公开(公告)号：US06342547B1

公开(公告)日：2002-01-29

申请号：US09497215

申请日：2000-02-03

申请人： Kenji Mimura ,  Hiromi Ito ,  Hiroyuki Nishimura ,  Kazuharu Kato ,  Hirofumi Fujioka ,  Yukio Ozaki ,  Hiroyuki Hama

发明人： Kenji Mimura ,  Hiromi Ito ,  Hiroyuki Nishimura ,  Kazuharu Kato ,  Hirofumi Fujioka ,  Yukio Ozaki ,  Hiroyuki Hama

IPC分类号： C08K334

CPC分类号： H01B3/40

摘要： There is provided an epoxy resin composition, which has superior resistant property to SF6 gas, mechanical strength and cracking resistance in a well balanced manner and which can provide an insulating molded article having a low dielectric constant. The epoxy resin composition for an SF6-gas insulating device of the present invention is obtained by adding a silicate compound powder to an epoxy resin.

摘要翻译： 提供一种环氧树脂组合物，其以良好平衡的方式具有优良的耐SF6气体的耐受性，机械强度和抗裂性，并且可以提供具有低介电常数的绝缘模制品。 本发明的SF6气体绝缘装置用环氧树脂组合物是通过向环氧树脂中添加硅酸盐化合物粉末而得到的。

公开(公告)号：US5723813A

公开(公告)日：1998-03-03

申请号：US663733

申请日：1996-06-14

申请人： Hiromi Ito ,  Kenji Mimura ,  Hirofumi Fujioka ,  Etsuro Tomonaga ,  Hiroshi Aoki ,  Hiroyuki Hama

发明人： Hiromi Ito ,  Kenji Mimura ,  Hirofumi Fujioka ,  Etsuro Tomonaga ,  Hiroshi Aoki ,  Hiroyuki Hama

IPC分类号： H02G5/06 ,  H01B7/00

CPC分类号： H02G5/068 ,  Y10T29/49227

摘要： The present invention provides an insulating spacer for a high-voltage conductor constructed with a plastic made of an epoxy resin composition so that the volumetric specific resistance of the shield electrode increases toward the median point between a container and the conductor and a method for manufacturing shield electrode used therein. The insulating spacer according to the present invention can lessen the concentration of electric fields in the boundary areas between the shield electrode and the insulating member with the result that reliability is improved and service life is lengthened.

摘要翻译： 本发明提供一种用由环氧树脂组合物制成的塑料构成的高压导体的绝缘间隔件，使得屏蔽电极的体积电阻率朝向容器和导体之间的中点增加，并且制造屏蔽的方法 电极。 根据本发明的绝缘间隔物可以减小屏蔽电极和绝缘构件之间的边界区域中的电场浓度，从而提高可靠性并延长使用寿命。

公开(公告)号：US08007897B2

公开(公告)日：2011-08-30

申请号：US12834073

申请日：2010-07-12

申请人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

发明人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

IPC分类号： B32B5/16 ,  H05K7/20

CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T156/10 ,  Y10T428/24372 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/049 ,  H01L2924/045 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.

摘要翻译： 绝缘片包括热固性树脂的粘合剂组分并且包含填充构件。 绝缘片的粘合面区域的导热率小于绝缘片的内部区域的导热率。

公开(公告)号：US20100277872A1

公开(公告)日：2010-11-04

申请号：US12834073

申请日：2010-07-12

申请人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

发明人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

IPC分类号： H05K7/20 ,  B32B37/02 ,  B32B27/04

CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T156/10 ,  Y10T428/24372 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/049 ,  H01L2924/045 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating sheet includes an adhesive component of a thermosetting resin and containing a filler member. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region of the insulating sheet.

摘要翻译： 绝缘片包括热固性树脂的粘合剂组分并且包含填充构件。 绝缘片的粘合面区域的导热率小于绝缘片的内部区域的导热率。

公开(公告)号：US20060165978A1

公开(公告)日：2006-07-27

申请号：US11340867

申请日：2006-01-27

申请人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

发明人： Hiromi Ito ,  Naoshi Yamada ,  Kei Yamamoto ,  Hirofumi Fujioka ,  Takumi Kikuchi ,  Osamu Yashiro

IPC分类号： B31B1/60 ,  D04H13/00

CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T156/10 ,  Y10T428/24372 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/049 ,  H01L2924/045 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating sheet includes an adhesive component of essentially a thermosetting resin and a filler member infiltrated into the component. Heat conductivity of an adhesive face region of the insulating sheet is smaller than heat conductivity of an inner region, other than the adhesive face region of the insulating sheet.

摘要翻译： 绝缘片包括基本上是热固性树脂的粘合剂组分和渗透到组分中的填料构件。 除了绝缘片的粘合面区域之外，绝缘片的粘合面区域的导热率小于内部区域的导热率。

公开(公告)号：US5939472A

公开(公告)日：1999-08-17

申请号：US841312

申请日：1997-04-30

申请人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

发明人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

IPC分类号： B29C39/10 ,  B29K63/00 ,  B29L31/34 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/30 ,  C08G59/40 ,  C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/56 ,  C08L63/00 ,  H01B3/40 ,  C08L63/02

