公开(公告)号：US20090095511A1

公开(公告)日：2009-04-16

申请号：US12173371

申请日：2008-07-15

申请人： Kenji IIDA ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Kenji IIDA ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K9/00 ,  H05K3/38 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/09809 ,  H05K2201/2072 ,  Y10T29/49155

摘要： The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member.

摘要翻译： 即使基部构件和电缆层的热膨胀系数明显不同，电路板也能够将基座构件上的电缆层紧密接合。 电路板包括：基座部件; 并且所述电缆层被层压在所述基底构件上，所述锚固图案是形成在所述基底构件的表面上的导电层。

公开(公告)号：US20090098391A1

公开(公告)日：2009-04-16

申请号：US12188759

申请日：2008-08-08

申请人： Takashi NAKAGAWA ,  Kenji IIDA ,  Yasutomo MAEHARA ,  Shin HIRANO ,  Tomoyuki ABE ,  Hideaki YOSHIMURA ,  Seigo YAMAWAKI ,  Norikazu OZAKI

发明人： Takashi NAKAGAWA ,  Kenji IIDA ,  Yasutomo MAEHARA ,  Shin HIRANO ,  Tomoyuki ABE ,  Hideaki YOSHIMURA ,  Seigo YAMAWAKI ,  Norikazu OZAKI

IPC分类号： B32B5/28 ,  B32B37/04

CPC分类号： H05K9/00 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/429 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0959 ,  H05K2201/09809

摘要： The core member constitutes a core substrate of a circuit board. The core member comprises: a carbon fiber-reinforced core section, in which prepregs including carbon fibers are thermocompression-bonded; and copper foils being respectively thermocompression-bonded on the both side faces of the carbon fiber-reinforced core section with prepregs including glass fibers. The pregregs including glass fibers are composed of resin, whose melting temperature range is higher than that of resin composing the pregregs including carbon fibers.

摘要翻译： 芯构件构成电路板的芯基板。 芯构件包括：碳纤维增强芯部，其中包括碳纤维的预浸料被热压粘合; 并且在包括玻璃纤维的预浸料坯的碳纤维增强芯部的两个侧面上分别热压粘合铜箔。 包括玻璃纤维的预浸料由树脂组成，其熔融温度范围高于构成包括碳纤维的预浸料的树脂。

公开(公告)号：US20090294161A1

公开(公告)日：2009-12-03

申请号：US12390010

申请日：2009-02-20

申请人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Tomoyuki ABE ,  Yasutomo MAEHARA ,  Takashi NAKAGAWA ,  Shin HIRANO

发明人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Tomoyuki ABE ,  Yasutomo MAEHARA ,  Takashi NAKAGAWA ,  Shin HIRANO

IPC分类号： H05K1/00 ,  B32B5/00

CPC分类号： H05K3/4641 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/09809 ,  Y10T428/24331

摘要： The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.

摘要翻译： 核心基材的芯层由浸渍有树脂的碳纤维制成。 当芯层的温度升高时，由于树脂的热膨胀，芯层的厚度增加。 芯层夹在包含玻璃纤维的绝缘层之间。 绝缘层用于抑制由芯层的热膨胀产生的芯层的厚度的增加。 核心基板中的热应力被抑制。

公开(公告)号：US20090294166A1

公开(公告)日：2009-12-03

申请号：US12390168

申请日：2009-02-20

申请人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Tomoyuki ABE ,  Yasutomo MAEHARA ,  Shin HIRANO

发明人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Tomoyuki ABE ,  Yasutomo MAEHARA ,  Shin HIRANO

IPC分类号： H05K1/11

CPC分类号： H05K3/445 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09809

摘要： Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.

摘要翻译： 在印刷电路板的芯层中形成大尺寸的通孔。 大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料填充大尺寸通孔的内部空间。 小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。 小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。 这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。

公开(公告)号：US20100018762A1

公开(公告)日：2010-01-28

申请号：US12502268

申请日：2009-07-14

申请人： Hideaki YOSHIMURA ,  Norikazu OZAKI ,  Kenji IIDA ,  Tomoyuki ABE

发明人： Hideaki YOSHIMURA ,  Norikazu OZAKI ,  Kenji IIDA ,  Tomoyuki ABE

IPC分类号： H05K1/11 ,  H05K3/36 ,  B23P23/00

CPC分类号： H05K1/036 ,  H05K1/0366 ,  H05K3/06 ,  H05K3/107 ,  H05K3/108 ,  H05K3/421 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/51

摘要： A printed circuit board includes a first insulation layer that is formed of a resin material into which fiber cloth is embedded. A second insulation layer is formed of a resin material, and is stacked on a front surface of the first insulation layer on which a heating process has been performed. A conductive land is formed on a front surface of the second insulation layer. A via is provided in a through hole penetrating through the first insulation layer and the second insulation layer. The through hole is filled with a conductive material, and the via is connected to the conductive land.

