摘要:
The step of forming an opening in an insulating layer to expose a carbon nanotube layer is performed using two types of dry etching different from each other in conditions. In the first-stage dry etching step, a hole is formed in the insulating layer to such a depth as not exposing the carbon nanotube layer. Thereafter, in the second-stage dry etching step, a bottom surface portion of the hole is removed, thus exposing an upper surface of the carbon nanotube layer. A method of manufacturing an electron emission source capable of improving performance of an electron emission portion is thus obtained.
摘要:
The step of forming an opening in an insulating layer to expose a carbon nanotube layer is performed using two types of dry etching different from each other in conditions. In the first-stage dry etching step, a hole is formed in the insulating layer to such a depth as not exposing the carbon nanotube layer. Thereafter, in the second-stage dry etching step, a bottom surface portion of the hole is removed, thus exposing an upper surface of the carbon nanotube layer. A method of manufacturing an electron emission source capable of improving performance of an electron emission portion is thus obtained.
摘要:
A circuit substrate includes a plurality of dielectric members and a plurality of wiring patterns. The plurality of wiring patterns are stacked on one another through the plurality of dielectric members. The plurality of dielectric members includes a mount dielectric member. A first wiring pattern of the plurality of wiring patterns is provided on a side of the mount dielectric member. A second wiring pattern of the plurality of wiring patterns is provided on an opposite side of the mount dielectric member. A first length is a length between a reinforcing medium of the mount dielectric member and the opposite side of the mount dielectric member in a thickness direction. A second length is a length between the reinforcing medium of the mount dielectric member and the side of the mount dielectric member in the thickness direction. The first length is smaller than the second length.
摘要:
A voltage detection circuit for accurately detecting a voltage while suppressing the voltage fluctuation due to the off-leak current of a transistor. The voltage detection circuit includes first and second capacitors, first and second transistors, a comparator, and a control circuit. The capacitors are connected in series to generate a division voltage corresponding to a high voltage by the capacitors. The potential at a node between the first capacitor and the second capacitor is reset to ground potential when the transistors are activated. When the potential at the node reaches a predetermined potential, the first transistor is inactivated, and then the second transistor is inactivated.
摘要:
There is provided an oscillator circuit capable of obtaining stable frequency by avoiding output having unstable frequency that is likely to occur to an operation/stop-control-feasible type oscillator circuit when oscillation begins. In such an oscillator circuit, an oscillation permitting signal (EN) sets an oscillator section in oscillation-operable state, whereby a controller section starts operation. The controller section that has stared its operation change an oscillation- frequency control signal (VR) into a signal value corresponding to predetermined oscillation frequency so as to set oscillation frequency at an oscillator section. Further on, the oscillator section outputs an oscillation signal in response to a detection signal (MON) that is outputted after a detector section compares a signal inputted therein with a predetermined signal value and detects that the inputted signal reaches a predetermined signal value. Thereby, transient state of an oscillation-frequency control signal (VR) can be detected. That is, there can be avoided an output of an unstable oscillation signal due to a transient oscillation-frequency control signal (VR).
摘要:
A storage device and its control method are described, according to which a bias voltage to be supplied to a memory cell array is selected from boosted voltages which are increased from an external voltage and non-boosted voltages which are not increased from the external voltage. In the period during which a DC-DC converter section supplies a boosted voltage increased from the external voltage to an internal bias line for supplying a bias voltage to the memory cell array, a non-boosted voltage supply section for supplying a non-boosted voltage equal to or less than the external voltage is in its inactive state. In the period during which the non-boosted voltage supply section supplies a non-boosted voltage to the internal bias line, the DC-DC converter section is in its inactive state. In the period during which a boosted voltage is supplied to the internal bias line, the DC-DC converter section is used for ensuring sufficient power supply ability, and in the period during which the non-boosted voltage is supplied to the internal bias line, the DC-DC converter section can be kept in its inactive state. Thus, the power consumed by the DC-DC converter section can be saved in the period during which the supply of a boosted voltage is unnecessary.
摘要:
A memory system (1A) includes a memory section (2A) and a memory control section (3A). The memory section (2A) includes a test circuit (4A), a data register (5A), a data output section (6A), and a memory core section (9A). Data DI is held in the data resistor (5A). The test circuit (4A) outputs write inhibit signal WINH to the memory core section (9A) in response to test signal TEST. Write instruction recognition signal WR which recognizes that a write command is inputted into the memory section (2A) and select signal S are inverted and, in response thereto, retained data DR of the data register (5A) is outputted as output data DO from the data output section (6A). Thus, it is possible to test whether generation, propagation, or recognition operation of a write command CMD and the data DI is normal or not without executing the operation of writing data into a memory cell of the memory section.
摘要:
It is an object to provide a semiconductor memory device that can conduct the equalizing operation of bit lines with a low current consumption while maintaining a normal accessing speed and the chip area, and a control method thereof. In a semiconductor memory device of the shared sense amplification system, in a predetermined number of times which is (k−1) times or less among k-times of continuous word line selections of a selected memory block, the bit line separation gate of the unselected memory block is rendered conductive in the active period of the equalizing unit after the word line selection. Also, a circuit that equalizes a wiring higher in the capacity component is driven by a higher voltage level according to the wiring capacity component of the sense amplification power supply line and the bit lines, to thereby equalize the power supply line and the bit line in the equal time, thereby being capable of preventing the short-circuiting within the sense amplifier.
摘要:
A delay circuit including a delay section having two or more predetermined delay stages is disclosed. Each predetermined delay stage adds a predetermined delay time to an input signal. The delay circuit also includes selecting switch sections. At least one of the selecting switch sections includes: a buffer section for receiving a delayed input signal from one of the delay stages and a selecting section means directly connected to the buffer section for activating the buffer section to establish a delay path, wherein an output signal from the delay path has a desired delay time.
摘要:
A semiconductor memory device, in which a cell plate potential does not fluctuate even when the device state is changed from a state without stored charge in all charge storage nodes of the cell capacitors at power-on to an access operation state, comprises NMOS transistors M1 to Mk for connecting a line VPR as a feeder for a reference voltage VPR from a reference voltage generation circuit with a line VCP as a feeder for a reference voltage VCP from the reference voltage generation circuit in each of cell blocks B1 to Bk. Gate terminals of the NMOS transistors M1 to Mk are connected to a common signal φCPR. The signal φCPR outputs a positive logical level at a predetermined time after power-on. By providing the NMOS transistors M1 to Mk for short-circuiting the line VPR with the line VCP in each of the cell blocks B1 to Bk, both lines are short-circuited in each of the cell blocks B1 to Bk.