Angled transducer-dual head bonder for optimum ultrasonic power
application and flexibility for tight pitch leadframe
    3.
    发明授权
    Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe 有权
    角度传感器 - 双头焊接机,适用于最佳的超声波功率应用和灵活性,适用于紧密俯仰引线框架

    公开(公告)号:US6112973A

    公开(公告)日:2000-09-05

    申请号:US178843

    申请日:1998-10-26

    摘要: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. A second capillary is provided for forming a stitch bond to the second bonding location, the second capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal to the predetermined direction and substantially parallel to the plane of the conveying surface and a stitch bond is formed on the second bonding location with the second capillary. The second capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. The first and second capillaries are disposed at an angle of about 90 degrees with respect to each other with respect to each other in a direction normal to said plane.

    摘要翻译: 一种在半导体器件中的至少一对接合位置和接合器之间接合引线的方法。 输送机具有输送表面,用于沿预定方向输送具有第一和第二粘合位置的部分制造的半导体器件。 第一毛细管被提供用于形成与第一接合位置的针脚接合,第一毛细管以相对于预定方向约45度的角度设置,并且与其垂直并且基本上平行于输送表面的平面设置。 在与第一毛细管的第一结合位置处形成针迹结合。 第一毛细管相对于与输送表面的平面垂直的线呈大致45度的角度。 提供第二毛细管用于形成与第二接合位置的针脚接合,第二毛细管相对于预定方向以大约45度的角度设置,以及垂直于预定方向的线并且基本上平行于 在第二接合位置与第二毛细管形成传送表面和针脚接合。 第二毛细管相对于垂直于输送表面平面的线呈大致45度的角度。 第一和第二毛细管以垂直于所述平面的方向相对于彼此以大约90度的角度设置。

    Undercut process with isotropic plasma etching at package level
    5.
    发明授权
    Undercut process with isotropic plasma etching at package level 失效
    底切工艺采用各向同性等离子体蚀刻封装级

    公开(公告)号:US06686291B1

    公开(公告)日:2004-02-03

    申请号:US08859407

    申请日:1997-05-20

    IPC分类号: H01L7120

    摘要: A method (30) of fabricating a micromechanical device (10) by performing spacer layer undercutting (46) and passivation at the package level. A back-end assembly process utilizes a full-cut saw process to separate the partially fabricated micromechanical devices. The individual die are then attached by pick and place equipment to a lead frame and are wire bonded, before the die are undercut. This technique avoids the generation of any particles from becoming lodged under movable structure during the cut process, and further, reduces the susceptibility of the die to damage or particles generated during the pick and place process.

    摘要翻译: 一种通过执行间隔层底切(46)和在封装级别的钝化来制造微机械器件(10)的方法(30)。 后端组装工艺利用全切锯工艺来分离部分制造的微机械装置。 然后将单独的模具通过拾取和放置设备连接到引线框架并且在芯片被切削之前被引线接合。 这种技术避免了在切割过程中任何颗粒产生不可移动的结构,并且进一步降低了模具在拾取和放置过程中产生的损坏或颗粒的敏感性。

    Heat dissipating flip-chip ball grid array
    6.
    发明授权
    Heat dissipating flip-chip ball grid array 有权
    散热倒装球形网格阵列

    公开(公告)号:US06657311B1

    公开(公告)日:2003-12-02

    申请号:US10147094

    申请日:2002-05-16

    IPC分类号: H01L720

    摘要: A heat dissipating flip-chip Ball Grid Array (BGA) (10) including a substrate (12), a die (14), a first set of solder balls (16) coupling the die with the substrate, a thermal compound (20) attached to a backside of the die, a second set of solder balls (28) attached to the substrate, and a printed circuit board (22) that includes a heat dissipating metal (24). The heat dissipating metal is in contact with the thermal compound, and the second set of solder balls is connected to thermal vias in the printed circuit board.

    摘要翻译: 一种散热倒装芯片球栅阵列(BGA)(10),包括基板(12),模具(14),将管芯与基板耦合的第一组焊球(16),热化合物(20) 附接到模具的背面,附接到基板的第二组焊球(28)和包括散热金属(24)的印刷电路板(22)。 散热金属与热化合物接触,第二组焊球与印刷电路板中的热通孔连接。

    Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe
    7.
    发明授权
    Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframe 有权
    角度传感器 - 双头焊接机,适用于最佳的超声波功率应用和灵活性,适用于紧密俯仰的引线框架

    公开(公告)号:US06182882B2

    公开(公告)日:2001-02-06

    申请号:US09542005

    申请日:2000-04-03

    IPC分类号: B23K100

    摘要: A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. A second capillary is provided for forming a stitch bond to the second bonding location, the second capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal to the predetermined direction and substantially parallel to the plane of the conveying surface and a stitch bond is formed on the second bonding location with the second capillary. The second capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. The first and second capillaries are disposed at an angle of about 90 degrees with respect to each other with respect to each other in a direction normal to said plane.

