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公开(公告)号:US06807213B1
公开(公告)日:2004-10-19
申请号:US09511188
申请日:2000-02-23
IPC分类号: H01S500
CPC分类号: H01S5/2231 , H01L33/02 , H01L33/24 , H01S5/1014 , H01S5/1064 , H01S5/50 , H01S2301/18
摘要: This application discloses a semiconductor optical device apparatus having on a substrate, at least, a compound semiconductor layer containing an active layer, a protection film having a stripe-shaped opening formed on the compound semiconductor layer, and a ridge type compound semiconductor layer formed as to cover the stripe-shaped opening having a smaller refractive index than the refractive index of the active layer, has a feature that a width (WC) at an opening center of the stripe-shaped opening is different from either or both of a width (WF) of the opening front end and a width (WR) of the opening rear end. According to the invention, a semiconductor optical device apparatus capable of operating with a high output, and a semiconductor optical device apparatus having a small beam spot diameter, and the like can be manufactured where the width of the stripe-shaped opening is properly controlled.
摘要翻译: 本申请公开了一种半导体光学器件装置,在至少具有含有活性层的化合物半导体层,在化合物半导体层上形成有条状开口的保护膜,以及形成为 为了覆盖具有比有源层的折射率小的折射率的条形开口,具有条形开口的开口中心处的宽度(WC)不同于宽度( WF)和开口后端的宽度(WR)。 根据本发明,可以制造能够适当地控制条形开口的宽度的能够以高输出操作的半导体光学装置装置和具有小的光斑直径的半导体光学装置装置等。
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2.
公开(公告)号:US06387721B1
公开(公告)日:2002-05-14
申请号:US09404376
申请日:1999-09-24
申请人: Makiko Hashimoto , Nobuyuki Hosoi , Kenji Shimoyama , Katsushi Fujii , Yoshihito Sato , Kazumasa Kiyomi
发明人: Makiko Hashimoto , Nobuyuki Hosoi , Kenji Shimoyama , Katsushi Fujii , Yoshihito Sato , Kazumasa Kiyomi
IPC分类号: H01L2100
CPC分类号: H01S5/2231 , H01S5/0202 , H01S5/0658 , H01S5/2272 , H01S5/3213
摘要: In a semiconductor light-emitting device including a substrate, a first compound semiconductor layer including an active layer formed on the substrate, a second compound semiconductor layer of a ridge type formed on the first compound semiconductor layer, and a protective film formed above the first compound semiconductor layer on both sides of the second compound semiconductor layer, the disclosed semiconductor light-emitting device has a current blocking layer formed above the first compound semiconductor layer outside the protective film. This semiconductor light-emitting device is with a high production yield since readily cleaved and assembled, with adequately squeezed currents, and with, when assembled in the junction-down type, a high output and a longer life span.
摘要翻译: 在包括衬底的半导体发光器件中,包括形成在衬底上的有源层的第一化合物半导体层,形成在第一化合物半导体层上的脊状的第二化合物半导体层和形成在第一化合物半导体层上的保护膜 化合物半导体层在第二化合物半导体层的两侧,所公开的半导体发光器件具有形成在保护膜外部的第一化合物半导体层上方的电流阻挡层。 这种半导体发光器件由于容易地被切割和组装而具有高的产量,具有适当的挤压电流,并且当在结合型组装时具有高输出和更长的寿命。
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公开(公告)号:US06707071B2
公开(公告)日:2004-03-16
申请号:US10096508
申请日:2002-03-13
申请人: Makiko Hashimoto , Nobuyuki Hosoi , Kenji Shimoyama , Katsushi Fujii , Yoshihito Sato , Kazumasa Kiyomi
发明人: Makiko Hashimoto , Nobuyuki Hosoi , Kenji Shimoyama , Katsushi Fujii , Yoshihito Sato , Kazumasa Kiyomi
IPC分类号: H01L3300
CPC分类号: H01S5/2231 , H01S5/0202 , H01S5/0658 , H01S5/2272 , H01S5/3213
摘要: In a semiconductor light-emitting device including a substrate, a first compound semiconductor layer including an active layer formed on the substrate, a second compound semiconductor layer of a ridge type formed on the first compound semiconductor layer, and a protective film formed above the first compound semiconductor layer on both sides of the second compound semiconductor layer, the disclosed semiconductor light-emitting device has a current blocking layer formed above the first compound semiconductor layer outside the protective film. This semiconductor light-emitting device is with a high production yield since readily cleaved and assembled, with adequately squeezed currents, and with, when assembled in the junction-down type, a high output and a longer life span.
