公开(公告)号：US06644866B1

公开(公告)日：2003-11-11

申请号：US09386317

申请日：1999-08-31

申请人： Kiyonori Kusuda ,  Kenji Tsutsumi ,  Hiroshi Kadoya ,  Kenji Toshimitsu ,  Kazuo Fujita ,  Hiroshi Katou ,  Mitsuaki Hayashi ,  Koichi Nakamura ,  Hironori Tanaka ,  Akira Sawada ,  Kazuya Nishida ,  Hideki Zenitani

发明人： Kiyonori Kusuda ,  Kenji Tsutsumi ,  Hiroshi Kadoya ,  Kenji Toshimitsu ,  Kazuo Fujita ,  Hiroshi Katou ,  Mitsuaki Hayashi ,  Koichi Nakamura ,  Hironori Tanaka ,  Akira Sawada ,  Kazuya Nishida ,  Hideki Zenitani

IPC分类号： G02B636

CPC分类号： G02B6/3897 ,  G02B6/3616 ,  G02B6/3817 ,  G02B6/3825 ,  G02B6/3879 ,  G02B6/4471 ,  G02B6/4478

摘要： An electronic apparatus includes an optical connector adapting unit to which optical connectors of external optical fibers are connected. The optical connector adapting unit includes a plurality of optical connector adapters which are diagonally arranged on the front side of the apparatus. The optical connectors of the external optical fibers are diagonally detachable from the optical connector adapters. In this electronic apparatus, a large number of optical connectors of optical fibers can be connected and arranged in a restricted space.

摘要翻译： 一种电子设备，包括连接外部光纤的光学连接器的光学连接器适配单元。 光连接器适配单元包括多个光学连接器适配器，它们对角地布置在设备的前侧。 外部光纤的光学连接器可以与光学连接器适配器对角地分离。 在这种电子设备中，可以在有限的空间中连接和布置大量的光纤光连接器。

公开(公告)号：US07196905B2

公开(公告)日：2007-03-27

申请号：US11044629

申请日：2005-01-27

申请人： Hironori Tanaka ,  Yoshiyuki Sato ,  Wataru Takano ,  Hideki Zenitani ,  Mituaki Hayashi ,  Kazuya Nishida ,  Katsuhiko Ikeda

发明人： Hironori Tanaka ,  Yoshiyuki Sato ,  Wataru Takano ,  Hideki Zenitani ,  Mituaki Hayashi ,  Kazuya Nishida ,  Katsuhiko Ikeda

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the elastic member includes an engaging part configured to engage the projection part and a radiator insert hole forming part where the radiator is inserted, and a pushing force is applied from the elastic member to the radiator by rotating the radiator so that the projection part is engaged by the engaging part, and thereby a bottom surface of the radiator is adhered to the electronic component.

摘要翻译： 散热装置包括：散热器，其通过设置在电路板上的弹性部件固定在安装在电路板上的电子部件上，使电子部件冷却。 散热器包括多个突起部分，弹性部件包括配合成与突出部接合的接合部和散热器插入的散热器插入孔形成部，并且通过旋转从弹性部件向散热器施加推力 所述散热器使得所述突出部与所述接合部接合，从而所述散热器的底面粘附到所述电子部件。

公开(公告)号：US20050185384A1

公开(公告)日：2005-08-25

申请号：US11044629

申请日：2005-01-27

申请人： Hironori Tanaka ,  Yoshiyuki Sato ,  Wataru Takano ,  Hideki Zenitani ,  Mituaki Hayashi ,  Kazuya Nishida ,  Katsuhiko Ikeda

发明人： Hironori Tanaka ,  Yoshiyuki Sato ,  Wataru Takano ,  Hideki Zenitani ,  Mituaki Hayashi ,  Kazuya Nishida ,  Katsuhiko Ikeda

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/40 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat radiating apparatus includes a radiator adhering to an electronic component mounted on a circuit board via an elastic member provided on the circuit board so that the electronic component is cooled. The radiator includes a plurality of projection parts, the elastic member includes an engaging part configured to engage the projection part and a radiator insert hole forming part where the radiator is inserted, and a pushing force is applied from the elastic member to the radiator by rotating the radiator so that the projection part is engaged by the engaging part, and thereby a bottom surface of the radiator is adhered to the electronic component.

