Integrated circuit planarization method
    1.
    发明授权
    Integrated circuit planarization method 有权
    集成电路平面化方法

    公开(公告)号:US06372648B1

    公开(公告)日:2002-04-16

    申请号:US09442181

    申请日:1999-11-16

    IPC分类号: H01L21302

    摘要: Chemical mechanical polishing slurry with functionalized silica abrasive particles, the functionalization permits high pH slurry without rapid degradation of silica particles and also permits the modification of surface properties of abrasive particles to modify slurry behavior. One example of modified behavior would be to enhance selectivity by controlling particle interaction with different surfaces on the wafer.

    摘要翻译: 具有功能化二氧化硅磨料颗粒的化学机械抛光浆料,功能化允许高pH浆料,而不会快速降解二氧化硅颗粒,并且还允许改变磨料颗粒的表面性质以改变浆料性能。 改进行为的一个例子是通过控制与晶片上的不同表面的颗粒相互作用来提高选择性。

    Piranha etch preparation having long shelf life and method of making same
    4.
    发明授权
    Piranha etch preparation having long shelf life and method of making same 失效
    具有长保质期的食人鱼蚀刻制剂及其制备方法

    公开(公告)号:US06294145B1

    公开(公告)日:2001-09-25

    申请号:US08336352

    申请日:1994-11-08

    IPC分类号: C01B508

    CPC分类号: C01B15/08

    摘要: A method of formulating a strong oxidizing solution comprising formulating a strong oxidizing solution having from about 2 to about 5 percent PDSA with concentrated sulfuric acid in the ratio of from about 1:8 to about 1:20 parts by volume and storing the strong oxidizing solution in a container having a space over the solution containing one of a vacuum or a non-oxidizing atmosphere inert to the oxidizing solution. The amount of PDSA is preferably about 4 percent by volume and the ratio is preferably about 1:10 parts by volume. The space over the strong oxidizing solution is preferably a vacuum or substantially all nitrogen. Hydrogen peroxide can be substituted for the PDSA in which case the method comprises formulating a strong oxidizing solution having from about 40 to about 60 percent hydrogen peroxide with concentrated sulfuric acid in the ratio of from about 1:8 to about 1:20 parts by volume and storing the strong oxidizing solution in a container having a space over the solution containing one of a vacuum or a non-oxidizing atmosphere inert to the oxidizing solution.

    摘要翻译: 一种配制强氧化溶液的方法,其包括以约1:8至约1:20体积份的比例配制具有约2至约5%PDSA的强氧化性溶液,浓硫酸存储强氧化溶液 在具有在氧化溶液惰性的真空或非氧化性气氛中的溶液的空间之上的容器中。 PDSA的量优选为约4体积%,并且该比例优选为约1:10体积份。 强氧化溶液之间的空间优选为真空或基本上全部为氮。 过氧化氢可以代替PDSA,在这种情况下,该方法包括配制具有约40至约60%过氧化氢的强氧化溶液,浓硫酸的比例约为1:8至约1:20体积份 并将强氧化溶液储存在具有空间的容器中,所述容器中含有对氧化溶液呈惰性的真空或非氧化性气氛之一的溶液。

    Recessed drain extensions in transistor device
    7.
    发明授权
    Recessed drain extensions in transistor device 有权
    晶体管器件中的凹槽漏极延伸

    公开(公告)号:US07517779B2

    公开(公告)日:2009-04-14

    申请号:US11772508

    申请日:2007-07-02

    申请人: Lindsey H. Hall

    发明人: Lindsey H. Hall

    IPC分类号: H01L21/3205 H01L21/4763

    摘要: A method of forming an integrated circuit transistor (50). The method provides a first semiconductor region (52) and forms (110) a gate structure (54x) in a fixed position relative to the first semiconductor region. The gate structure has a first sidewall and a second sidewall (59x). The method also forms at least a first layer (58x, 60x) adjacent the first sidewall and the second sidewall. The method also forms (120) at least one recess (62x) in the first semiconductor region and extending laterally outward from the gate structure. Additional steps in the method are first, oxidizing (130) the at least one recess such that an oxidized material is formed therein, second, stripping (140) at least a portion of the oxidized material, and third, forming (160) a second semiconductor region (66x) in the at least one recess.