摘要翻译: 在包括衬底的半导体发光器件中,包括形成在衬底上的有源层的第一化合物半导体层,形成在第一化合物半导体层上的脊状的第二化合物半导体层和形成在第一化合物半导体层上的保护膜 化合物半导体层在第二化合物半导体层的两侧,所公开的半导体发光器件具有形成在保护膜外部的第一化合物半导体层上方的电流阻挡层。 这种半导体发光器件由于容易地被切割和组装而具有高的产量,具有适当的挤压电流,并且当在结合型组装时具有高输出和更长的寿命。
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公开(公告)号:US5811839A
公开(公告)日:1998-09-22
申请号:US521980
申请日:1995-08-31
申请人: Kenji Shimoyama , Nobuyuki Hosoi , Katsushi Fujii , Atsunori Yamauchi , Hideki Gotoh , Yoshihito Sato
发明人: Kenji Shimoyama , Nobuyuki Hosoi , Katsushi Fujii , Atsunori Yamauchi , Hideki Gotoh , Yoshihito Sato
CPC分类号: H01L33/30 , H01S5/32325 , H01S5/3211
摘要: The present invention provides a semiconductor light-emitting device including a first clad layer comprising a first conductive type of AlGaAsP compound, a second clad layer that is located next to the first clad layer, comprises a first conductive type of AlGaInP compound and has a thickness of up to 0.5 .mu.m, an active layer that is located next to the second clad layer and comprises a first or second conductive type AlGaInP or GaInP, a third clad layer that is located next to the active layer, comprises a second conductive type of AlGaInP compound and has a thickness of up to 0.5 .mu.m, and a fourth clad layer that is located next to the third clad layer and comprises a second conductive type of AlGaAsP compound, and/or a light-extracting layer that comprises a second conductive type AlGaP or GaP and has a thickness of 1 .mu.m to 100 .mu.m.
摘要翻译: 本发明提供一种半导体发光器件,包括:第一覆盖层,包括第一导电类型的AlGaAsP化合物,位于第一覆盖层旁边的第二覆盖层,包括第一导电型AlGaInP化合物, 高达0.5μm的有源层,位于第二覆层旁边并且包括第一或第二导电型AlGaInP或GaInP,位于有源层旁边的第三覆盖层包括第二导电类型 AlGaInP化合物,并且具有至多0.5μm的厚度,以及位于第三覆盖层旁边并包括第二导电型AlGaAsP化合物的第四覆盖层和/或包含第二导电类型的光提取层 型AlGaP或GaP,并且具有1μm至100μm的厚度。
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公开(公告)号:US06278137B1
公开(公告)日:2001-08-21
申请号:US09035333
申请日:1998-03-05
申请人: Kenji Shimoyama , Nobuyuki Hosoi , Katsushi Fujii , Atsunori Yamauchi , Hideki Gotoh , Yoshihito Sato
发明人: Kenji Shimoyama , Nobuyuki Hosoi , Katsushi Fujii , Atsunori Yamauchi , Hideki Gotoh , Yoshihito Sato
IPC分类号: H01L3300
CPC分类号: H01L33/30 , H01S5/3211 , H01S5/32325
摘要: The present invention provides a semiconductor light-emitting device including a first clad layer comprising a first conductive type of AlGaAsP compound, a second clad layer that is located next to the first clad layer, comprises a first conductive type of AlGaInP compound and has a thickness of up to 0.5 &mgr;m, an active layer that is located next to the second clad layer and comprises a first or second conductive type AlGaInP or GaInP, a third clad layer that is located next to the active layer, comprises a second conductive type of AlGaInP compound and has a thickness of up to 0.5 &mgr;m, and a fourth clad layer that is located next to the third clad layer and comprises a second conductive type of AlGaAsP compound, and/or a light-extracting layer that comprises a second conductive type AlGaP or GaP and has a thickness of 1 &mgr;m to 100 &mgr;m.
