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公开(公告)号：US08153908B2
公开(公告)日：2012-04-10
申请号：US12173371
申请日：2008-07-15
申请人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
CPC分类号： H05K9/00 , H05K3/38 , H05K3/429 , H05K3/4608 , H05K3/4611 , H05K3/4691 , H05K2201/0281 , H05K2201/0323 , H05K2201/09581 , H05K2201/0959 , H05K2201/09781 , H05K2201/09809 , H05K2201/2072 , Y10T29/49155
摘要： The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member.
摘要翻译： 即使基部构件和电缆层的热膨胀系数明显不同，电路板也能够将基座构件上的电缆层紧密接合。 电路板包括：基座部件; 并且电缆层被层压在具有锚定图案的基底构件上，锚定图案是形成在基底构件的表面上的导电层。
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公开(公告)号：US20090095511A1
公开(公告)日：2009-04-16
申请号：US12173371
申请日：2008-07-15
申请人： Kenji IIDA , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Kenji IIDA , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
CPC分类号： H05K9/00 , H05K3/38 , H05K3/429 , H05K3/4608 , H05K3/4611 , H05K3/4691 , H05K2201/0281 , H05K2201/0323 , H05K2201/09581 , H05K2201/0959 , H05K2201/09781 , H05K2201/09809 , H05K2201/2072 , Y10T29/49155
摘要： The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member.
摘要翻译： 即使基部构件和电缆层的热膨胀系数明显不同，电路板也能够将基座构件上的电缆层紧密接合。 电路板包括：基座部件; 并且所述电缆层被层压在所述基底构件上，所述锚固图案是形成在所述基底构件的表面上的导电层。
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公开(公告)号：US20090094825A1
公开(公告)日：2009-04-16
申请号：US12175732
申请日：2008-07-18
申请人： Yasutomo MAEHARA , Kenji Iida , Tomoyuki Abe , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Yasutomo MAEHARA , Kenji Iida , Tomoyuki Abe , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
IPC分类号： H05K3/02
CPC分类号： H05K3/427 , H05K1/115 , H05K1/116 , H05K3/0094 , H05K3/061 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4691 , H05K2201/0347 , H05K2201/09581 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , H05K2203/135 , H05K2203/1476 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step.
摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 电镀所述基底构件以便用镀层涂覆所述通孔的内表面; 在基底上施加光刻胶; 对光致抗蚀剂进行光学曝光和显影，以形成至少覆盖通孔的平面区域的抗蚀剂图案; 以及蚀刻形成在所述基底构件的表面上的导电层。 形成抗蚀剂图形，以将导电层暴露出距通孔边缘规定距离的区域，并且规定的长度比蚀刻导电层的侧面的距离长 步。
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公开(公告)号：US08151456B2
公开(公告)日：2012-04-10
申请号：US12175732
申请日：2008-07-18
申请人： Yasutomo Maehara , Kenji Iida , Tomoyuki Abe , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Yasutomo Maehara , Kenji Iida , Tomoyuki Abe , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
CPC分类号： H05K3/427 , H05K1/115 , H05K1/116 , H05K3/0094 , H05K3/061 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K3/4691 , H05K2201/0347 , H05K2201/09581 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , H05K2203/135 , H05K2203/1476 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step.
摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 电镀所述基底构件以便用镀层涂覆所述通孔的内表面; 在基底上施加光刻胶; 对光致抗蚀剂进行光学曝光和显影，以形成至少覆盖通孔的平面区域的抗蚀剂图案; 以及蚀刻形成在所述基底构件的表面上的导电层。 形成抗蚀剂图形，以将导电层暴露出距通孔边缘规定距离的区域，并且规定的长度比蚀刻导电层的侧面的距离长 步。
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公开(公告)号：US08035037B2
公开(公告)日：2011-10-11
申请号：US12170963
申请日：2008-07-10
申请人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
IPC分类号： H05K1/11
CPC分类号： H05K3/4608 , H05K1/056 , H05K3/427 , H05K3/429 , H05K3/4611 , H05K3/4691 , H05K2201/0281 , H05K2201/0323 , H05K2201/09309 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , Y10S428/901 , Y10T29/49155
摘要： The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section.
摘要翻译： 芯基板能够可靠地防止导电芯部与电镀通孔部之间的短路。 芯基板包括：具有引导孔的导电芯部分，形成电镀通孔部分; 涂覆导向孔的内表面和芯部表面的导电层; 形成在所述芯部的表面上的导电层中形成的气体净化孔; 绝缘材料，其填充所述导向孔的内表面与所述电镀通孔部的外周面之间的空间; 并且层叠在芯部的两个侧面上的电缆层。
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公开(公告)号：US20090095524A1
公开(公告)日：2009-04-16
申请号：US12170963
申请日：2008-07-10
申请人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
CPC分类号： H05K3/4608 , H05K1/056 , H05K3/427 , H05K3/429 , H05K3/4611 , H05K3/4691 , H05K2201/0281 , H05K2201/0323 , H05K2201/09309 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , Y10S428/901 , Y10T29/49155
摘要： The core substrate is capable of securely preventing short circuit between an electrically conductive core section and a plated through-hole section. The core substrate comprises: an electrically conductive core section having a pilot hole, through which a plated through-hole section is formed; electrically conductive layers coating the inner face of the pilot hole and a surface of the core section; a gas purging hole being formed in the conductive layer coating the surface of the core section; an insulating material filling a space between the inner face of the pilot hole and an outer circumferential face of the plated through-hole section; and cable layers being laminated on both side faces of the core section.
