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    Integrated circuit chip carrier
    2.
    发明授权
    Integrated circuit chip carrier 失效
    集成电路芯片载体

    公开(公告)号：US5293067A

    公开(公告)日：1994-03-08

    申请号：US898231

    申请日：1992-06-12

    申请人： Kenneth R. Thompson ,  Kingshuk Banerji ,  William B. Mullen, III

    发明人： Kenneth R. Thompson ,  Kingshuk Banerji ,  William B. Mullen, III

    IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/32 ,  H01L23/498 ,  H01L23/02

    CPC分类号： H01L23/49827 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/15311

    摘要： An integrated circuit chip carrier assembly, comprising a semiconductor device (10) having interconnection pads (14) disposed on an active surface (12) of the device. The device (10) is attached by means of electrically conducting bumps (26) to a circuitry pattern (18) on a first side of a circuit carrying substrate (16). The substrate is typically an aramid reinforced organic resin, such as epoxy. The circuitry (18, 20) is electrically connected by conductive through-holes (22) to an array of solder pads on a second side of the substrate. Some or all of the through-holes (22) are covered by the device. The overall length and width of the circuit carrying substrate (16) are each a maximum of about 0.15 inches greater than the equivalent dimensions of the device (10), creating a carrier that is only slightly larger than the semiconductor device itself.

    摘要翻译： 一种集成电路芯片载体组件，包括具有布置在所述装置的有效表面（12）上的互连焊盘（14）的半导体器件（10）。 装置（10）通过导电凸块（26）连接到电路承载衬底（16）的第一侧上的电路图案（18）。 基底通常是芳族聚酰胺增强的有机树脂，例如环氧树脂。 电路（18,20）通过导电通孔（22）电连接到衬底的第二侧上的焊盘阵列。 一些或全部通孔（22）被装置覆盖。 电路承载基板（16）的总长度和宽度各自最大大约为装置（10）的等效尺寸约0.15英寸，从而形成仅略大于半导体装置本身的载体。

    STRUCTURAL COMPONENT
    3.
    发明申请
    STRUCTURAL COMPONENT 审中-公开
    结构部件

    公开(公告)号：US20160356044A1

    公开(公告)日：2016-12-08

    申请号：US15169982

    申请日：2016-06-01

    申请人： Kenneth R. Thompson

    发明人： Kenneth R. Thompson

    IPC分类号： E04C3/12 ,  E04B1/76 ,  E04B1/88

    CPC分类号： E04C3/29 ,  E04B1/76 ,  E04B1/7604 ,  E04B1/88 ,  E04B2001/7679 ,  E04C3/02 ,  E04C3/122 ,  E04C3/127 ,  E04C3/145 ,  E04C3/36

    摘要： A structural component for use in building construction including a first and second support material member, an insulating material, and a first securing member. The first support material member may have a first length, a first side, and an opposing second side. The second support material member may have a second length, a first side, and an opposing second side. The second support material member may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to secure the first support material member to the second support material member.

    摘要翻译： 一种用于建筑结构的结构构件，包括第一和第二支撑材料构件，绝缘材料和第一固定构件。 第一支撑材料构件可以具有第一长度，第一侧和相对的第二侧。 第二支撑材料构件可以具有第二长度，第一侧和相对的第二侧。 第二支撑材料构件可以与第一支撑材料构件相对。 绝缘材料可以设置在第一支撑材料构件和第二支撑材料构件之间。 第一固定构件可以适于将第一支撑材料构件固定到第二支撑材料构件。

    Shielded semiconductor device package
    4.
    发明授权
    Shielded semiconductor device package 失效
    屏蔽半导体器件封装

    公开(公告)号：US5557142A

    公开(公告)日：1996-09-17

    申请号：US650326

    申请日：1991-02-04

    申请人： Peter B. Gilmore ,  Kenneth R. Thompson

    发明人： Peter B. Gilmore ,  Kenneth R. Thompson

    IPC分类号： H01L23/552 ,  H01L23/02

    CPC分类号： H01L23/552 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025

    摘要： A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating (19) serves as a barrier to the transmission of electromagnetic or radio frequency energy, thereby shielding the semiconductor device (16). The shielded semiconductor package is manufactured by providing a metallization pattern (12 and 14) on a substrate (10) and mechanically attaching and electrically interconnecting a semiconductor device (16) to the metallization pattern. A resin (18) is transfer molded about the semiconductor device, the electrical interconnections (17), and the metallization pattern so as to form an assembly, and a metal coating (19) is applied via vacuum deposition or plating to interconnect with a portion of the metallization pattern.

