immediately warming the tip. The probe may be cycled several times between its freeze and defrost modes before the refrigerant supply is exhausted.

Abstract translation: 具有独立液体制冷剂供应的小型一次性冷冻手术探针可以以冻结模式或除霜模式操作。 在冷冻模式期间，制冷剂作为两相流体从供应器传导到探针尖端，使得探头可以用有限的制冷剂供应将组织冷冻相对较长的时间。 为了便于将探针尖端从组织分离，按下探针上的按钮，其将探针切换到其除霜操作模式，其中室温液体制冷剂直接从供应物传导到探针末端，从而立即加热尖端。 在制冷剂供应耗尽之前，探头可以在其冻结和除霜模式之间循环几次。

公开(公告)号：US3951152A

公开(公告)日：1976-04-20

申请号：US550124

申请日：1975-02-14

Applicant: William H. Crandell ,  Wayne F. Lisenbee ,  Keith E. Nelson

Inventor： William H. Crandell ,  Wayne F. Lisenbee ,  Keith E. Nelson

IPC: A61B18/02 ,  A61B17/36

CPC classification number: A61B18/02 ,  F25B2309/021

Abstract: A small, self-contained, disposable cryosurgical probe has a pencil-like housing with a refrigerant-containing cartridge in the housing and a hollow tip projecting from the housing. A small diameter capillary tube has one end in the housing opposite the cartridge and its other end extending into the tip with the intervening length of the tube formed into a multi-turn coil. The refrigerant is conducted from the cartridge through the tube to the probe tip and the temperature of the refrigerant is stabilized so as to maintain a substantially uniform mass flow rate of refrigerant through the tube to the tip.

Abstract translation: 小型，独立的一次性冷冻手术探针具有铅笔状壳体，壳体中具有制冷剂容纳盒，并且从壳体突出的中空尖端。 一个小直径的毛细管的一端位于壳体中与筒相对的一端，另一端延伸到尖端，管的中间长度形成多匝线圈。 制冷剂从筒通过管传导到探针尖端，并且制冷剂的温度稳定，从而将制冷剂的质量流量通过管保持到尖端。

公开(公告)号：US5895229A

公开(公告)日：1999-04-20

申请号：US858756

申请日：1997-05-19

Applicant: Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

Inventor： Francis J. Carney ,  George Amos Carson ,  Phillip C. Celaya ,  Harry Fuerhaupter ,  Frank Tim Jones ,  Donald H. Klosterman ,  Cynthia M. Melton ,  James Howard Knapp ,  Keith E. Nelson

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311

Abstract: A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24). The polymeric precursor (36) is then cured to form a polymeric encapsulant (38) that encapsulates the integrated circuit die (12).

Abstract translation: 形成微电子封装（10）并且包括通过多个焊料凸块互连（16）附接到衬底（14）以形成预组件（18）的集成电路管芯（12）。 集成电路管芯（12）具有面向衬底（14）并与间隔开的间隙（22）的有效面（20）。 集成电路管芯（12）还包括与有源面（20）相对的背面（24）。 衬底（14）包括管芯附接区域（26）和围绕集成电路管芯（12）的周围区域（28）。 焊料凸点互连（16）跨越间隙（22）延伸并连接集成电路管芯（12）和衬底（14）。 模具（30）围绕预组件（18）设置，使得模具（30）与衬底（14）配合以限定围绕集成电路管芯（12）的模腔（32）。 模具（30）具有包括周围区域（28）的模制表面（34）和面向背面（24）并与其间隔开的模具表面（34）。 聚合物前体（36）被分配到模腔（32）中并且抵靠模制表面（34）和背面（24）形成。 聚合物前体（36）然后被固化以形成封装集成电路管芯（12）的聚合密封剂（38）。

公开(公告)号：US5776798A

公开(公告)日：1998-07-07

申请号：US708296

申请日：1996-09-04

Applicant: Son Ky Quan ,  Samuel L. Coffman ,  Bruce Reid ,  Keith E. Nelson ,  Deborah A. Hagen

Inventor： Son Ky Quan ,  Samuel L. Coffman ,  Bruce Reid ,  Keith E. Nelson ,  Deborah A. Hagen

IPC: H01L23/28 ,  H01L21/301 ,  H01L21/56 ,  H01L23/24 ,  H01L23/31 ,  H01L21/44

CPC classification number: H01L23/24 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).

Abstract translation: 半导体封装基板（10）具有基本相同的封装位置阵列（13,14,16,21,22和23）。 封装位置（13,14,16,21,22和23）的整个阵列由密封剂（19）覆盖。 单个包装位置（13,14,16,21,22和23）通过锯切通过密封剂（19）和下面的半导体封装衬底（10）而被分割。