公开(公告)号：US06479788B1

公开(公告)日：2002-11-12

申请号：US09577888

申请日：2000-05-25

申请人： Kunio Arai ,  Hiroshi Aoyama ,  Hideo Ueno

发明人： Kunio Arai ,  Hiroshi Aoyama ,  Hideo Ueno

IPC分类号： B23K2636

CPC分类号： H05K3/0035 ,  B23K26/0622 ,  B23K26/384 ,  B23K26/389

摘要： The invention provides a method and an apparatus of making a hole in a printed circuit board, which improve the quality of a hole shape and the processing speed. In accordance with the invention, a control apparatus controls a laser oscillator and a galvano mirrors so as to form a hole while gradually reducing a pulse width in each step with respect to one hole. As a result of this, no insulating material is left on the bottom portion of the hole, and it is possible to make a hole having an intended shape, particularly, having a desired diameter of the hole bottom.

摘要翻译： 本发明提供一种在印刷电路板上形成孔的方法和装置，其提高了孔形状和加工速度。 根据本发明，控制装置控制激光振荡器和电流镜以形成孔，同时相对于一个孔逐渐减小每个步骤中的脉冲宽度。 其结果是，孔的底部没有绝缘材料残留，并且可以形成具有期望形状的孔，特别是具有所希望的孔底直径的孔。

公开(公告)号：US5066171A

公开(公告)日：1991-11-19

申请号：US324769

申请日：1989-03-17

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： In a method of and an apparatus for drilling a hole in a workpiece, a pressure foot associated with a drill is moved into contact with the workpiece, and a drill bit associated with the drill is moved from a drill-starting position into the workpiece, toward the drill-starting position and again into the workpiece while maintaining the pressure foot in constant contact with the workpiece. The drill is reciprocally fed by a plurality of times under the pressure of the pressure foot acting upon the printed circuit board. In either of the method and the apparatus, a hole with a high aspect ratio can be formed in a workpiece made from a thin, flexible material.

公开(公告)号：US4997319A

公开(公告)日：1991-03-05

申请号：US394659

申请日：1989-08-16

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： An apparatus for drilling a hole in a workpiece such as, for example, a printed circuit board wherein a pressure foot, associated with a drill, is moved into a position to exert a pressure on the workpiece. A drill bit associated with the drill is moved with respect to the workpiece, and an arrangement is provided for controlling the operations of the pressure foot and the drill bit in such a manner so as to move the drill bit from a drill starting position into the workpiece, then toward the drill starting position and again into the workpiece while maintaining the pressure exerted on the workpiece by the pressure foot.

公开(公告)号：US08075788B2

公开(公告)日：2011-12-13

申请号：US11987980

申请日：2007-12-06

申请人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： H05K3/06

CPC分类号： H05K3/465 ,  B23K26/0604 ,  B23K26/0661 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/045 ,  H05K3/107 ,  H05K3/16 ,  H05K3/4661 ,  H05K2201/0166 ,  H05K2201/09563 ,  H05K2203/0557 ,  H05K2203/108 ,  Y10T29/49155

摘要： A printed circuit board fabrication method allows a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board includes steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

摘要翻译： 印刷电路板制造方法可以减少制造时间和制造成本。 印刷电路板的制造方法包括以下步骤：在表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案 内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射 导体图案的部分从绝缘层的表面出来。

公开(公告)号：US20080283491A1

公开(公告)日：2008-11-20

申请号：US11987980

申请日：2007-12-06

申请人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： H01B13/00

CPC分类号： H05K3/465 ,  B23K26/0604 ,  B23K26/0661 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/045 ,  H05K3/107 ,  H05K3/16 ,  H05K3/4661 ,  H05K2201/0166 ,  H05K2201/09563 ,  H05K2203/0557 ,  H05K2203/108 ,  Y10T29/49155

摘要： There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

摘要翻译： 提供了剥离强度大的印刷电路板和允许制造时间和制造成本降低的印刷电路板制造方法和印刷电路板加工装置。 印刷电路板的制造方法包括以下步骤：在其表面由绝缘体制成的印刷电路板的表面上形成抗蚀剂层，形成从抗蚀剂层的表面连接到孔的导体图案 内层和孔以及通过照射激光而不与内层的导体层连接的深度的凹槽，将导电材料填充到孔和凹槽中以形成导体图案并且去除抗蚀剂层以投射 导体图案的部分从绝缘层的表面出来。

