摘要:
A hermetic cap member of a casing for a semiconductor memory element is provided with a protection layer on a recessed surface facing the memory element. The protection layer is of at least one material which does not emit alpha particles and has a thickness sufficient to prevent alpha particles from being emitted from the cap member onto the memory element. Specifically, the protection layer may be a plate of a pertinent one of the following silicon of high purity, 42 alloy, or Kovar and is attached to the cap member by the use of an adhesive of glass frit. Alternatively, the protection layer may be made from a metallic paste of silver, silver-palladium, or gold-palladium by firing the same onto the cap member. The protection layer may also be magnesium oxide formed by the use of a plasma spray process. As a further alternative, the protection layer may consist of a plurality of materials.
摘要:
A process for forming fine thick-film conductor patterns on a ceramic substrate which comprises the steps of forming grooves in a positive-working photoresist layer on the substrate by the photolithographic technology, filling the grooves with a conductive paste by squeezing with a squeegee, removing the photoresist layer by a wet process, and firing the remaining conductive paste pattern is improved. By the improvements, the conductive paste is squeezed into the grooves by the screen printing technique using a mask, and/or the solvent in the conducive paste consists essentially of one or more hydrocarbons, and/or the squeegee is made of a material having a flexural modulus in a range of 30-200 kgf/mm.sup.2. The formation of the grooves may be accomplished by laser beam machining; in this case a negative-working photoresist or any other soluble resin may be used to form the grooves therein. Also provided are a process for forming a fine thick-film conductor pattern by means of transfer of a conductive paste pattern formed on a support film to a green sheet, as well as a process for forming bumps on a ceramic circuit substrate.
摘要:
A ceramic substrate has a five-layered thin metallic film thereon. The first layer is Ti, Zr, Cr and/or W; the second layer is Ni and/or Mo; the third layer is one or more metals of group Ib in the periodic table; the fourth layer contains the same metals as the second layer and the fifth layer contains the same metals as the third layer.
摘要:
An electronic apparatus is configured to display screen information supplied from a portable information terminal, and includes a connection unit configured to confirm if the portable information terminal is connected to the electronic apparatus. Also included is a notification unit configured to notify the portable information terminal of setting information concerning setting of the screen information supplied from the portable information terminal. A receiving unit is configured to receive the screen information that is set on the basis of the setting information from the portable information terminal, and a display unit is configured to display the screen information received by the receiving unit.
摘要:
An electronic apparatus is configured to display screen information supplied from a portable information terminal, and includes a connection unit configured to confirm if the portable information terminal is connected to the electronic apparatus. Also included is a notification unit configured to notify the portable information terminal of setting information concerning setting of the screen information supplied from the portable information terminal. A receiving unit is configured to receive the screen information that is set on the basis of the setting information from the portable information terminal, and a display unit is configured to display the screen information received by the receiving unit.
摘要:
A music data reproduction apparatus can reproduce music data stored in a hierarchical folder with a simpler operation, and the reproduction can be started in a shorter time. An audio system for reproducing music data stored in a hierarchical format in one or more folders recorded on a memory includes a folder specifying unit for specifying one of the folders, a music data extracting unit for extracting music data stored in a lower-level folder under the folder that is specified by the folder specifying unit, and an audio processing unit for reproducing the music data that is extracted by the music data extracting unit.
摘要:
Photoresist compositions, which can attain high-accuracy etching without causing separation and flexible printed wiring boards prepared with the photoresist compositions are disclosed. In order to etch a polyimide precursor layer on a conductive circuit, a photoresist composition comprising a photopolymerizable organic material (A), a water-soluble resin (B) and an amino-group-containing resin (C) is applied on the surface of the polyimide precursor layer to form a photoresist layer. Then, the photoresist layer is patterned by a photolithographic process. The polyimide precursor layer is etched and the pattern of the photoresist layer is transferred to the polyimide precursor layer. The amino-group-containing resin (C) in the photoresist layer is combined with an acid anhydride in the polyimide precursor layer to attain good adhesion and high-accuracy etching without causing separation of the photoresist layer. Alternatively, a film can be formed from the photoresist composition and then be applied on the surface of the polyimide precursor layer to form a photoresist layer.
摘要:
A flexible printed circuit board that is intended to minimize curling is formed having a first polyimide-resin layer with a conductor pattern formed on one surface thereof and supporting that conductor pattern. A second polyimide-resin is formed on another surface of the conductor pattern and covers and protects the circuit of the conductor pattern. The polyimide-resin layers are chosen so that a difference between a coefficient of linear thermal expansion of the first polyimide-resin layer and the coefficient of linear thermal expansion of the second polyimide-resin layer is 3×10−6/K or smaller.
摘要:
The present invention aims to obtain a flexible printed wiring board with good flatness. According to the present invention, a copper-clad film 3 is formed by applying a polyamic acid solution on one surface of a copper foil 2 and thermally contracting the polyamic acid layer la so that the other surface of the copper foil 2 may form a convex surface of a curling surface to form a polyimide film 1. A polyamic acid solution is applied on the other surface of the copper foil 2 of the copper-clad film 3, and then the polyamic acid layer 5a is thermally contracted to form a protective film 5, whereby a flexible printed wiring board 10 is obtained.
摘要:
Low-firing glass ceramic green sheets useful in the production of glass ceramic multilayer substrates are prepared from a coarse raw powder material comprising a B.sub.2 O.sub.3 -containing glass powder. The coarse raw powder material is initially subjected to wet grinding, either in an alcohol-free organic solvent in the presence or absence of an organic binder, or in an alcohol-containing organic solvent in the presence of an organic binder, until the powder is comminuted to a particle size suitable for tape casting. The wet-ground powder is slurried with an organic solvent and an organic binder, and the slurry is cast into sheets. The resulting green sheets have improved elongation and can be punched to form fine through holes with a small pitch.
摘要翻译:用于制造玻璃陶瓷多层基板的低烧玻璃陶瓷生片由包含含B 2 O 3的玻璃粉末的粗制原料粉末制备。 在有机粘合剂存在或不存在下,或者在有机粘合剂存在下,在含醇的有机溶剂中,粗粉末原料首先在无醇的有机溶剂中进行湿磨,直到粉末为 粉碎成适合于胶带铸造的粒度。 湿磨粉末用有机溶剂和有机粘合剂浆化,并将浆料浇铸成片。 所得到的生片具有提高的伸长率并且可以冲压以形成具有小间距的细小通孔。