Single transistor with double gate structure for adjustable firing threshold voltage, and neuromorphic system using the same

    公开(公告)号:US12183821B2

    公开(公告)日:2024-12-31

    申请号:US17346372

    申请日:2021-06-14

    Abstract: Disclosed is a single transistor with a double gate structure for an adjustable firing threshold voltage and a neuromorphic system using the same. A single transistor neuron with a double gate structure according to an example embodiment includes a barrier material layer formed on a semiconductor substrate and comprising a hole barrier material or an electron barrier material; a floating body layer formed on the barrier material layer; a source and a drain formed at both sides of the floating body layer, respectively; a driving gate formed at a first side of the floating body layer without contacting the source and the drain; a control gate formed at a second side of the floating body layer without contacting the source and the drain; and a gate insulating film formed between the floating body layer and the driving gate and between the floating body layer and the control gate.

    STEEP-SLOPE FIELD-EFFECT TRANSISTOR AND FABRICATION METHOD THEREOF

    公开(公告)号:US20220223705A1

    公开(公告)日:2022-07-14

    申请号:US17437368

    申请日:2021-07-29

    Abstract: A steep-slope field-effect transistor and a fabrication method thereof are disclosed. The steep-slope field-effect transistor according to an embodiment of the inventive concept includes a source, a channel region, and a drain formed on a substrate; a gate insulating film formed on an upper portion of the channel region; a floating gate formed on an upper portion of the gate insulating film; a transition layer formed on an upper portion of the floating gate; and a control gate formed on an upper portion of the transition layer. The steep-slope field-effect transistor applies a reference potential or more to the control gate to discharge or bring in at least one charge stored in the floating gate.

    Dynamic random access memory device with long retention and operating method thereof

    公开(公告)号:US11922988B2

    公开(公告)日:2024-03-05

    申请号:US17674301

    申请日:2022-02-17

    CPC classification number: G11C11/404 G11C11/4096

    Abstract: Disclosed are a DRAM device capable of storing charges for a long time and an operating method thereof. According to an embodiment, a DRAM device includes a channel region formed on a substrate, a gate insulating film region formed on the channel region, a floating gate region formed on the gate insulating film region, a transition layer region formed on the floating gate region, and a control gate region formed on the transition layer region and generating a potential difference with the floating gate region in response to a fact that a potential that is not less than a reference potential is applied and releasing at least one charge stored in the floating gate region or storing the at least one charge into the floating gate region, by generating a transition current due to the potential difference.

    Semiconductor channel based neuromorphic synapse device including trap-rich layer

    公开(公告)号:US11288570B2

    公开(公告)日:2022-03-29

    申请号:US16169676

    申请日:2018-10-24

    Abstract: A semiconductor channel based neuromorphic synapse device 1 including a trap-rich layer may be provided that includes: a first to a third semiconductor regions which are formed on a substrate and are sequentially arranged; a word line which is electrically connected to the first semiconductor region; a trap-rich layer which surrounds the second semiconductor region; and a bit line which is electrically connected to the third semiconductor region. When a pulse with positive (+) voltage is applied to the word line, a concentration of electrons emitted from the trap-rich layer to the second semiconductor region increases and a resistance of the second semiconductor region decreases. When a pulse with negative (−) voltage is applied to the word line, a concentration of electrons trapped in the trap-rich layer from the second semiconductor region increases and the resistance of the second semiconductor region increases.

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