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公开(公告)号：US20070215612A1
公开(公告)日：2007-09-20
申请号：US11384672
申请日：2006-03-20
IPC分类号： H05B6/74
摘要： A microwave heating apparatus is designed to improve distribution of the microwaves introduced into a multi-mode microwave cavity for heating or other selected applications. The microwave heating apparatus includes a microwave signal generator and a waveguide to convey microwave power to the cavity. A perforated metal plate disposed within the cavity encloses a volume adjacent to the waveguide opening, forming a leaky multimode subcavity. Through multiple processes of reflection, transmission, diffraction, and scattering, the leaky subcavity serves to smooth the microwave power distribution in the near-field region adjacent to the waveguide to better disperse the energy throughout the main applicator cavity. A more uniform level of microwave power is thereby applied to the workpiece.
摘要翻译： 微波加热装置被设计成改善引入到用于加热或其它选择的应用的多模式微波空腔中的微波的分布。 微波加热装置包括微波信号发生器和将微波功率传送到空腔的波导。 设置在空腔内的穿孔金属板围绕与波导开口相邻的体积，形成泄漏的多模子腔。 通过反射，透射，衍射和散射的多个过程，泄漏子腔用于平滑与波导相邻的近场区域中的微波功率分布，以更好地将能量分散在整个主施加器腔体中。 因此，对工件施加更均匀的微波功率。
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2.发明授权公开(公告)号：US07901536B2
公开(公告)日：2011-03-08
申请号：US11807435
申请日：2007-05-29
CPC分类号： B29C65/1403 , B29C65/04 , B29C65/1406 , B29C65/1425 , B29C65/366 , B29C65/4835 , B29C65/4865 , B29C66/20 , B29C66/54 , B29C66/73112 , B29C66/73921 , B29C66/964 , B29K2995/0006 , B29L2031/30 , B29L2031/3061 , B29L2031/3425 , B29L2031/3475 , B29L2031/50 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/83234 , H01L2224/83855 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H05K3/3494 , H05K2201/0394 , H05K2203/102 , B29C65/00 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.
摘要翻译： 导电迹线和相同的图案用于通过电磁辐射将部件粘合在一起。 每个导电迹线被配置为当用诸如微波能量和/或RF能量的电磁辐射照射时谐振和加热，其具有约为导电迹线长度的2.3倍的波长。 导电迹线可以以图案布置，以在用电磁辐射照射时将基板或其他部件的目标区域均匀加热到所选择的温度。
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公开(公告)号：US20110226759A1
公开(公告)日：2011-09-22
申请号：US13065606
申请日：2011-03-25
IPC分类号： H05B6/68
CPC分类号： H05B6/80 , H01L21/324 , H01L21/67109 , H01L21/67115 , H01L21/67248 , H01L22/26 , H05B6/6411 , H05B6/645 , H05B6/806
摘要： An apparatus for heating a semiconductor wafer includes: a microwave source; an applicator cavity; and, a fixture for supporting a wafer in the cavity. The fixture comprises a dielectric mechanical support for the wafer and a grounded metallic ring movably positioned parallel to and concentric with the wafer at some distance from the wafer, to adjust the microwave power distribution to compensate for edge effects. A closed-loop feedback system adjusts the distance based on wafer edge and center temperatures. A method for heating a semiconductor wafer comprises: a. placing the wafer in a microwave cavity; b. supporting the wafer on a fixture comprising a dielectric wafer support and a grounded metallic ring movably positioned at some distance from the wafer; c. introducing microwave power into the cavity to heat the wafer; and d. adjusting the distance between wafer and ring to modify the power distribution near the wafer edge.
