公开(公告)号：US20140186607A1

公开(公告)日：2014-07-03

申请号：US14148886

申请日：2014-01-07

申请人： Kyoung Tae WI ,  Jae Won CHOI ,  Sung Min KIM ,  Jin Man KIM ,  Hye Jin KIM ,  Jun Woo LEE

发明人： Kyoung Tae WI ,  Jae Won CHOI ,  Sung Min KIM ,  Jin Man KIM ,  Hye Jin KIM ,  Jun Woo LEE

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08G59/3209 ,  C08G59/50 ,  C08G59/621 ,  C08G59/688 ,  Y10T428/31515

摘要： An adhesive film, an adhesive composition, and a semiconductor device wherein, in the adhesive film, a difference between a storage modulus (A) of the adhesive film after 4 cycles and a storage modulus (B) of the adhesive film after 1 cycle is about 3×106 dyne/cm2 or less, the storage modulus (A) of the adhesive film after 4 cycles is about 7×106 dyne/cm2 or less, and the storage modulus (B) of the adhesive film after 1 cycle is about 2×106 dyne/cm2 or more, when curing at 125° C. for 1 hour and then at 150° C. for 10 minutes is defined as 1 cycle.

摘要翻译： 粘合剂膜，粘合剂组合物和半导体器件，其中在粘合剂膜中，4个循环之后的粘合剂膜的储能模量（A）与1个循环后的粘合剂膜的储能模量（B）之间的差为 约3×10 6达因/ cm 2以下，4次循环后的粘合膜的储能模量（A）约为7×10 6达因/ cm 2以下，1次循环后的粘合膜的储能模量（B）约为 2×10 6达因/ cm 2以上，当在125℃下固化1小时，然后在150℃下固化10分钟时，定义为1个循环。

公开(公告)号：US20130154125A1

公开(公告)日：2013-06-20

申请号：US13713679

申请日：2012-12-13

申请人： Hye Jin KIM ,  Jae Won CHOI ,  Ji Ho KIM ,  Jin Man KIM ,  Gyu Seok SONG

发明人： Hye Jin KIM ,  Jae Won CHOI ,  Ji Ho KIM ,  Jin Man KIM ,  Gyu Seok SONG

IPC分类号： C09J163/00 ,  H01L23/00

CPC分类号： C09J163/00 ,  C08G59/504 ,  C08G59/56 ,  C08G59/621 ,  H01L24/29 ,  H01L24/32 ,  H01L24/50 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00

摘要： An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.

摘要翻译： 粘合剂膜包括胺固化剂和酚类固化剂，并且在固化后在170℃下在80℃以上固化后的储能模量与在40℃下的储能模量之比在约1.5的范围内 至约3.0。

公开(公告)号：US20140306357A1

公开(公告)日：2014-10-16

申请号：US14315495

申请日：2014-06-26

申请人： Baek Soung PARK ,  Jae Won CHOI ,  Sung Min KIM ,  In Hwan KIM ,  Jun Woo LEE ,  Su MI IM

发明人： Baek Soung PARK ,  Jae Won CHOI ,  Sung Min KIM ,  In Hwan KIM ,  Jun Woo LEE ,  Su MI IM

IPC分类号： H01L23/544 ,  H01L21/70

CPC分类号： H01L23/544 ,  C09J7/20 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L21/70 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2224/83191

摘要： A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.

摘要翻译： 一种切割芯片接合薄膜和一种在切割芯片接合薄膜中形成凹槽的方法，该薄膜包括一个基膜; 叠层在基膜上的压敏粘合剂层; 以及层叠在所述粘合剂层上的接合层，其中，所述压敏粘合剂层包括与所述接合层重叠的第一区域和与所述接合层不重叠的第二区域，所述第二区域包括与所述接合层相邻的第三区域 所述第一区域和与所述第三区域相邻并且在其中形成有凹槽的第四区域。

公开(公告)号：US20140194555A1

公开(公告)日：2014-07-10

申请号：US14204128

申请日：2014-03-11

申请人： Jun Woo LEE ,  Sung Min KIM ,  In Hwan KIM ,  Baek Soung PARK ,  Su Mi LIM ,  Jae Won CHOI

发明人： Jun Woo LEE ,  Sung Min KIM ,  In Hwan KIM ,  Baek Soung PARK ,  Su Mi LIM ,  Jae Won CHOI

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08K5/0025 ,  C08K5/3445 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/05442 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.