公开(公告)号：US4872787A

公开(公告)日：1989-10-10

申请号：US106439

申请日：1987-10-09

申请人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Hiromi Nishiyama ,  Hiroshi Aoyama ,  Yasuhiko Kanaya

IPC分类号： B23B47/18 ,  B23B35/00 ,  B23B41/00 ,  B23B47/22 ,  B26F1/16 ,  H05K3/00

CPC分类号： B23B35/005 ,  H05K3/0047 ,  G05B2219/45129 ,  G05B2219/49047 ,  H05K2203/1536 ,  Y10T408/03 ,  Y10T408/23 ,  Y10T408/5623

摘要： In a method of drilling a printed circuit board according to the present invention, an entry feed rate at which a drill is fed into the printed circuit boards during the initial stage of drilling is made slightly smaller than a drilling feed rate at which the drill is fed while it is drilling a hole through the printed circuit boards, so as to enhance the accuracy at which holes are located. One drilling operation includes a plurality of drilling feeds of the drill, and pulled-out positions of the drill which are reached by the drill between adjacent drilling feed rate are set within a range in which the pressure of a pressure foot is effective. This can prevent the stacked printed circuit boards from shifting and increase the accuracy at which the holes are located.

摘要翻译： 在根据本发明的钻孔印刷电路板的方法中，钻头在初始阶段期间将钻头送入印刷电路板的入料速率略小于钻头的钻孔进给速率 在通过印刷电路板钻孔时进给，以提高孔所在的精度。 一次钻孔操作包括钻头的多个钻孔进给，并且由钻头在相邻的钻井进给速率之间达到的钻头的拉出位置设定在压脚的压力有效的范围内。 这可以防止堆叠的印刷电路板移动并增加孔所在的精度。

公开(公告)号：US20140030417A1

公开(公告)日：2014-01-30

申请号：US14008698

申请日：2012-03-30

申请人： Hiroshi Aoyama ,  Atsunobu Fujii ,  Yuki Kaneko ,  Shin Koike

发明人： Hiroshi Aoyama ,  Atsunobu Fujii ,  Yuki Kaneko ,  Shin Koike

IPC分类号： A23L1/24

CPC分类号： A23L27/63 ,  A23L23/00 ,  A23L27/45

摘要： A tomato ketchup containing the following components (A) to (C): (A) saccharidefrom 12 to 31 mass %, (B) potassiumfrom 0.6 to 1.9 mass %, and (C) sodiumfrom 0.1 to 1.55 mass %.

摘要翻译： 含有以下组分（A）至（C）的番茄酱：（A）12至31质量％的糖，（B）0.6至1.9质量％的钾，和（C）0.1至1.55质量％的钠。

公开(公告)号：US20120129669A1

公开(公告)日：2012-05-24

申请号：US13383778

申请日：2010-02-22

申请人： Hiroshi Aoyama ,  Takahiko Sawada

发明人： Hiroshi Aoyama ,  Takahiko Sawada

IPC分类号： F16C13/00 ,  B32B1/04

CPC分类号： F16C13/006 ,  B29C53/58 ,  B29C63/06 ,  B29C63/10 ,  B29C63/14 ,  B29C70/22 ,  B29C70/222 ,  B29C70/32 ,  B29C70/48 ,  B29C70/86 ,  B29K2311/10 ,  B32B1/08 ,  B32B5/026 ,  B32B5/26 ,  B32B2250/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/062 ,  E06C5/04 ,  F16C2350/00 ,  Y10T428/31515

摘要： A composite material roller that itself rotates comprises a cylindrical laminate 1 of fiber-knitted cloths 2 impregnated with resin; and a sheet 4, formed of a fiber different from that of the laminate 1, for covering the rotary surface of the laminate 1. The longitudinal elastic modulus of the fiber in the cloths 2 is made lower than that of the resin in the cloths 2. Also, the rigidity of the fiber in the cloths 2 is made lower than that of the resin in cloths 2. The above configuration reduces the contract pressure between the composite material roller and a structure on which the roller slides.