    摘要翻译： 提供一种屏蔽半导体封装及其制造方法。 屏蔽半导体封装包括施加在封装的半导体器件（16）上的金属涂层（19）。 该装置可以通过球顶技术进行模塑或包封。 金属涂层（19）用作电磁或射频能量传输的屏障，从而屏蔽半导体器件（16）。 屏蔽半导体封装通过在衬底（10）上提供金属化图案（12和14）并机械地将半导体器件（16）电连接到金属化图案来制造。 树脂（18）围绕半导体器件，电互连（17）和金属化图案传递模制以形成组件，并且通过真空沉积或电镀施加金属涂层（19）以与部分 的金属化图案。

    STRUCTURAL COMPONENT
    5.
    发明申请
    STRUCTURAL COMPONENT 审中-公开

    公开(公告)号：US20170167138A1

    公开(公告)日：2017-06-15

    申请号：US15430848

    申请日：2017-02-13

    申请人： Kenneth R. Thompson

    发明人： Kenneth R. Thompson

    IPC分类号： E04C3/29 ,  E04C3/36 ,  E04C3/02

    CPC分类号： E04C3/29 ,  E04B1/76 ,  E04B1/7604 ,  E04B1/88 ,  E04B2001/7679 ,  E04C3/02 ,  E04C3/122 ,  E04C3/127 ,  E04C3/145 ,  E04C3/36

    摘要： A structural component for use in building construction including a first support material member, a second support material member, an insulating material, and a first securing member. The first support material member may have a first length and a first edge. The second support material member may have a second length and a second edge and may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to contact the first edge and the second edge.

    Apparatus for inserting data into the vertical blanking interval of a video signal
    6.
    发明授权
    Apparatus for inserting data into the vertical blanking interval of a video signal 失效
    用于将数据插入视频信号的垂直消隐间隔的装置

    公开(公告)号：US6064440A

    公开(公告)日：2000-05-16

    申请号：US004475

    申请日：1998-01-08

    申请人： Gregory S. Born ,  Paul A. Cousineau ,  Kenneth R. Thompson

    发明人： Gregory S. Born ,  Paul A. Cousineau ,  Kenneth R. Thompson

    IPC分类号： H04N7/088 ,  H04N7/087

    CPC分类号： H04N7/088

    摘要： An improved data inserter for inserting data into selected lines, including the vertical blanking interval, of a television or video signal. The data inserter includes a parallel interface for receiving data and a digital signal processor (DSP) for controlling the insertion of that data. A dual port memory structure is used to temporarily store data to be inserted. The dual port memory is associated with and connected to an autobuffer unit. Each video signal received by the inserter is provided to a switch which is also coupled to the autobuffer unit so that the switch may receive data stored in the dual port memory devices. When a selected line in a given video signal is detected by the DSP, it triggers the respective autobuffer unit which, in turn, transfers the data out of the dual port memory to the respective switch for insertion into the selected line of the video signal.

    摘要翻译： 一种改进的数据插入器，用于将数据插入电视或视频信号的选定行中，包括垂直消隐间隔。 数据插入器包括用于接收数据的并行接口和用于控制该数据的插入的数字信号处理器（DSP）。 双端口存储器结构用于临时存储要插入的数据。 双端口存储器与自动缓冲器单元相关联并连接到自动缓冲器单元。 由插入器接收的每个视频信号被提供给也被耦合到自动缓冲器单元的开关，使得开关可以接收存储在双端口存储器装置中的数据。 当由DSP检测到给定视频信号中的选定行时，它触发相应的自动缓冲器单元，该自动缓冲器单元又将数据从双端口存储器传送到相应的开关，以便插入视频信号的选定行。

    Revenue generating system and associated methods
    7.
    发明授权
    Revenue generating system and associated methods 有权
    收入生成系统及相关方法

    公开(公告)号：US07722454B2

    公开(公告)日：2010-05-25

    申请号：US11115803

    申请日：2005-04-27

    申请人： Kenneth R. Thompson ,  Debra R. Hatch

    发明人： Kenneth R. Thompson ,  Debra R. Hatch

    IPC分类号： A63F9/24

    CPC分类号： G06Q30/02

    摘要： A system for generating revenue includes a fee collection station. The fee collection station may include a controller and a fee receiver in communication with the controller for receiving a predetermined fee from a plurality of users. The fee receiver may also receive a predetermined participation fee from the plurality of users that selectively participate in a game. The fee collection station may also comprise an indicator in communication with the controller and adjacent to the fee receiver for indicating to participating users one of a winning indication or a losing indication. The participating users that receive the winning indication may receive a predetermined reward.