摘要翻译： 印刷电路板包括由嵌入有纤维布的树脂材料形成的第一绝缘层。 第二绝缘层由树脂材料形成，并且堆叠在已经进行了加热处理的第一绝缘层的前表面上。 导电焊盘形成在第二绝缘层的前表面上。 通孔设置在穿过第一绝缘层和第二绝缘层的通孔中。 通孔填充有导电材料，并且通孔连接到导电焊盘。

公开(公告)号：US20120024586A1

公开(公告)日：2012-02-02

申请号：US13097530

申请日：2011-04-29

申请人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Yasutomo MAEHARA

发明人： Hideaki YOSHIMURA ,  Kenji IIDA ,  Yasutomo MAEHARA

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K3/4602 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0187 ,  H05K2201/068 ,  Y10T29/49165

摘要： A printed wiring board including a substrate that includes wiring through-hole portions where wiring through-holes which each penetrate the substrate from a surface on a front side of the substrate to a surface on a back side of the substrate, the wiring through-hole portions being made using a dielectric material having a thermal expansion coefficient different from a thermal expansion coefficient of the substrate; and thermal-expansion adjusting portions produced by filling prepared-holes with the dielectric material, the prepared-holes being produced at a surface of the substrate. The surface is partitioned into predetermined blocks, in each of which the thermal-expansion adjusting portions are placed in a layout that minimizes a difference between a thermal expansion coefficient in the block in a length direction and a thermal expansion coefficient in the block in a width direction according to a placement of the wiring through-hole portions in the block.

摘要翻译： 一种印刷电路板，包括基板，该基板包括布线通孔部分，其中布线通孔各自从基板的前侧的表面穿过基板到基板的背面上的表面，布线通孔 使用具有与基板的热膨胀系数不同的热膨胀系数的介电材料制造部分; 以及通过用电介质材料填充准备孔而产生的热膨胀调节部分，所制备的孔在基板的表面处产生。 表面被划分成预定的块，其中每个热膨胀调节部分被放置成使得在长度方向上的块中的热膨胀系数与块中的热膨胀系数之间的差最小的布局 根据块中布线通孔部分的布置方向。

公开(公告)号：US20080268761A1

公开(公告)日：2008-10-30

申请号：US12108857

申请日：2008-04-24

申请人： Kenji IIDA ,  Wataru SAKUMA

发明人： Kenji IIDA ,  Wataru SAKUMA

IPC分类号： B60H1/00

CPC分类号： B60H1/00742 ,  B60H1/00778 ,  B60H1/008 ,  B60H1/00978

摘要： A condition monitoring apparatus determines whether an occupant is present in a passenger compartment based on a detection signal from a seat sensor, and detects the carbon dioxide concentration Cx in the passenger compartment based on a detection signal from a carbon dioxide sensor. When the ignition switch is OFF and an occupant is present in the passenger compartment, the condition monitoring apparatus determines whether the carbon dioxide concentration Cx is greater than a determination threshold value C1 for carbon dioxide concentration. The apparatus activates an alarm when the carbon dioxide concentration Cx is greater than the threshold value C1.

摘要翻译： 状态监视装置根据来自座椅传感器的检测信号，判定乘客的乘客是否存在，根据来自二氧化碳传感器的检测信号，检测乘客室内的二氧化碳浓度Cx。 当点火开关关闭并且乘员在乘客室中时，条件监测装置确定二氧化碳浓度Cx是否大于用于二氧化碳浓度的确定阈值C 1。 当二氧化碳浓度Cx大于阈值C 1时，该装置启动报警。

公开(公告)号：US20110301278A1

公开(公告)日：2011-12-08

申请号：US13151023

申请日：2011-06-01

申请人： Akira SANNOMIYA ,  Kenji IIDA ,  Noriyuki MEGURIYA ,  Atsuhito KASHIMA

发明人： Akira SANNOMIYA ,  Kenji IIDA ,  Noriyuki MEGURIYA ,  Atsuhito KASHIMA

IPC分类号： C08L47/00 ,  C08L83/05

CPC分类号： C08L23/16 ,  C08G77/12 ,  C08K3/08 ,  C08K3/36 ,  C08L83/04 ,  C08L2312/00

摘要： A crosslinkable rubber composition includes, as essential components: (A) an ethylene-α-olefin-nonconjugated polyene random copolymer rubber in which the nonconjugated polyene has a terminal vinyl group-containing norbornene compound represented by the following general formula (1) or (II), wherein n is an integer of 0 to 10, R1 is H or an alkyl group, and R2 is H or an alkyl group, wherein R3 is H or an alkyl group, and which has a viscosity of not less than 10 Pa·s and less than 1,000 Pa·s at 25° C. under a shear rate of 10 s−1; (B) an organopolysiloxane which has three repeating units of siloxane represented by the following formula and which has three Si-bonded hydrogen atoms per molecule, wherein R4 is a monovalent hydrocarbon group; (C) a reinforcing filler; (D) a curing catalyst; and (E) a curing reaction retarder.

摘要翻译： 作为必要成分，可交联橡胶组合物含有：（A）乙烯-α-烯烃 - 非共轭多烯无规共聚物橡胶，其中非共轭多烯具有由以下通式（1）表示的含末端乙烯基的降冰片烯化合物或（ II），其中n为0〜10的整数，R1为H或烷基，R2为H或烷基，其中R3为H或烷基，粘度为10Pa以上 ·在10s -1的剪切速率下在25℃下小于1,000Pa·s; （B）有机聚硅氧烷，其具有三个由下式表示的硅氧烷重复单元，每分子具有三个Si键合的氢原子，其中R4是一价烃基; （C）增强填料; （D）固化催化剂; 和（E）固化反应缓凝剂。