摘要翻译: 本发明提供一种半导体发光器件,包括:第一覆盖层,包括第一导电类型的AlGaAsP化合物,位于第一覆盖层旁边的第二覆盖层,包括第一导电型AlGaInP化合物, 高达0.5μm的有源层,位于第二覆盖层的旁边并且包括第一或第二导电型AlGaInP或GaInP,位于有源层旁边的第三覆盖层包括第二导电类型的AlGaInP 并且具有高达0.5μm的厚度,以及位于第三覆盖层旁边并且包括第二导电型AlGaAsP化合物的第四覆盖层和/或包含第二导电型AlGaP的光提取层 或GaP,并且具有1μm至100μm的厚度。
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公开(公告)号:US20120112320A1
公开(公告)日:2012-05-10
申请号:US13309138
申请日:2011-12-01
申请人: Shuichi KUBO , Kenji Shimoyama , Kazumasa Kiyomi , Kenji Fujito , Yutaka Mikawa
发明人: Shuichi KUBO , Kenji Shimoyama , Kazumasa Kiyomi , Kenji Fujito , Yutaka Mikawa
CPC分类号: C30B25/20 , C23C16/303 , C30B25/18 , C30B29/403 , H01L21/0237 , H01L21/02433 , H01L21/0254 , H01L21/02609
摘要: A production process for a nitride semiconductor crystal, comprising growing a semiconductor layer on a seed substrate to obtain a nitride semiconductor crystal, wherein the seed substrate comprises a plurality of seed substrates made of the same material, at least one of the plurality of seed substrates differs in the off-angle from the other seed substrates, and a single semiconductor layer is grown by disposing the plurality of seed substrates in a semiconductor crystal production apparatus, such that when the single semiconductor layer is grown on the plurality of seed substrates, the off-angle distribution in the single semiconductor layer becomes smaller than the off-angle distribution in the plurality of seed substrates.
摘要翻译: 一种氮化物半导体晶体的生产方法,包括在籽晶基底上生长半导体层以获得氮化物半导体晶体,其中种子基底包括由相同材料制成的多个晶种基底,多个晶种基底中的至少一个 与其他种子基板的偏角不同,并且通过将多个种子基板设置在半导体晶体制造装置中而生长单个半导体层,使得当在多个种子基板上生长单个半导体层时, 单个半导体层中的偏角分布变得小于多个种子基板中的偏角分布。
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公开(公告)号:US06744066B2
公开(公告)日:2004-06-01
申请号:US09785428
申请日:2001-02-20
申请人: Kenji Shimoyama , Kazumasa Kiyomi , Hideki Gotoh , Satoru Nagao
发明人: Kenji Shimoyama , Kazumasa Kiyomi , Hideki Gotoh , Satoru Nagao
IPC分类号: H01L2906
CPC分类号: H01S5/341 , B82Y20/00 , H01L33/06 , H01L33/24 , H01S5/2275 , H01S2304/04
摘要: The semiconductor device according to the present invention comprises a V-groove having V-shaped cross-section formed on a semiconductor substrate or on an epitaxial growth layer grown on a semiconductor substrate, and an active layer is provided only at the bottom of said V-groove. The method for manufacturing a semiconductor device according to the present invention comprises the steps of forming a stripe-like etching protective film in direction of a semiconductor substrate or an epitaxial growth layer grown on it, performing gas etching using hydrogen chloride as etching gas on a semiconductor substrate or on an epitaxial growth layer grown on a semiconductor substrate to form a V-groove, and forming an active layer at the bottom of said V-groove.