CPC分类号： H01B3/40 ,  C08G59/226 ,  C08G59/245 ,  C08G59/26 ,  C08G59/30 ,  C08G59/42 ,  C08L63/00

摘要： Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

摘要翻译： 环氧树脂（A），酸酐（B），固化促进剂（C），偶联剂（D）和填料（E））的模塑用环氧树脂组合物，用于制备由环氧树脂 用于模塑的树脂组合物和通过制备模制产品的方法制备的模塑产品。 环氧树脂组合物具有机械强度高，韧性高，耐热性优异的机械性能优异，制备成型体的方法可以提供由环氧树脂组合物制成的模制品，并且生产的模制产品具有优异的抗裂性和高 可靠性。

公开(公告)号：US5880179A

公开(公告)日：1999-03-09

申请号：US774068

申请日：1996-12-23

申请人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

发明人： Hiromi Ito ,  Takumi Kikuchi ,  Hirofumi Fujioka ,  Hirozoh Kanegae ,  Yoshifumi Itabashi ,  Fumio Nogami

IPC分类号： B29C39/10 ,  B29K63/00 ,  B29L31/34 ,  C08G59/20 ,  C08G59/22 ,  C08G59/24 ,  C08G59/26 ,  C08G59/30 ,  C08G59/40 ,  C08G59/42 ,  C08K3/22 ,  C08K3/36 ,  C08K5/5415 ,  C08K5/56 ,  C08L63/00 ,  H01B3/40 ,  C08L63/02 ,  H01F27/30 ,  H02K1/04

CPC分类号： H01B3/40 ,  C08G59/226 ,  C08G59/245 ,  C08G59/26 ,  C08G59/30 ,  C08G59/42 ,  C08L63/00

摘要： "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.5; the amount of the curing accelerator (C) is 0.5 to 10 parts by weight based on 100 parts by weight of the epoxy resin (A); the amount of the coupling agent (D) is 0.05 to 5 parts by weight based on 100 parts by weight of the filler (E); and the content of the filler (E) is 35 to 95% by weight of the resin composition. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and toughness, and excellent thermal resistance.

摘要翻译： “包含环氧树脂（A），酸酐（B），固化促进剂（C），至少一种偶联剂（D）和填料（E））的成型用环氧树脂组合物的高压设备用成型体 ）。 环氧树脂（A）是双官能溴化双酚A或溴化双酚F“环氧树脂和至少一种双酚A，双酚F或双酚环氧树脂”。 偶联剂（D）选自环氧硅烷型偶联剂，苯基氨基硅烷型偶联剂，巯基硅烷型偶联剂和钛酸酯型偶联剂，其平均粒径不大于60μm，其中 直径不大于5μm的颗粒的含量不小于5重量％。 填料（E）包括二氧化硅填料或氧化铝填料中的至少一种。 酸酐（B）的酸酐基与环氧树脂（A）的环氧基数的比例为0.5〜1.5; 相对于100重量份的环氧树脂（A），固化促进剂（C）的使用量为0.5〜10重量份。 相对于100重量份的填料（E），偶联剂（D）的量为0.05〜5重量份。 填料（E）的含量为树脂组合物的35〜95重量％。 环氧树脂组合物具有优异的机械强度和韧性等机械性能，耐热性优异。

公开(公告)号：US08193633B2

公开(公告)日：2012-06-05

申请号：US12675549

申请日：2008-09-12

申请人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

发明人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

IPC分类号： H01L23/34 ,  H01L23/10

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

摘要翻译： 提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有 大于20体积％的二次聚集粒子各自具有50μm以上的粒径。 导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

公开(公告)号：US20100226095A1

公开(公告)日：2010-09-09

申请号：US12675549

申请日：2008-09-12

申请人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

发明人： Kenji Mimura ,  Hideki Takigawa ,  Hiroki Shiota ,  Kazuhiro Tada ,  Takashi Nishimura ,  Hiromi Ito ,  Seiki Hiramatsu ,  Atsuko Fujino ,  Kei Yamamoto ,  Motoki Masaki

IPC分类号： H05K7/20 ,  F28F7/00 ,  B21D53/02

CPC分类号： H01L23/3737 ,  F28F2013/006 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/181 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.

摘要翻译： 提供了一种通过将无机填料分散在热固性树脂中而获得的导热片，其中无机填料含有通过各向同性地聚集平均长度为15μm以下的鳞片状氮化硼一次粒子形成的二次凝集粒子，无机填料含有 大于20体积％的二次聚集粒子各自具有50μm以上的粒径。 导热片在生产率和成本方面是有利的，并且导热性和电绝缘性能优异。

公开(公告)号：US20060188727A1

公开(公告)日：2006-08-24

申请号：US11408025

申请日：2006-04-21

申请人： Hiromi Ito ,  Osamu Yashiro

发明人： Hiromi Ito ,  Osamu Yashiro

IPC分类号： B32B27/38 ,  C08L63/00 ,  B32B37/00

CPC分类号： H01L23/3733 ,  C08K7/00 ,  C08K2201/014 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48137 ,  H01L2224/48237 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/181 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A thermally conductive resin sheet includes a thermosetting resin, and a thermally conductive and electrically insulating inorganic filler. The inorganic filler is a mixture of a flat inorganic filler and a granular inorganic filler. The ratio of the volume content, VL, of the flat inorganic filler to volume content, VR, of the granular inorganic filler in the mixture is from 30/70 to 80/20, in terms of VL/VR.

摘要翻译： 导热树脂片包括热固性树脂和导热和电绝缘的无机填料。 无机填料是扁平无机填料和粒状无机填料的混合物。 平均无机填料的体积含量V L L与混合物中颗粒状无机填料的体积含量V R R的比例为30/70至 80/20，就V L / V R R而言。