    摘要翻译： 收取收入的系统包括收费站。 收费站可以包括控制器和与控制器通信的费用接收器，用于从多个用户接收预定的费用。 费用接收者还可以从有选择地参与游戏的多个用户接收预定参与费用。 费用收集站还可以包括与控制器通信并与费用接收器相邻的指示符，用于向参与用户指示获胜指示或丢失指示之一。 接收获胜指示的参与用户可以获得预定的奖励。

    Vessel transfer system and associated methods
    8.
    发明授权
    Vessel transfer system and associated methods 有权
    船舶转运系统及相关方法

    公开(公告)号：US06979149B1

    公开(公告)日：2005-12-27

    申请号：US10869424

    申请日：2004-06-16

    申请人： Kenneth R. Thompson

    发明人： Kenneth R. Thompson

    IPC分类号： E02C5/00

    CPC分类号： E02C5/00

    摘要： A system for transferring a vessel between a first body of water having a first water level and a second body of water having a second water level includes a barrier separating the first body of water from the second body of water. The system also includes a transfer structure adjacent the barrier for receiving the vessel to be transferred between the first and second bodies of water, and a transfer apparatus adjacent the barrier for moving the transfer structure between a first position and a second position. The upper portion of the barrier includes a barrier door that is movable between an opened position when the transfer structure is in the second position to allow the vessel to move into and out of the transfer structure, and a closed position when the transfer structure is in the first position.

    摘要翻译： 用于在具有第一水位的第一水体和具有第二水位的第二水体之间转移容器的系统包括将第一水体与第二水体分隔开的屏障。 该系统还包括邻近屏障的传送结构，用于接收要在第一和第二水体之间转移的容器，以及邻近屏障的传送装置，用于在第一位置和第二位置之间移动传送结构。 挡板的上部包括阻挡门，该挡板门能够在转印结构处于第二位置的打开位置之间移动，以允许容器移入和移出转印结构;以及当转印结构处于 第一名。

    Self-aligning electrical contact array
    9.
    发明授权
    Self-aligning electrical contact array 失效
    自调心电接触阵列

    公开(公告)号：US5381307A

    公开(公告)日：1995-01-10

    申请号：US129010

    申请日：1993-09-29

    申请人： Allen D. Hertz ,  David A. Tribbey ,  Kenneth R. Thompson

    发明人： Allen D. Hertz ,  David A. Tribbey ,  Kenneth R. Thompson

    IPC分类号： B23K1/20 ,  H05K1/11 ,  H05K3/34 ,  H05K13/04 ,  H05K7/10 ,  H05K7/02

    CPC分类号： B23K1/20 ,  H05K1/111 ,  H05K13/046 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/13012 ,  H01L2224/1403 ,  H01L2224/14051 ,  H05K2201/094 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/048 ,  H05K2203/166 ,  Y02P70/611 ,  Y02P70/613

    摘要： A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern. Eight pads of the second pad array (406) also align with points of intersection of the first linear grid pattern that fall within each of the eight aligning pads (504,506,510,514,518). Each pad of the second pad array (406) is equal in size to any other pad of the second pad array (406). Solder (312) is disposed between and contacting each pad of the first and second pad arrays.

    摘要翻译： 安装垫装置（图5）提高了表面安装部件的放置的可靠性。 第一衬垫阵列设置在衬底（202）的表面（308）上的整个区域中，该区域具有四个外角。 第一焊盘阵列包括以第一线性栅格图案布置的接触焊盘（502）和大于接触焊盘（502）的八个对准焊盘（504,506,510,514,518）。 两个对准垫（504,506,510,514,518）靠近四个外角中的每一个。 每个对准衬垫（504,506,510,514,518）相对于第一线性网格图案偏离中心，使得切向线（608,610,612,614）可以在对准衬垫（504,506,510,514,518）的最内点和接触垫（502）的相应最内点之间绘制 ），其在第一线性网格图案上是共线的。 第二衬垫阵列（406）设置在表面安装部件上并且以与第一线性网格图案对准的第二线性网格图案布置。 第二焊盘阵列（406）的八个焊盘还与落在八个对准焊盘（504,506,510,514,518）的每一个内的第一线性栅格图案的交点相对准。 第二焊盘阵列（406）的每个焊盘的大小与第二焊盘阵列（406）的任何其他焊盘相同。 焊料（312）设置在第一和第二焊盘阵列之间并接触第一和第二焊盘阵列的每个焊盘。