摘要翻译: 根据本发明的半导体器件包括在半导体衬底上或在半导体衬底上生长的外延生长层上形成具有V形横截面的V形沟槽,并且仅在所述V的底部提供有源层 -槽。 根据本发明的制造半导体器件的方法包括以下步骤:在半导体衬底或其上生长的外延生长层的<011>方向上形成条状蚀刻保护膜,使用氯化氢作为蚀刻进行气体蚀刻 在半导体衬底上或在半导体衬底上生长的外延生长层上的气体形成V形槽,并在所述V形槽的底部形成有源层。
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公开(公告)号:US20090081110A1
公开(公告)日:2009-03-26
申请号:US12282961
申请日:2007-03-08
CPC分类号: C30B25/165 , C30B25/02 , C30B29/406 , H01L21/0237 , H01L21/02389 , H01L21/0242 , H01L21/0254 , H01L21/0262
摘要: Disclosed is a method of manufacturing a GaN-based material having high thermal conductivity. A gallium nitride-based material is grown by HVPE (Hydride Vapor Phase Epitaxial Growth) by supplying a carrier gas (G1) containing H2 gas, GaCl gas (G2), and NH3 gas (G3) to a reaction chamber (10), and setting the growth temperature at 900 (° C.) (inclusive) to 1,200 (° C.) (inclusive), the growth pressure at 8.08×104 (Pa) (inclusive) to 1.21×105 (Pa) (inclusive), the partial pressure of the GaCl gas (G2) at 1.0×104 (Pa) (inclusive) to 1.0×104 (Pa) (inclusive), and the partial pressure of the NH3 gas (G3) at 9.1×102 (Pa) (inclusive) to 2.0×104 (Pa) (inclusive).
摘要翻译: 公开了一种制造具有高导热性的GaN基材料的方法。 通过向反应室(10)供给含有H 2气体,GaCl气体(G2)和NH 3气体(G3)的载气(G1),通过HVPE(氢化物气相外延生长)来生长氮化镓系材料, 将生长温度设定在900(℃)(含)以上为1,200(℃)(以下),将生长压力设定在8.08×104(Pa)(含)以上至1.21×10 5 Pa以上, 的气体(G2)在1.0×104(Pa)(包括)至1.0×104(Pa)(含)的范围内,NH 3气体(G3)在9.1×102(Pa)(包括在内)的分压为2.0×10 4( Pa)(含)。
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公开(公告)号:US07794541B2
公开(公告)日:2010-09-14
申请号:US12282961
申请日:2007-03-08
IPC分类号: C30B23/00
CPC分类号: C30B25/165 , C30B25/02 , C30B29/406 , H01L21/0237 , H01L21/02389 , H01L21/0242 , H01L21/0254 , H01L21/0262
摘要: Disclosed is a method of manufacturing a GaN-based material having high thermal conductivity. A gallium nitride-based material is grown by HVPE (Hydride Vapor Phase Epitaxial Growth) by supplying a carrier gas (G1) containing H2 gas, GaCl gas (G2), and NH3 gas (G3) to a reaction chamber (10), and setting the growth temperature at 900 (° C.) (inclusive) to 1,200 (° C.) (inclusive), the growth pressure at 8.08×104 (Pa) (inclusive) to 1.21×105 (Pa) (inclusive), the partial pressure of the GaCl gas (G2) at 1.0×104 (Pa) (inclusive) to 1.0×104 (Pa) (inclusive), and the partial pressure of the NH3 gas (G3) at 9.1×102 (Pa) (inclusive) to 2.0×104 (Pa) (inclusive).
摘要翻译: 公开了一种制造具有高导热性的GaN基材料的方法。 通过向反应室(10)供给含有H 2气体,GaCl气体(G2)和NH 3气体(G3)的载气(G1),通过HVPE(氢化物气相外延生长)来生长氮化镓系材料, 将生长温度设定在900(℃)(含)以上为1,200(℃)(以下),将生长压力设定在8.08×104(Pa)(含)以上至1.21×10 5(Pa)(以下) 在1.0×104(Pa)(含)下将GaCl气体(G2)的分压为1.0×104(Pa)(以下),NH 3气体(G3)的分压为9.1×102(Pa) )至2.0×104(Pa)(含)。
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10.
公开(公告)号:US20100162945A1
公开(公告)日:2010-07-01
申请号:US12719465
申请日:2010-03-08
IPC分类号: C30B25/02
CPC分类号: C30B25/165 , C30B25/02 , C30B29/406 , H01L21/0237 , H01L21/02389 , H01L21/0242 , H01L21/0254 , H01L21/0262
摘要: A method to make gallium nitride-based material by Hydride Vapor Phase Epitaxial Growth is provided.
摘要翻译: 提供了通过氢化物气相外延生长来制造氮化镓基材料的方法。
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