    摘要翻译: 一种在半导体器件中的至少一对接合位置和接合器之间接合引线的方法。 输送机具有输送表面,用于沿预定方向输送具有第一和第二粘合位置的部分制造的半导体器件。 第一毛细管被提供用于形成与第一接合位置的针脚接合,第一毛细管以相对于预定方向约45度的角度设置,并且与其垂直并且基本上平行于输送表面的平面设置。 在与第一毛细管的第一结合位置处形成针迹结合。 第一毛细管相对于与输送表面的平面垂直的线呈大致45度的角度。 提供第二毛细管用于形成与第二接合位置的针脚接合,第二毛细管相对于预定方向以大约45度的角度设置,以及垂直于预定方向的线并且基本上平行于 在第二接合位置与第二毛细管形成传送表面和针脚接合。 第二毛细管相对于垂直于输送表面平面的线呈大致45度的角度。 第一和第二毛细管以垂直于所述平面的方向相对于彼此以大约90度的角度设置。

    Balancing of x and y axis bonding by 45 degree capillary positioning

    公开(公告)号:US6131792A

    公开(公告)日:2000-10-17

    申请号:US517512

    申请日:2000-03-02

    摘要: A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions. Then the first bonding head is caused to make wire bonds in a predetermined one of the plurality of regions and the second bonding head is caused to make wire bonds in a predetermined second one of the plurality of regions. The first major axis is preferably at an angle of about 45 degrees with respect to the first predetermined direction and the second major axis is preferably at an angle of about 45 degrees with respect to the second predetermined direction. The first predetermined direction is preferably substantially normal to the second predetermined direction.

    Balancing of x and y axis bonding by 45 degree capillary positioning
    10.
    发明授权
    Balancing of x and y axis bonding by 45 degree capillary positioning 有权
    通过45度毛细管定位平衡x和y轴接合

    公开(公告)号:US6089443A

    公开(公告)日:2000-07-18

    申请号:US178820

    申请日:1998-10-26

    IPC分类号: B23K20/00 B23K31/02 B23K37/04

    摘要: A method of bonding wire and the bonder which includes providing a wire bonder for bonding wire to a bonding location. The wire bonder has a first bonding head designed to form a stitch bond while travelling in a first predetermined direction, the first bonding head having a first major axis and a first minor axis normal to the first major axis, the first major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the first predetermined direction and a second bonding head designed to form a stitch bond while travelling in a second predetermined direction, the second bonding head having a second major axis and a second minor axis normal to the second major axis, the second major axis being at an angle of from about 45 degrees to a finite angle greater than zero relative to the second predetermined direction. An area having bonding locations to which the bonder is to make wire bonds is divided into a plurality of regions. Then the first bonding head is caused to make wire bonds in a predetermined one of the plurality of regions and the second bonding head is caused to make wire bonds in a predetermined second one of the plurality of regions. The first major axis is preferably at an angle of about 45 degrees with respect to the first predetermined direction and the second major axis is preferably at an angle of about 45 degrees with respect to the second predetermined direction. The first predetermined direction is preferably substantially normal to the second predetermined direction.

    摘要翻译: 一种接合线和接合器的方法,包括提供用于将线接合到接合位置的引线接合器。 引线接合器具有设计成在沿第一预定方向行进时形成线圈接合的第一接合头,第一接合头具有垂直于第一长轴的第一长轴和第一短轴,第一长轴为 角度约为45度至相对于第一预定方向大于零的有限角度;以及第二接合头,设计成在沿第二预定方向行进时形成线迹接合,所述第二接合头具有第二长轴和第二长轴 与第二长轴垂直的短轴,第二长轴相对于第二预定方向成大于零的角度约为45度。 具有接合位置的接合位置的区域被划分为多个区域。 然后使第一接合头在多个区域中的预定的一个区域中引线接合,并且使第二接合头在多个区域中的预定的第二个区域中引线接合。 第一长轴优选地相对于第一预定方向成大约45度的角度,并且第二长轴优选地相对于第二预定方向成大约45度的角度。 优选地,第一预定方向基本上垂直于第二预定方向。