摘要翻译： 本身旋转的复合材料辊包括用树脂浸渍的纤维编织布2的圆柱形层压体1; 以及由不同于层压体1的纤维形成的用于覆盖层压体1的旋转表面的片材4.布2中的纤维的纵向弹性模量比布2中的树脂的纵向弹性模量低 此外，布2中的纤维的刚性比布2中的树脂低。上述构造降低了复合材料辊与辊滑动的结构之间的收缩压力。

公开(公告)号：US20110228537A1

公开(公告)日：2011-09-22

申请号：US13049089

申请日：2011-03-16

申请人： Keiko YOSHIMIZU ,  Hiroshi Aoyama ,  Shigenobu Maruyama ,  Yasuhiro Yoshitake

发明人： Keiko YOSHIMIZU ,  Hiroshi Aoyama ,  Shigenobu Maruyama ,  Yasuhiro Yoshitake

IPC分类号： F21V5/04

CPC分类号： G02B27/0955

摘要： An adjustable beam size illumination optical apparatus includes a beam size adjusting optical system which includes groups of cylindrical array lenses disposed correspondingly to the long and short axis directions respectively and having variable intervals among the lenses, and a group of cylindrical telescope lenses disposed correspondingly to one of the long and short axis directions and having variable intervals among the lenses, and adjusts parallel light from a light source in size in accordance with the two axis directions orthogonal to each other. The lens interval of one of the cylindrical array lens groups and the cylindrical telescope lens group is changed to adjust a beam size on a projection surface in accordance with the long axis direction or the short axis direction. Thus, it is possible to adjust the beam size in accordance with the long axis direction and the short axis direction individually, and it is possible to make irradiation with the beam with uniform intensity.

摘要翻译： 可调光束尺寸照明光学装置包括光束尺寸调整光学系统，该光束尺寸调整光学系统包括分别对应于长轴和短轴方向设置的圆柱形阵列透镜组，并且在透镜之间具有可变的间隔，以及一组圆柱形望远镜，其对应于一个 并且在透镜中具有可变的间隔，并且根据彼此正交的两个轴方向来调整来自光源的尺寸的平行光。 根据长轴方向或短轴方向，改变圆柱形阵列透镜组和圆柱形望远镜透镜组中的一个的透镜间隔，以调整投影表面上的光束尺寸。 因此，可以分别根据长轴方向和短轴方向调整光束尺寸，并且可以以均匀的强度对光束进行照射。

公开(公告)号：US07619003B2

公开(公告)日：2009-11-17

申请号：US10546858

申请日：2004-01-28

申请人： Makoto Tokunaga ,  Yasushi Tsuji ,  Yasushi Obora ,  Yoji Hori ,  Hiroshi Aoyama

发明人： Makoto Tokunaga ,  Yasushi Tsuji ,  Yasushi Obora ,  Yoji Hori ,  Hiroshi Aoyama

IPC分类号： A61K31/045 ,  A61K31/19

CPC分类号： C07C29/10 ,  B01J31/182 ,  B01J31/189 ,  B01J31/2243 ,  B01J31/2409 ,  B01J2531/0241 ,  B01J2531/0252 ,  B01J2531/0266 ,  B01J2531/28 ,  B01J2531/824 ,  B01J2531/828 ,  B01J2531/845 ,  C07B53/00 ,  C07C35/08 ,  C07C35/12 ,  C07C35/30

摘要： A process for producing an optically active compound based on the hydrolysis of an alkenyl ester compound or the cleavage of an alkenyl ether compound. The process uses neither an acidic compound nor a basic compound, and reactants can be reacted in a high concentration. It does not necessitate a buffer, nutrient, etc. unlike enzymatic reactions or reactions using a microorganism. It is a simple process which attains a satisfactory production efficiency. The process, which is for producing an optically active carboxylic acid or optically active alcohol represented by the general formula (VI): (wherein R1, R2, and R3 are different groups; and A represents methylene, carbonyl, or a single bond), is characterized by causing water to act on an alkenyl ester or alkenyl ether represented by the general formula (I): (wherein R4, R5, and R6 each represents hydrogen, alkyl, etc.) in the presence of a specific transition metal complex having an optically active ligand.

摘要翻译： 基于链烯基酯化合物的水解或烯基醚化合物的裂解来制造光学活性化合物的方法。 该方法既不使用酸性化合物也不使用碱性化合物，并且反应物可以高浓度反应。 与使用微生物的酶反应或反应不同，不需要缓冲液，营养物等。 这是一个达到令人满意的生产效率的简单过程。 该方法用于制备由通式（VI）表示的光学活性羧酸或光学活性醇：（其中R 1，R 2和R 3是不同基团; A代表亚甲基，羰基或单键）， 其特征在于使水作用于由通式（I）表示的烯基酯或链烯基醚：（其中R 4，R 5和R 6各自表示氢，烷基等），在具有 光学活性配体。