摘要翻译： 散热装置包括：散热器，其通过设置在电路板上的弹性部件固定在安装在电路板上的电子部件上，使电子部件冷却。 散热器包括多个突起部分，弹性部件包括配合成与突出部接合的接合部和散热器插入的散热器插入孔形成部，并且通过旋转从弹性部件向散热器施加推力 所述散热器使得所述突出部与所述接合部接合，从而所述散热器的底面粘附到所述电子部件。

公开(公告)号：US06991471B2

公开(公告)日：2006-01-31

申请号：US10788915

申请日：2004-02-27

申请人： Mitsuaki Hayashi ,  Akira Sawada ,  Kouichi Kuramitsu ,  Wataru Takano ,  Minoru Fujii ,  Hironori Tanaka

发明人： Mitsuaki Hayashi ,  Akira Sawada ,  Kouichi Kuramitsu ,  Wataru Takano ,  Minoru Fujii ,  Hironori Tanaka

IPC分类号： H01R12/00 ,  H05K1/00

CPC分类号： G02B6/4452 ,  G02B6/3897 ,  G02B6/4292

摘要： An electronic apparatus has a plug-in unit and a housing that can increase a number of optical modules connected thereto. In the plug-in unit, a first connector is connectable to an optical module connected to an optical cable. A connector housing accommodates the first connector and has an insertion part into which the optical module is inserted. An attachment lever is used for fixing the plug-in unit to the housing in which the plug-in unit is accommodated. The first connector is located on a back side of the plug-in unit opposite to a front side where the attachment lever is located.

摘要翻译： 电子设备具有插入单元和壳体，其可以增加与其连接的多个光学模块。 在插件单元中，第一连接器可连接到连接到光缆的光学模块。 连接器壳体容纳第一连接器并且具有插入部件，光学模块插入该插入部分。 使用连接杆将插入单元固定到容纳插入单元的壳体上。 第一连接器位于插入单元的背面，与安装杆所在的前侧相对。

公开(公告)号：US20050074222A1

公开(公告)日：2005-04-07

申请号：US10788915

申请日：2004-02-27

申请人： Mitsuaki Hayashi ,  Akira Sawada ,  Kouichi Kuramitsu ,  Wataru Takano ,  Minoru Fujii ,  Hironori Tanaka

发明人： Mitsuaki Hayashi ,  Akira Sawada ,  Kouichi Kuramitsu ,  Wataru Takano ,  Minoru Fujii ,  Hironori Tanaka

IPC分类号： G02B6/00 ,  G02B6/38 ,  G02B6/42 ,  H05K7/14

CPC分类号： G02B6/4452 ,  G02B6/3897 ,  G02B6/4292

摘要： An electronic apparatus has a plug-in unit and a housing that can increase a number of optical modules connected thereto. In the plug-in unit, a first connector is connectable to an optical module connected to an optical cable. A connector housing accommodates the first connector and has an insertion part into which the optical module is inserted. An attachment lever is used for fixing the plug-in unit to the housing in which the plug-in unit is accommodated. The first connector is located on a back side of the plug-in unit opposite to a front side where the attachment lever is located.

摘要翻译： 电子设备具有插入单元和壳体，其可以增加与其连接的多个光学模块。 在插件单元中，第一连接器可连接到连接到光缆的光学模块。 连接器壳体容纳第一连接器并且具有插入部件，光学模块插入该插入部分。 使用连接杆将插入单元固定到容纳插入单元的壳体上。 第一连接器位于插入单元的背面，与安装杆所在的前侧相对。

公开(公告)号：US07463495B2

公开(公告)日：2008-12-09

申请号：US11474456

申请日：2006-06-26

申请人： Hironori Tanaka ,  Akira Sawada ,  Mitsuaki Hayashi ,  Minoru Fujii ,  Wataru Takano

发明人： Hironori Tanaka ,  Akira Sawada ,  Mitsuaki Hayashi ,  Minoru Fujii ,  Wataru Takano

IPC分类号： H05K7/02

CPC分类号： H05K7/20418 ,  H05K7/12

摘要： An optical module cage mounting structure is disclosed. In the module cage mounting structure, an optical module cage including a cage body with a box shape into which an optical module is inserted is mounted on a printed circuit board such that the cage body is spaced apart from a face of the printed circuit board.

