摘要:
Photoresist compositions, which can attain high-accuracy etching without causing separation and flexible printed wiring boards prepared with the photoresist compositions are disclosed. In order to etch a polyimide precursor layer on a conductive circuit, a photoresist composition comprising a photopolymerizable organic material (A), a water-soluble resin (B) and an amino-group-containing resin (C) is applied on the surface of the polyimide precursor layer to form a photoresist layer. Then, the photoresist layer is patterned by a photolithographic process. The polyimide precursor layer is etched and the pattern of the photoresist layer is transferred to the polyimide precursor layer. The amino-group-containing resin (C) in the photoresist layer is combined with an acid anhydride in the polyimide precursor layer to attain good adhesion and high-accuracy etching without causing separation of the photoresist layer. Alternatively, a film can be formed from the photoresist composition and then be applied on the surface of the polyimide precursor layer to form a photoresist layer.
摘要:
A flexible printed circuit board that is intended to minimize curling is formed having a first polyimide-resin layer with a conductor pattern formed on one surface thereof and supporting that conductor pattern. A second polyimide-resin is formed on another surface of the conductor pattern and covers and protects the circuit of the conductor pattern. The polyimide-resin layers are chosen so that a difference between a coefficient of linear thermal expansion of the first polyimide-resin layer and the coefficient of linear thermal expansion of the second polyimide-resin layer is 3×10−6/K or smaller.
摘要:
The present invention aims to obtain a flexible printed wiring board with good flatness. According to the present invention, a copper-clad film 3 is formed by applying a polyamic acid solution on one surface of a copper foil 2 and thermally contracting the polyamic acid layer la so that the other surface of the copper foil 2 may form a convex surface of a curling surface to form a polyimide film 1. A polyamic acid solution is applied on the other surface of the copper foil 2 of the copper-clad film 3, and then the polyamic acid layer 5a is thermally contracted to form a protective film 5, whereby a flexible printed wiring board 10 is obtained.
摘要:
A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.
摘要:
A flexible circuit board comprises a polyimide insulating layer 5 with land access holes 3 and a conductor circuit layer 4 provided thereon, and is produced by coating one surface of a conductor circuit metal foil 1 side with a polyimide precursor varnish, which is dried to give a polyimide precursor layer 2, where the polyimide precursor layer 2 is provided with land access holes 3 by a photolithography process; the conductor circuit metal foil 1 is patterned by the subtractive process to form conductor circuit layer 4; and the polyimide precursor layer 4 is then imidated to form polyimide insulating layer 5.
摘要:
The present invention provides a circuit substrate containing a conductive circuit on an insulating base, an electrode for connection to an IC and an electrode for connection to a mother board substrate, which eliminates the step of bonding the film-like insulating base and the conductive circuit to simplify the manufacturing process.
摘要:
A secondary heat exchanger B for recovering latent heat from combustion gas includes water tubes 5 each of which is so inclined that a first end 50a is positioned lower than a second end 50b. Therefore, in draining water from each of the water tubes 5, water can be caused to flow smoothly into a water-inflow and hot-water-outflow header 6A connected to the first ends 50a. The secondary heat exchanger B includes a casing 7 which includes an upper wall 70a and a bottom wall 70b which are so inclined that the inner surfaces thereof extend generally in parallel with the water tubes 5, and the upper and the lower gaps 79a and 79b have constant widths s2 and s3. Therefore, the amount of heat recovery from the combustion gas passing through the gaps 79a and 79b can be increased.
摘要:
A flexible wiring board piece which can prevent a short circuit because of scattering of the connecting terminal parts and facilitate cutting when cut at an intermediate connecting terminal part. A constitution wherein circuit wiring patterns 13 [131-134] are coated with insulating films 11 and 14; connecting terminal parts 17 of the circuit wiring patterns 13 and cut parts 18 of the circuit wiring patterns 13, which are located apart form the connecting terminal parts 17, are exposed in both faces via openings 20a, 20b, 21a and 21b formed in insulating films 11 and 14; and narrow parts for cutting are formed in the cut parts 18 facing the openings 20b and 20b.
摘要:
At a transmitting end, first and second dipole antennas are crossed each other by right angles and are arranged in a plane perpendicular to a propagating direction of radio wave. In first and second balanced modulators, a carrier signal is modulated with respective modulation signals having a phase difference of 90.degree. to produce balanced-modulated signals, which are then supplied to the first and second dipole antennas, respectively. Then a plane of polarization of a composite vector of radio waves transmitted by the dipole antennas is rotated at a frequency of the modulation signals, said frequency being higher than a fading frequency. The modulation signals are controlled by a state of a digital signal to be transmitted. At a receiving end, the digital signal is reproduced by receiving the transmitted radio wave by a conventional single side band receiver.