摘要翻译： 一种用于半导体的粘合剂组合物，粘合剂膜和半导体器件，其中在包括在120℃至130℃的温度下进行1至20分钟的第一阶段的固化过程中，第二阶段在 温度范围为140℃至150℃，持续1至10分钟，第三阶段在160℃至180℃的温度下进行30秒至10分钟，第四阶段在温度范围 从160℃至180℃进行10分钟〜2小时，粘合膜的第一阶段的DSC固化速度为总固化速度的40％以下，第四阶段的DSC固化速度为 比第三阶段的DSC固化速度高30〜60％，第二阶段和第三阶段的DSC固化速度比前一阶段的DSC固化速度高5％以上。

公开(公告)号：US20130165603A1

公开(公告)日：2013-06-27

申请号：US13727107

申请日：2012-12-26

申请人： Kyoung Tae WI ,  Sang Jin KIM ,  Cheol Su KIM ,  Seung Yong YANG ,  Jae Won CHOI

发明人： Kyoung Tae WI ,  Sang Jin KIM ,  Cheol Su KIM ,  Seung Yong YANG ,  Jae Won CHOI

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08G59/50 ,  C08G59/621 ,  C08K5/0025 ,  C08K5/18 ,  C08L61/06 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/22 ,  C09J2461/00 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/0665 ,  H01L2924/00014

摘要： An adhesive film has a die-shear strength of 4 kgf or more/5 mm×5 mm chip, upon chip bonding at 120° C. for 5 seconds, and a storage modulus of 2×106 dyne/cm2 or more at 150° C. after curing at 150° C. for 20 minutes.

摘要翻译： 粘合膜的芯片剪切强度为4kgf以上/ 5mm×5mm的芯片，在120℃下芯片接合5秒，在150℃下的储能模量为2×106达因/ cm 2以上 C.在150℃下固化20分钟。

公开(公告)号：US20130143363A1

公开(公告)日：2013-06-06

申请号：US13705594

申请日：2012-12-05

申请人： Sang Jin KIM ,  Kyoung Tae WI ,  Jae Won CHOI ,  Sang Kyun KIM ,  Cheol Su KIM

发明人： Sang Jin KIM ,  Kyoung Tae WI ,  Jae Won CHOI ,  Sang Kyun KIM ,  Cheol Su KIM

IPC分类号： C08L63/00 ,  H01L21/56

CPC分类号： C08L63/00 ,  C08G59/5033 ,  C08G59/56 ,  C08G59/621 ,  C09J163/00 ,  H01L21/56 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An adhesive film for a semiconductor may include about 60 wt % to about 80 wt % of a thermoplastic resin based on a total solid content of the adhesive film, a phenolic curing agent, and an amine curing agent, and the adhesive film may have a storage modulus of about 2 MPa or more and a reaction curing rate of about 50% or more when cured at 150° C. for 20 minutes.

摘要翻译： 用于半导体的粘合膜可以包括基于粘合剂膜，酚类固化剂和胺固化剂的总固体含量的约60重量％至约80重量％的热塑性树脂，并且粘合剂膜可以具有 储存模量为约2MPa以上，当在150℃下固化20分钟时的反应固化速度为约50％以上。

公开(公告)号：US20110159284A1

公开(公告)日：2011-06-30

申请号：US12970004

申请日：2010-12-16

申请人： Jae Won CHOI ,  Jin Man Kim ,  Ki Tae Song

发明人： Jae Won CHOI ,  Jin Man Kim ,  Ki Tae Song

IPC分类号： C09J163/00 ,  C09J163/02 ,  C09J163/04 ,  B32B27/38

CPC分类号： C08G59/38 ,  C08L21/00 ,  C08L63/00 ,  C08L63/04 ,  C08L2205/02 ,  C09J163/00 ,  Y10T428/287

摘要： An adhesive composition for a semiconductor device and a die attach film for a semiconductor device, the adhesive composition including about 50 to about 80 parts by weight of an elastomeric resin; about 10 to about 20 parts by weight of an epoxy resin, the epoxy resin including a difunctional epoxy resin and polyfunctional epoxy resins and the difunctional epoxy resin being present in an amount of about 20 to about 60 parts by weight with respect to 100 parts by weight of the epoxy resin; about 1 to about 10 parts by weight of a curable resin; about 0.01 to about 10 parts by weight of a curing accelerator; about 0.01 to about 10 parts by weight of a silane coupling agent; and about 5 to about 10 parts by weight of a filler.