摘要翻译： 公开了一种光模块保持架安装结构。 在模块保持架安装结构中，在印刷电路板上安装包括具有插入光学模块的箱形的笼体的光模块保持架，使得保持架主体与印刷电路板的表面间隔开。

公开(公告)号：US20070223208A1

公开(公告)日：2007-09-27

申请号：US11474456

申请日：2006-06-26

申请人： Hironori Tanaka ,  Akira Sawada ,  Mitsuaki Hayashi ,  Minoru Fujii ,  Wataru Takano

发明人： Hironori Tanaka ,  Akira Sawada ,  Mitsuaki Hayashi ,  Minoru Fujii ,  Wataru Takano

IPC分类号： H05K7/04 ,  H05K7/02

CPC分类号： H05K7/20418 ,  H05K7/12

摘要： An optical module cage mounting structure is disclosed. In the module cage mounting structure, an optical module cage including a cage body with a box shape into which an optical module is inserted is mounted on a printed circuit board such that the cage body is spaced apart from a face of the printed circuit board.

摘要翻译： 公开了一种光模块保持架安装结构。 在模块保持架安装结构中，在印刷电路板上安装包括具有插入光学模块的箱形的笼体的光学模块保持架，使得保持架主体与印刷电路板的表面间隔开。

公开(公告)号：US07064961B2

公开(公告)日：2006-06-20

申请号：US09952246

申请日：2001-09-14

申请人： Akira Sawada ,  Mitsuaki Hayashi ,  Hironori Tanaka ,  Kouichi Kuramitsu ,  Miyuki Hashimoto ,  Wataru Takano ,  Mitsuo Fujimura

发明人： Akira Sawada ,  Mitsuaki Hayashi ,  Hironori Tanaka ,  Kouichi Kuramitsu ,  Miyuki Hashimoto ,  Wataru Takano ,  Mitsuo Fujimura

IPC分类号： H01R12/16

CPC分类号： H05K7/1441 ,  H05K7/1451

摘要： A communication device which is constructed so as to permit efficient mounting of cards such as printed boards, thereby enhancing convenience and economy and ensuring high-quality communications. A basic unit is constituted by a basic board having a common control section packaged thereon, and a basic back wiring board on which are arranged a basic card connector for mounting a detachable card unit for processing signals and a basic link connector for additionally connecting such a card unit and which has wiring formed on a substrate thereof. An extension unit is connected to the basic link connector to permit additional connection of the card unit.

公开(公告)号：US08624132B2

公开(公告)日：2014-01-07

申请号：US13109745

申请日：2011-05-17

申请人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

发明人： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC分类号： H05K1/11

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

摘要： A printed wiring board including a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of about 200 μm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is about 1.05 to about 1.7, connection reliability and insulation reliability can be easily improved.

摘要翻译： 一种印刷电路板，包括设置有至少一个导体电路的布线基板，设置在所述布线基板的表面上的阻焊层，至少一个导体焊盘，所述导体焊盘由设置在所述焊料中的开口露出的所述导体电路的一部分形成 抗蚀剂层和用于将电子部件安装在导体焊盘上的至少一个焊料凸块。 在印刷布线板中，由于至少一个导体焊盘以约200μm或更小的间距对准，并且焊料凸块的直径W与形成的开口的开口直径D的比（W / D） 在阻焊层中约1.05〜约1.7，可以容易地提高连接可靠性和绝缘可靠性。

公开(公告)号：US08575496B2

公开(公告)日：2013-11-05

申请号：US13269079

申请日：2011-10-07

申请人： Hironori Tanaka

发明人： Hironori Tanaka

IPC分类号： H05K1/16 ,  H05K1/18

CPC分类号： H05K1/162 ,  H05K1/0269 ,  H05K1/112 ,  H05K3/205 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/09918 ,  H05K2203/166

摘要： A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the capacitor section, and a metal thin-film layer is provided over the capacitor section and on the second insulation layer. An outermost interlayer resin insulation layer is provided on the second insulation layer and the metal thin-film layer. A mounting section is provided on the outermost insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals. Second via conductors electrically connect the second layered electrode to the second external terminals.

摘要翻译： 一种多层印刷线路板，包括设置在第一层间树脂绝缘层和高电介质层上的层状电容器部分和夹着高电介质层的第一和第二层状电极。 在第一绝缘层和电容器部分上设置第二层间树脂绝缘层，并且在电容器部分和第二绝缘层上设置金属薄膜层。 在第二绝缘层和金属薄膜层上设置最外层的层间树脂绝缘层。 安装部分设置在最外层绝缘层上，并且具有安装半导体元件的第一和第二外部端子。 多个通孔导体穿过每个绝缘层。 通孔导体包括将第一层状电极电连接到第一外部端子的第一通孔导体。 第二通孔导体将第二层状电极电连接到第二外部端子。