摘要翻译： 一种用于加热半导体晶片的装置包括：微波源; 一个涂抹腔; 以及用于在所述腔中支撑晶片的固定装置。 夹具包括用于晶片的介电机械支撑件和接地的金属环，其可移动地定位成平行于晶片与晶片一定距离并与其同心，以调整微波功率分布以补偿边缘效应。 闭环反馈系统根据晶圆边缘和中心温度调节距离。 一种用于加热半导体晶片的方法包括：a。 将晶片放置在微波腔中; b。 将晶片支撑在包括电介质晶片支撑件和可移动地定位在离晶片一定距离处的接地金属环的固定器上; C。 将微波功率引入腔体以加热晶片; 和d。 调整晶片和环之间的距离以修改晶片边缘附近的功率分布。
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4.发明授权公开(公告)号：US06758609B2
公开(公告)日：2004-07-06
申请号：US10167551
申请日：2002-06-11
IPC分类号： G02B6255
CPC分类号： G02B6/4239 , G02B6/255 , G02B6/2553 , G02B6/3803 , G02B6/4225 , G02B6/4226
摘要： In-situ and post-cure methods of joining optical fibers and optoelectronic components are provided. An in situ method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with non-ionizing radiation in RF/microwave energy to rapidly cure the resin. A post-cure method of joining an optical fiber to an optoelectronic component includes positioning an optical fiber and optoelectronic component in adjacent relationship such that light signals can pass therebetween, applying a curable resin having adhesive properties to an interface of the optical fiber and the optoelectronic component, aligning the optical fiber and optoelectronic component relative to each other such that the signal strength of light signals passing between the optical fiber and the optoelectronic component is substantially maximized, and irradiating the interface with microwave energy to partially cure the resin. The joined components are then transferred to a curing oven to fully cure the adhesive resin.
摘要翻译： 提供了连接光纤和光电子部件的原位和后固化方法。 将光纤接合到光电子部件的原位方法包括将光纤和光电子部件定位在相邻关系中，使得光信号可以在其间通过，将具有粘合性质的可固化树脂施加到光纤和光电子部件的界面 使光纤和光电子部件相对于彼此对准，使得在光纤和光电子部件之间通过的光信号的信号强度基本上最大化，并且以RF /微波能量以非电离辐射照射界面以快速固化 树脂。 将光纤接合到光电子部件的后固化方法包括将光纤和光电子部件定位在相邻关系中，使得光信号可以在其间通过，将具有粘合性质的可固化树脂施加到光纤和光电子器件的界面 使光纤和光电子部件相对于彼此对准，使得在光纤和光电子部件之间通过的光信号的信号强度基本上最大化，并且用微波能量照射界面以部分地固化树脂。 然后将接合的组分转移到固化炉中以使粘合剂树脂完全固化。
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公开(公告)号：US09048270B2
公开(公告)日：2015-06-02
申请号：US13065606
申请日：2011-03-25
CPC分类号： H05B6/80 , H01L21/324 , H01L21/67109 , H01L21/67115 , H01L21/67248 , H01L22/26 , H05B6/6411 , H05B6/645 , H05B6/806
摘要： An apparatus for heating a semiconductor wafer includes: a microwave source; an applicator cavity; and, a fixture for supporting a wafer in the cavity. The fixture contains a dielectric mechanical support for the wafer and a grounded metallic ring movably positioned parallel to and concentric with the wafer at some distance from the wafer, to adjust the microwave power distribution to compensate for edge effects. A closed-loop feedback system adjusts the distance based on wafer edge and center temperatures. A method for heating a semiconductor wafer includes: a. placing the wafer in a microwave cavity; b. supporting the wafer on a fixture having a dielectric wafer support and a grounded metallic ring movably positioned at some distance from the wafer; c. introducing microwave power into the cavity to heat the wafer; and d. adjusting the distance between wafer and ring to modify the power distribution near the wafer edge.
摘要翻译： 一种用于加热半导体晶片的装置包括：微波源; 一个涂抹腔; 以及用于在所述腔中支撑晶片的固定装置。 固定装置包含用于晶片的介电机械支撑件和接地的金属环，其可移动地定位成平行于与晶片相距一定距离的晶片并且与晶片同心，以调整微波功率分布以补偿边缘效应。 闭环反馈系统根据晶圆边缘和中心温度调节距离。 一种用于加热半导体晶片的方法包括：a。 将晶片放置在微波腔中; b。 将晶片支撑在具有电介质晶片支架和可移动地定位在离晶片一定距离处的接地金属环的固定装置上; C。 将微波功率引入腔体以加热晶片; 和d。 调整晶片和环之间的距离以修改晶片边缘附近的功率分布。
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6.发明申请公开(公告)号：US20070284034A1
公开(公告)日：2007-12-13
申请号：US11807435
申请日：2007-05-29
CPC分类号： B29C65/1403 , B29C65/04 , B29C65/1406 , B29C65/1425 , B29C65/366 , B29C65/4835 , B29C65/4865 , B29C66/20 , B29C66/54 , B29C66/73112 , B29C66/73921 , B29C66/964 , B29K2995/0006 , B29L2031/30 , B29L2031/3061 , B29L2031/3425 , B29L2031/3475 , B29L2031/50 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/83234 , H01L2224/83855 , H01L2224/8388 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/351 , H05K3/3494 , H05K2201/0394 , H05K2203/102 , B29C65/00 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： Conductive traces and patterns of same are used to bond components together via electromagnetic radiation. Each conductive trace is configured to resonate and heat up when irradiated with electromagnetic radiation, such as microwave energy and/or RF energy, having a wavelength that is about 2.3 times the length of the conductive trace. The conductive traces may be arranged in a pattern to uniformly heat a target area of a substrate or other component to a selected temperature when irradiated with electromagnetic radiation.
