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    Heat dissipating semiconductor package
    1.
    发明申请
    Heat dissipating semiconductor package 审中-公开
    散热半导体封装

    公开(公告)号：US20080164604A1

    公开(公告)日：2008-07-10

    申请号：US12008202

    申请日：2008-01-08

    申请人： Liang-Yi Hung ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    发明人： Liang-Yi Hung ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3675 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

    摘要： A heat dissipating semiconductor package is disclosed, including a chip carrier; at least a semiconductor chip mounted and electrically connected to the chip carrier; and a heat dissipating member mounted on the semiconductor chip with a thermal interface material (TIM) interposed therebetween, wherein the TIM is provided with a plurality of fillers for supporting the TIM at an appropriate height, thereby preventing the TIM from being wetted so as to avoid collapsing and overflow of the TIM as a result of wetting problem.

    摘要翻译： 公开了一种散热半导体封装，包括芯片载体; 至少安装并电连接到所述芯片载体的半导体芯片; 以及安装在半导体芯片上的散热构件，其间插入有热界面材料（TIM），其中所述TIM具有多个用于将TIM支撑在适当高度的填充物，从而防止TIM被润湿，从而 避免由于润湿问题导致TIM的崩溃和溢出。

    Semiconductor device and fabrication method thereof
    3.
    发明申请
    Semiconductor device and fabrication method thereof 审中-公开
    半导体器件及其制造方法

    公开(公告)号：US20070164386A1

    公开(公告)日：2007-07-19

    申请号：US11648045

    申请日：2006-12-28

    申请人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    发明人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

    IPC分类号： H01L31/0203 ,  H01L21/56

    CPC分类号： H01L27/14687 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/85 ,  H01L2924/00014

    摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.

    摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。

    Semiconductor package substrate
    9.
    发明授权
    Semiconductor package substrate 有权
    半导体封装基板

    公开(公告)号：US07732913B2

    公开(公告)日：2010-06-08

    申请号：US11701767

    申请日：2007-02-02

    申请人： Tsung-Tien Hsieh ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

    发明人： Tsung-Tien Hsieh ,  Wen-Jung Chiang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao ,  Sen-Yen Yang

    IPC分类号： H01L23/04

    CPC分类号： H01L23/49827 ,  H01L23/64 ,  H01L2223/6638 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/114 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09636 ,  H05K2201/09718 ,  H01L2924/00

    摘要： A semiconductor package substrate is provided, which includes a substrate body having a plurality of conductive through holes formed therein, wherein at least two adjacent conductive through holes are formed as a differential pair, each of which has a ball pad formed at an end thereof; and at least one electrically integrated layer formed in the substrate body, and having an opening corresponding to the two adjacent conductive through holes formed as the differential pair and the ball pads thereof. Thus, the spacing between the conductive through holes and the electrically integrated layer and the spacing between the ball pads can be enlarged by the opening, so as to balance the impedance match.

    摘要翻译： 提供了一种半导体封装基板，其包括其中形成有多个导电通孔的基板主体，其中至少两个相邻的导电通孔形成为差分对，每个导体通孔在其一端形成有球垫; 以及形成在所述基板主体中的至少一个电气集成层，并且具有与形成为所述差动对的两个相邻的导电通孔对应的开口及其球垫。 因此，可以通过开口来扩大导电通孔和电气集成层之间的间隔以及球垫之间的间隔，从而平衡阻抗匹配。