摘要翻译： 用于半导体器件的粘合剂组合物和用于半导体器件的芯片附着膜，所述粘合剂组合物包含约50至约80重量份的弹性体树脂; 约10至约20重量份的环氧树脂，环氧树脂包括双官能环氧树脂和多官能环氧树脂，双官能环氧树脂以相对于100份的约20至约60重量份的量存在 环氧树脂的重量; 约1至约10重量份的可固化树脂; 约0.01至约10重量份的固化促进剂; 约0.01至约10重量份的硅烷偶联剂; 和约5至约10重量份的填料。

公开(公告)号：US20190200779A1

公开(公告)日：2019-07-04

申请号：US16330064

申请日：2017-07-26

申请人： Jae Won CHOI

发明人： Jae Won CHOI

IPC分类号： A47D9/00 ,  A47D15/00

CPC分类号： A47D9/00 ,  A47D7/00 ,  A47D15/00 ,  A47D15/008

摘要： The preset invention proposes an infant bed having a sudden death prevention function, comprising: a bed body having a grating structure capable of ventilation; a mattress body comprising an air layer having excellent air permeability; and a bed body support stand having an air layer formed beneath the bed body such that air can flow through the bottom thereof, wherein air can still flow even when an infant who has been sleeping with the back down in a supine position turns the body into a prone position with the nose down, thereby fundamentally preventing sudden infant death due to suffocation.

公开(公告)号：US20140353848A1

公开(公告)日：2014-12-04

申请号：US14202006

申请日：2014-03-10

申请人： Baek Soung PARK ,  Jae Won CHOI ,  In Hwan KIM ,  Gyu Seok SONG ,  Su Mi LIM

发明人： Baek Soung PARK ,  Jae Won CHOI ,  In Hwan KIM ,  Gyu Seok SONG ,  Su Mi LIM

IPC分类号： H01L23/373 ,  H01L21/48

CPC分类号： H01L23/3737 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/36 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01049 ,  H01L2924/01004 ,  H01L2924/00012

摘要： A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mm2 or greater.

摘要翻译： 散热粘合膜，包含该半导体装置的半导体装置以及制造该半导体装置的方法，散热粘合剂膜可放置在其中包围半导体元件的保护层与保护层上的散热金属层之间 散热金属层的保护层，其中散热粘合剂膜和保护层之间的粘合强度以及散热粘合剂膜和散热金属层之间的粘合强度分别为约3kgf / 25mm 2或更大 。

公开(公告)号：US20110193415A1

公开(公告)日：2011-08-11

申请号：US12757490

申请日：2010-04-09

申请人： Jae Won CHOI ,  Chul Hun SEO ,  Chong Min LEE ,  Du Won JUNG ,  Yang Hyun KIM ,  Ju Eung KIM ,  Kwang Du LEE ,  Jung Ho YOON ,  Jeong Hoon KIM ,  Sang Hoon HWANG ,  Chul Gyun PARK ,  Jung Aun LEE

发明人： Jae Won CHOI ,  Chul Hun SEO ,  Chong Min LEE ,  Du Won JUNG ,  Yang Hyun KIM ,  Ju Eung KIM ,  Kwang Du LEE ,  Jung Ho YOON ,  Jeong Hoon KIM ,  Sang Hoon HWANG ,  Chul Gyun PARK ,  Jung Aun LEE

IPC分类号： H01F38/14

CPC分类号： H02J50/12 ,  H02J5/005 ,  H04B5/0037 ,  H04B5/0093

摘要： Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency.

摘要翻译： 公开了一种无线能量传输结构，其包括：盘部，包括彼此间隔开的第一导体板和第二导体板，以及插入在第一导体板和第二导体板之间的电介质材料，并且产生电场 在第一导体板和第二导体板之间; 以及环形线部分，其一端连接到第一导体板，另一端连接到第二导体板，并且具有多个元胞重复排列的元结构，以便 利用电场引起磁场，使得无线能量传输结构的尺寸减小，传输距离和传输效率得到提高。