摘要翻译： 导电迹线和相同的图案用于通过电磁辐射将部件粘合在一起。 每个导电迹线被配置为当用诸如微波能量和/或RF能量的电磁辐射照射时谐振和加热，其具有约为导电迹线长度的2.3倍的波长。 导电迹线可以以图案布置，以在用电磁辐射照射时将基板或其他部件的目标区域均匀加热到所选择的温度。
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公开(公告)号：US09907976B2
公开(公告)日：2018-03-06
申请号：US14131564
申请日：2012-07-09
申请人： Frederic A. Bourke, Jr. , Harold Walder , Zakaryae Fathi , Michael J. Therien , Mark W. Dewhirst , Ian N. Stanton , Jennifer Ann Ayres , Diane Renee Fels , Joseph A. Herbert
发明人： Frederic A. Bourke, Jr. , Harold Walder , Zakaryae Fathi , Michael J. Therien , Mark W. Dewhirst , Ian N. Stanton , Jennifer Ann Ayres , Diane Renee Fels , Joseph A. Herbert
CPC分类号： A61N5/062 , A61K41/0085 , A61N5/0622 , A61N5/1077 , A61N2005/0661 , A61N2005/1091 , A61N2005/1098
摘要： A system and method for light stimulation within a medium. The system has a reduced-voltage x-ray source configured to generate x-rays from a peak applied cathode voltage at or below 105 kVp, and a plurality of energy-emitting particles in the medium which, upon radiation from the x-ray source, radiate at a first lower energy than the x-ray source to interact with at least one photoactivatable agent in the medium. The method introduces the plurality of energy-emitting particles into the medium, radiates the energy-emitting particles in the medium with x-rays generated from a peak applied cathode voltage at or below 105 kVp; and emits a lower energy than the x-ray source to interact with the medium or with at least one photoactivatable agent in the medium.
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公开(公告)号：US20110138617A1
公开(公告)日：2011-06-16
申请号：US12932087
申请日：2011-02-17
申请人： James E. Clayton , Zakaryae Fathi
发明人： James E. Clayton , Zakaryae Fathi
IPC分类号： H05K3/00
CPC分类号： H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
摘要： A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.
摘要翻译： 多芯片模块包括在其表面上具有导电图案的柔性电路，微电子器件连接到该表面上。 柔性电路由两个刚性框架封闭并支撑，其可以进一步设置有保护性散热盖。 刚性框架上的接触垫可以被配置为接合配合插座，或者它们可焊接到印刷电路板。
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公开(公告)号：US20110116244A1
公开(公告)日：2011-05-19
申请号：US12930971
申请日：2011-01-21
申请人： James E. Clayton , Zakaryae Fathi
发明人： James E. Clayton , Zakaryae Fathi
IPC分类号： H05K1/18
CPC分类号： H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
摘要： A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.
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公开(公告)号：US20090168362A1
公开(公告)日：2009-07-02
申请号：US12317890
申请日：2008-12-30
申请人： James E. Clayton , Zakaryae Fathi
发明人： James E. Clayton , Zakaryae Fathi
IPC分类号： H05K7/20
CPC分类号： H05K1/189 , H01L2224/16225 , H01L2224/73253 , H01L2924/07811 , H01L2924/15311 , H05K1/147 , H05K3/0061 , H05K2201/043 , H05K2201/056 , H05K2201/09109 , H05K2201/10159 , H05K2201/1056 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144 , Y10T29/49179 , H01L2924/00
摘要： A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.
摘要翻译： 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。
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