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    Conductive adhesive and connection structure using the same
    1.
    发明申请
    Conductive adhesive and connection structure using the same 失效
    导电胶和连接结构使用相同

    公开(公告)号：US20010015424A1

    公开(公告)日：2001-08-23

    申请号：US09751621

    申请日：2000-12-29

    Applicant: Matsushita Electric Industrial Co. Ltd.

    Inventor： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani

    IPC: H01B001/22 ,  H01C001/00 ,  H01B001/02

    CPC classification number: H01B1/22 ,  C09J9/02 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2203/121 ,  Y10T428/249985 ,  Y10T428/2804 ,  Y10T428/2852

    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.

    Abstract translation: 通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术， 与电极金属容易形成多齿结合。 作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团 基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。 因此，可以实现与电极金属的牢固结合。 将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

    Electronic component mounted member and repair method thereof
    6.
    发明申请
    Electronic component mounted member and repair method thereof 有权

    公开(公告)号：US20030079896A1

    公开(公告)日：2003-05-01

    申请号：US10309597

    申请日：2002-12-03

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Tsutomu Matani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

    IPC: H01L023/02

    CPC classification number: H05K3/321 ,  H05K2201/0129 ,  H05K2201/10992 ,  H05K2203/176 ,  H05K2203/306 ,  Y10T29/49172

    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100null C. to 300null C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.

    Electronic component mounted member and repair method thereof
    7.
    发明申请
    Electronic component mounted member and repair method thereof 失效
    电子元件安装件及其修理方法

    公开(公告)号：US20020062988A1

    公开(公告)日：2002-05-30

    申请号：US09893106

    申请日：2001-06-27

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Tsutomu Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

    IPC: H05K001/09

    CPC classification number: H05K3/321 ,  H05K2201/0129 ,  H05K2201/10992 ,  H05K2203/176 ,  H05K2203/306 ,  Y10T29/49172

    Abstract: An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100null C. to 300null C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.

    Abstract translation: 电子部件安装部件包括电路板，连接到电路板的电子部件和插入在电子部件和电路板之间的导电粘合剂。 在导电粘合剂和电路板的电极的接合界面中，由软化温度为100℃至300℃的热塑性绝缘粘合剂形成的中间层介于导电粘合剂和 电极。 包含在导电粘合剂中的导电填料部分地存在于中间层中，从而允许导电粘合剂和电路板的电极之间的导电。 使用该电子部件安装部件，当需要修理时，对应于要修复的电子部件的中间层的一部分被加热，以将该部分的温度升高至热塑性绝缘体的至少熔点 粘合剂，从而熔化热塑性绝缘粘合剂。 然后，保持该状态，去除电子部件。

    Conductive adhesive and connection structure using the same
    8.
    发明申请
    Conductive adhesive and connection structure using the same 失效
    导电胶和连接结构使用相同

    公开(公告)号：US20030127632A1

    公开(公告)日：2003-07-10

    申请号：US10309596

    申请日：2002-12-03

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Hiroaki Takezawa ,  Takashi Kitae ,  Yukihiro Ishimaru ,  Tsutomu Mitani

    IPC: H01B001/00

    CPC classification number: H01B1/22 ,  C09J9/02 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0129 ,  H05K2203/121 ,  Y10T428/249985 ,  Y10T428/2804 ,  Y10T428/2852

    Abstract: A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.

    Abstract translation: 通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术， 与电极金属容易形成多齿结合。 作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团 基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。 因此，可以实现与电极金属的牢固结合。 将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

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