公开(公告)号：US08513801B2

公开(公告)日：2013-08-20

申请号：US12193540

申请日：2008-08-18

申请人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/34

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: mounting a first integrated circuit over a carrier; mounting an interposer, having an opening, over the first integrated circuit and the carrier with the interposer having an overhang over the carrier; connecting an internal interconnect, through the opening, between the carrier and the interposer; and forming an encapsulation over the first integrated circuit, the internal interconnect, and the carrier.

摘要翻译： 集成电路封装系统包括：将第一集成电路安装在载体上; 在所述第一集成电路和所述载体上安装具有开口的插入件，所述插入件在所述载体上具有突出端; 通过开口在载体和插入件之间连接内部互连件; 以及在第一集成电路，内部互连和载体上形成封装。

公开(公告)号：US08304869B2

公开(公告)日：2012-11-06

申请号：US12185061

申请日：2008-08-01

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/495 ,  H01L21/44

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49531 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An integrated circuit package on package system includes: providing a lead having a wire-bonded die with a bond wire connected thereto; mounting a fan-in interposer over the wire-bonded die and the bond wire; connecting the fan-in interposer to the lead with the bond wires; and encapsulating the wire-bonded die, bond wires, and the fan-in interposer with an encapsulation leaving a portion of the fan-in interposer exposed.

摘要翻译： 包装系统上的集成电路封装包括：提供具有与其连接的接合线的引线接合管芯的引线; 将插入式插入器安装在引线接合芯片和接合线上; 使用接合线将风扇插入插座连接到引线; 并且用封装封装引线接合的管芯，接合引线和风扇插入器，从而使风扇插入件的一部分露出。

公开(公告)号：US08106502B2

公开(公告)日：2012-01-31

申请号：US12272751

申请日：2008-11-17

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L21/4832 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming an external interconnect; forming a first planar terminal adjacent to the external interconnect and non-planar to a portion the external interconnect; mounting a first integrated circuit over the first planar terminal; connecting the first integrated circuit with the external interconnect; and forming an encapsulation over the first planar terminal covering the first integrated circuit and with the external interconnect extending from a non-horizontal side of the encapsulation and with the first planar terminal coplanar with the adjacent portion of the encapsulation exposing the first planar terminal.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成外部互连; 形成与所述外部互连相邻并且与所述外部互连的一部分非平面的第一平面端子; 在所述第一平面端子上安装第一集成电路; 将第一集成电路与外部互连连接; 以及在覆盖所述第一集成电路的所述第一平面端子上以及从所述封装的非水平侧延伸的所述外部互连以及与所述第一平面端子的所述封装的相邻部分共面的第一平面端子形成封装。

公开(公告)号：US20090166845A1

公开(公告)日：2009-07-02

申请号：US11965550

申请日：2007-12-27

申请人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L23/495 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.

摘要翻译： 一种集成电路封装系统，包括：形成管芯焊盘，其中所述管芯焊盘在拐角处具有连接杆; 形成引线，其中引线连接到连接杆; 将集成电路管芯连接到管芯焊盘; 以及在所述集成电路裸片上形成具有边缘的封装，所述引线从所述边缘延伸出并超过所述边缘。

公开(公告)号：US20090115032A1

公开(公告)日：2009-05-07

申请号：US11936532

申请日：2007-11-07

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49551 ,  H01L23/552 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: forming a lead having a both top contact portion and a bottom contact portion; connecting an integrated circuit die and the lead; and forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die. The forming the package encapsulation includes partially exposing the top contact portion at the top side, and partially exposing the bottom contact portion along the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.

摘要翻译： 集成电路封装系统包括：形成具有两个顶部接触部分和底部接触部分的引线; 连接集成电路管芯和引线; 以及在集成电路管芯上形成具有顶侧和底侧的封装封装。 形成封装封装包括部分地暴露顶侧的顶部接触部分，并且使底部接触部分沿底部部分露出，底部接触部分延伸超过封装封装的非水平部分。

公开(公告)号：US20080303122A1

公开(公告)日：2008-12-11

申请号：US12132121

申请日：2008-06-03

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.

摘要翻译： 集成电路封装系统包括：提供框架; 附接具有邻近框架的引线的引线封装，其中引线朝向与框架相对的一侧延伸; 以及在所述引线封装上施加封装密封剂，所述引线封装具有与所述框架相对部分地露出的引线。

公开(公告)号：US20110180928A1

公开(公告)日：2011-07-28

申请号：US13080469

申请日：2011-04-05

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan

IPC分类号： H01L23/498 ,  H01L23/50

CPC分类号： H01L23/49551 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/495 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/013 ,  H01L2924/00012 ,  H01L2224/0401

摘要： An integrated circuit package system includes: interconnection pads; a first device mounted below the interconnection pads; a bond wire, or a solder ball connecting the first device to the interconnection pads; a lead connected to the interconnection pad or to the first device; an encapsulation having a top surface encapsulating the first device; and a recess in the top surface of the encapsulation with the interconnection pads exposed therefrom.

摘要翻译： 集成电路封装系统包括：互连焊盘; 安装在互连焊盘下方的第一装置; 接合线或将第一器件连接到互连焊盘的焊球; 连接到互连衬垫或第一器件的引线; 封装，其具有封装所述第一器件的顶表面; 以及在封装的顶表面中的凹槽，其中互连焊盘从其暴露。

公开(公告)号：US07977782B2

公开(公告)日：2011-07-12

申请号：US11936532

申请日：2007-11-07

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L23/49551 ,  H01L23/552 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: forming a lead having a both top contact portion and a bottom contact portion; connecting an integrated circuit die and the lead; and forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die. The forming the package encapsulation includes partially exposing the top contact portion at the top side, and partially exposing the bottom contact portion along the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.

摘要翻译： 集成电路封装系统包括：形成具有两个顶部接触部分和底部接触部分的引线; 连接集成电路管芯和引线; 以及在集成电路管芯上形成具有顶侧和底侧的封装封装。 形成封装封装包括部分地暴露顶侧的顶部接触部分，并且使底部接触部分沿底部部分露出，底部接触部分延伸超过封装封装的非水平部分。

公开(公告)号：US20100264525A1

公开(公告)日：2010-10-21

申请号：US12822954

申请日：2010-06-24

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.

摘要翻译： 一种用于制造集成电路封装系统的方法，包括：提供框架; 附接具有邻近框架的引线的引线封装，其中引线朝向与框架相对的一侧延伸; 以及在所述引线封装上施加封装密封剂，所述引线封装具有与所述框架相对部分地露出的引线。

公开(公告)号：US20100123229A1

公开(公告)日：2010-05-20

申请号：US12272751

申请日：2008-11-17

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L21/4832 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming an external interconnect; forming a first planar terminal adjacent to the external interconnect and non-planar to a portion the external interconnect; mounting a first integrated circuit over the first planar terminal; connecting the first integrated circuit with the external interconnect; and forming an encapsulation over the first planar terminal covering the first integrated circuit and with the external interconnect extending from a non-horizontal side of the encapsulation and with the first planar terminal coplanar with the adjacent portion of the encapsulation exposing the first planar terminal.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成外部互连; 形成与所述外部互连相邻并且与所述外部互连的一部分非平面的第一平面端子; 在所述第一平面端子上安装第一集成电路; 将第一集成电路与外部互连连接; 以及在覆盖所述第一集成电路的所述第一平面端子上以及从所述封装的非水平侧延伸的所述外部互连以及与所述第一平面端子的所述封装的相邻部分共面的第一平面端子形成封装。