摘要翻译： 芯基板能够可靠地防止导电芯部与电镀通孔部之间的短路。 芯基板包括：具有引导孔的导电芯部分，形成电镀通孔部分; 涂覆导向孔的内表面和芯部表面的导电层; 形成在所述芯部的表面上的导电层中形成的气体净化孔; 绝缘材料，其填充所述导向孔的内表面与所述电镀通孔部的外周面之间的空间; 并且层叠在芯部的两个侧面上的电缆层。
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公开(公告)号：US08186052B2
公开(公告)日：2012-05-29
申请号：US12173562
申请日：2008-07-15
申请人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
CPC分类号： H05K3/427 , H05K3/064 , H05K3/429 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/0347 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.
摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 用绝缘材料填充通孔; 进行化学镀以用绝缘材料涂覆通孔填充有绝缘材料的基底构件的表面; 在形成在基体表面上的化学镀层上施加光刻胶; 光刻曝光和显影光致抗蚀剂，以形成涂覆填充有绝缘材料的通孔的端面的抗蚀剂图案; 使用抗蚀剂图案作为掩模蚀刻形成在基底构件的表面上的导电层; 并且通过使用化学镀层作为剥离层，从基体上除去涂覆通孔的端面的抗蚀剂图案。
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公开(公告)号：US20090095509A1
公开(公告)日：2009-04-16
申请号：US12188736
申请日：2008-08-08
申请人： Shin Hirano , Kenji Iida , Yasutomo Maehara , Tomoyuki Abe , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Shin Hirano , Kenji Iida , Yasutomo Maehara , Tomoyuki Abe , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
CPC分类号： H05K9/00 , H05K1/115 , H05K3/429 , H05K3/4608 , H05K3/4611 , H05K3/4691 , H05K2201/0281 , H05K2201/0323 , H05K2201/09581 , H05K2201/0959 , H05K2201/09809 , Y10T29/49155
摘要： In the core substrate, short circuit between an electrically conductive core section and a plated through-hole section can be securely prevented and cables can be formed in a high dense state. The core substrate comprises: the electrically conductive core section having a pilot hole, through which the plated through-hole section is formed; cable layers being respectively laminated on the both side faces of the core section; a plated layer coating an inner face of the pilot hole; and an insulating material filling a space between the plated layer and an outer circumferential face of the plated through-hole section.
摘要翻译： 在芯基板中，可以可靠地防止导电芯部与电镀通孔部之间的短路，并且可以以高致密状态形成电缆。 芯基板包括：导电芯部分具有导孔，电镀通孔部分穿过该引导孔; 电缆层分别层叠在芯部的两个侧面上; 涂覆导向孔的内表面的镀层; 以及填充所述镀层与所述电镀通孔部的外周面之间的空间的绝缘材料。
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公开(公告)号：US20090094824A1
公开(公告)日：2009-04-16
申请号：US12173562
申请日：2008-07-15
申请人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
发明人： Kenji Iida , Tomoyuki Abe , Yasutomo Maehara , Shin Hirano , Takashi Nakagawa , Hideaki Yoshimura , Seigo Yamawaki , Norikazu Ozaki
IPC分类号： H05K3/10
CPC分类号： H05K3/427 , H05K3/064 , H05K3/429 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/0347 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; filling the through-hole with an insulating material; performing electroless plating to coat the surface of the base member, in which the through-hole has been filled with the insulating material, with an electroless-plated layer; applying photo resist on the electroless-plated layer formed on the surface of the base member; optically exposing and developing the photo resist so as to form a resist pattern coating an end face of the through-hole filled with the insulating material; etching an electrically conductive layer formed on the surface of the base member with using the resist pattern as a mask; and removing the resist pattern coating the end face of the through-hole from the base member with using the electroless-plated layer as a release layer.
摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 用绝缘材料填充通孔; 进行化学镀以用绝缘材料涂覆通孔填充有绝缘材料的基底构件的表面; 在形成在基体表面上的化学镀层上施加光刻胶; 光刻曝光和显影光致抗蚀剂，以形成涂覆填充有绝缘材料的通孔的端面的抗蚀剂图案; 使用抗蚀剂图案作为掩模蚀刻形成在基底构件的表面上的导电层; 并且通过使用化学镀层作为剥离层，从基体上除去涂覆通孔的端面的抗蚀剂图案。
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公开(公告)号：US20100018758A1
公开(公告)日：2010-01-28
申请号：US12486996
申请日：2009-06-18
申请人： Hideaki Yoshimura , Norikazu Ozaki , Kenji Iida , Tomoyuki Abe
发明人： Hideaki Yoshimura , Norikazu Ozaki , Kenji Iida , Tomoyuki Abe
IPC分类号： H05K1/03
CPC分类号： H05K3/4673 , H05K1/0366 , H05K3/426 , H05K3/4608 , H05K3/4614 , H05K2201/0195 , H05K2201/0323 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09809 , H05K2201/10378 , H05K2203/061
摘要： A printed wiring board which includes a core substrate and a plurality of buildup layer. The core substrate contains carbon fiber. The plurality of buildup layers is stacked on the core substrate. The buildup layer includes an insulating layer and a conductive wiring layer. The insulating layer contains a resin material having a glass fiber cloth embedded therein.
摘要翻译： 一种印刷电路板，包括芯基板和多个堆积层。 核心基材含有碳纤维。 多个堆积层堆叠在芯基板上。 积层层包括绝缘层和导电布线层。 绝缘层包含嵌入其中的玻璃纤维布的树脂材料。
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