    摘要翻译: 一种形成集成电路晶体管(50)的方法。 该方法提供第一半导体区域(52)并且形成(110)相对于第一半导体区域处于固定位置的栅极结构(54x)。 栅极结构具有第一侧壁和第二侧壁(59x)。 该方法还形成与第一侧壁和第二侧壁相邻的至少第一层(58x,60x)。 该方法还在第一半导体区域中形成(120)至少一个凹部(62x)并且从栅极结构横向向外延伸。 该方法中的附加步骤首先是氧化(130)所述至少一个凹部,使得在其中形成氧化材料,其次,剥离(140)所述氧化材料的至少一部分,以及第三,形成(160)第二 半导体区域(66x)。

    Method for manufacturing a semiconductor device containing metal silicide regions
    8.
    发明授权
    Method for manufacturing a semiconductor device containing metal silicide regions 有权
    制造含有金属硅化物区域的半导体器件的方法

    公开(公告)号:US07422967B2

    公开(公告)日:2008-09-09

    申请号:US11127669

    申请日:2005-05-12

    IPC分类号: H01L21/3205

    摘要: The present invention provides a method for manufacturing a semiconductor device. In one embodiment of the present invention, without limitation, the method for manufacturing the semiconductor device includes forming a gate structure (120) over a substrate (110) and forming source/drain regions (190) in the substrate (110) proximate the gate structure (120). The method further includes forming fluorine containing regions (220) in the source/drain regions (190) employing a fluorine containing plasma using a power level of less than about 75 Watts, forming a metal layer (310) over the substrate (110) and fluorine containing regions (220), and reacting the metal layer (310) with the fluorine containing regions (220) to form metal silicide regions (410) in the source/drain regions (190).

    摘要翻译: 本发明提供一种制造半导体器件的方法。 在本发明的一个实施例中,但不限于,用于制造半导体器件的方法包括在衬底(110)上形成栅极结构(120)并且在靠近栅极的衬底(110)中形成源/漏区(190) 结构(120)。 该方法还包括在源极/漏极区(190)中使用含氟等离子体,使用小于约75瓦特的功率电平形成含氟区域(220),在基底(110)上形成金属层(310),以及 含氟区域(220),并且使金属层(310)与含氟区域(220)反应以在源极/漏极区域(190)中形成金属硅化物区域(410)。

    Apparatus and method for detecting impurities in wet chemicals
    9.
    发明授权
    Apparatus and method for detecting impurities in wet chemicals 失效
    用于检测湿化学品中杂质的装置和方法

    公开(公告)号:US6145372A

    公开(公告)日:2000-11-14

    申请号:US069908

    申请日:1998-04-30

    CPC分类号: G01N27/4166 G01N2033/0095

    摘要: A apparatus and method for monitoring impurities in wet chemicals in semiconductor wafer processing comprising a silicon sensor (12) that is electrically connected to a potentiometer (22), a reference electrode (14) electrically connected to the potentiometer (22), wherein a comparison in the potential between the silicon sensor (12) and the reference electrode (14) to a predetermined baseline is used to measure wet chemical impurities, is disclosed.

    摘要翻译: 一种用于监测半导体晶片处理中的湿化学品中的杂质的装置和方法,包括电连接到电位器(22)的硅传感器(12),与电位计(22)电连接的参考电极(14),其中比较 在硅传感器(12)和参考电极(14)之间的电位达到预定的基线用于测量湿化学杂质。

    METHOD TO IMPROVE SEMICONDUCTOR SURFACES AND POLISHING
    10.
    发明申请
    METHOD TO IMPROVE SEMICONDUCTOR SURFACES AND POLISHING 有权
    改善半导体表面和抛光的方法

    公开(公告)号:US20140073131A1

    公开(公告)日:2014-03-13

    申请号:US13609292

    申请日:2012-09-11

    IPC分类号: H01L21/768

    摘要: A method of forming a semiconductor device is disclosed. The method including providing a substrate with at least one insulating layer disposed thereon, the at least one insulating layer including a trench; forming at least one liner layer on the at least one insulating layer; forming a nucleation layer on the at least one liner layer; forming a first metal film on a surface of the nucleation layer; etching the first metal film; and depositing a second metal film on the etched surface of the first metal film, the second metal film substantially forming an overburden above the trench.

    摘要翻译: 公开了一种形成半导体器件的方法。 所述方法包括提供其上设置有至少一个绝缘层的衬底,所述至少一个绝缘层包括沟槽; 在所述至少一个绝缘层上形成至少一个衬垫层; 在所述至少一个衬垫层上形成成核层; 在成核层的表面上形成第一金属膜; 蚀刻第一金属膜; 以及在所述第一金属膜的蚀刻表面上沉积第二金属膜,所述第二金属膜基本上形成在所述沟槽上方的覆盖层。