利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

28 条记录 (耗时 0.026 秒)

    Copper alloy for electronic instruments and method of manufacturing the same
    1.
    发明授权
    Copper alloy for electronic instruments and method of manufacturing the same 失效
    铜合金电子仪器及其制造方法相同

    公开(公告)号：US4732731A

    公开(公告)日：1988-03-22

    申请号：US900429

    申请日：1986-08-26

    申请人： Makoto Asai ,  Shoji Shiga ,  Toru Tanigawa ,  Yoshimasa Oyama ,  Shigeo Shinozaki

    发明人： Makoto Asai ,  Shoji Shiga ,  Toru Tanigawa ,  Yoshimasa Oyama ,  Shigeo Shinozaki

    IPC分类号： H01L23/48 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22F1/08 ,  H01L23/495

    CPC分类号： H01L23/49579 ,  C22C9/02 ,  C22C9/06 ,  C22F1/08 ,  H01L2924/0002

    摘要： A copper alloy is disclosed, which contains 0.1 to 3.0 wt % of Ni, 0.1 to 1.0 wt % of Ti, the ratio of Ni to Ti being 4.ltoreq.Ni/Ti thereby, 0.1 to 6.0 wt % of Sn, and 0.005 to 3.0 wt % in total of one or more elements selected from the group consisting of Zn, Mn, Mg, Ca, RE, B, Sb, Te, Si, Co, Fe, Zr, Ag, Mm and Al, and consists of the remainder of Cu and the inevitable impurities. The method for the manufacture of the alloy is characterized in that, after copper alloy ingot was maintained and homogenized for 0.5 to 15 hours at 750.degree. to 960.degree. C. prior to rolling, the hot rolling is carried out starting from a temperature of 700.degree. to 880.degree. C. and the cooling is made immediately after the end of rolling.

    摘要翻译： 公开了一种铜合金，其含有0.1〜3.0重量％的Ni，0.1〜1.0重量％的Ti，Ni与Ti的比例为4≤Ni/ Ti，0.1〜6.0重量％的Sn和0.005 至少3.0重量％的选自Zn，Mn，Mg，Ca，RE，B，Sb，Te，Si，Co，Fe，Zr，Ag，Mm和Al中的一种或多种元素，并且由 剩余的Cu和不可避免的杂质。 合金的制造方法的特征在于，在轧制之后，在750〜960℃保持铜合金锭并均化0.5〜15小时后，从700℃的温度开始进行热轧 DEG至880℃，并在轧制结束后立即进行冷却。

    Copper alloy and method of manufacturing the same
    2.
    发明授权
    Copper alloy and method of manufacturing the same 失效
    铜合金及其制造方法

    公开(公告)号：US4822560A

    公开(公告)日：1989-04-18

    申请号：US916694

    申请日：1986-10-08

    申请人： Yoshimasa Oyama ,  Masato Asai ,  Toru Tanigawa ,  Shigeo Shinozaki ,  Shoji Shiga

    发明人： Yoshimasa Oyama ,  Masato Asai ,  Toru Tanigawa ,  Shigeo Shinozaki ,  Shoji Shiga

    IPC分类号： C22C9/02 ,  C22F1/08 ,  H01L23/495

    CPC分类号： H01L23/49579 ,  C22C9/02 ,  C22F1/08 ,  H01L2924/0002

    摘要： A copper alloy is disclosed which comprises 0.01 to 1.0 wt. % of Cr, 0.01 to 8 wt. % of Sn, 0.001 to 5 wt. % of at least one of 0.001 to 5 wt. % of Zn, 0.001 to 0.5 wt. % of Mn and 0.001 to 0.2 wt. % of Mg and the remainder of Cu, the content of O.sub.2 therein being not more than 0.005 wt. %. A method of manufacturing therefor is described wherein, after the hot processing or the heat treatment at 800.degree. to 950.degree. C., the alloy is cooled by passage through a region of 800.degree. to 400.degree. C. within 20 minutes, then following cold processing, heating treatment is carried out for at least 1 minute at 400.degree. to 650.degree. C. The alloy with the composition aforementioned is used as an alloy material for electric or electronic instruments.

    摘要翻译： 公开了一种铜合金，其包含0.01至1.0wt。 Cr％，0.01〜8重量％ Sn的％，0.001〜5重量％ 0.001至5重量％中的至少一个的％ ％的Zn，0.001〜0.5wt。 Mn的百分数为0.001〜0.2重量％。 ％的Mg和余量的Cu，其中的O 2含量不超过0.005wt。 ％。 对其制造方法进行说明，其中在800℃〜950℃的热加工或热处理后，在20分钟内通过800〜400℃的区域冷却合金，然后冷却 在400〜650℃下进行加工处理至少1分钟。将上述组成的合金用作电气或电子仪器的合金材料。

    Radiator for motor cars
    3.
    发明授权
    Radiator for motor cars 失效
    汽车散热器

    公开(公告)号：US4741394A

    公开(公告)日：1988-05-03

    申请号：US895465

    申请日：1986-08-11

    申请人： Toru Tanigawa ,  Shoji Shiga ,  Kiichi Akasaka ,  Yoshimasa Oyama

    发明人： Toru Tanigawa ,  Shoji Shiga ,  Kiichi Akasaka ,  Yoshimasa Oyama

    IPC分类号： F28F9/02 ,  F28D1/02

    CPC分类号： F28F9/0226 ,  Y10S165/474 ,  Y10S165/905

    摘要： In a radiator for motor cars wherein fins are fitted between vertical tubes through which the heat-exchanging medium flows to form a core and tube plates are provided at both ends of the tubes of said core to connect with a resinous tank, a concave groove is formed outside the peripheral portion thereof, and an elastic seal member is provided in said concave groove to insert the open end of the resinous tank, the improvement wherein said tube plates are .alpha. brass containing 15-38 wt. % Zn, 0.05-1.5 wt. % Si, and the remainder Cu.

    摘要翻译： 在用于汽车的散热器中，其中翅片装配在垂直管之间，热交换介质通过该管流动以形成芯，并且在所述芯的管的两端设置有管板，以与树脂罐连接，凹槽为 并且在所述凹槽中设置弹性密封件，以插入树脂罐的开口端，改进之处在于，所述管板为含有15-38重量％ ％Zn，0.05-1.5wt。 ％Si，其余为Cu。

    Copper alloy for electronic instruments
    4.
    发明授权
    Copper alloy for electronic instruments 失效
    铜合金电子仪器

    公开(公告)号：US5021105A

    公开(公告)日：1991-06-04

    申请号：US307488

    申请日：1989-02-08

    申请人： Makoto Asai ,  Yoshimasa Ohyama ,  Tohru Tanigawa ,  Shigeo Shinozaki ,  Shoji Shiga

    发明人： Makoto Asai ,  Yoshimasa Ohyama ,  Tohru Tanigawa ,  Shigeo Shinozaki ,  Shoji Shiga

    IPC分类号： C22C9/02 ,  H01L23/48 ,  H01R13/03

    CPC分类号： C22C9/02 ,  H01L23/48 ,  H01R13/03 ,  H01L2924/0002

    摘要： A copper alloy for electronic instruments is disclosed which comprises 2.0 to 7.0 wt. % of Sn, 1.0 to 6.0 wt. % in total amount of at least one kind of Ni, Co and Cr, o.1 to 2.0 wt. % of Si, and the remainder of Cu and unavoidable impurities, thereby further the content of O.sub.2 in unavoidable impurities being not more than 50 ppm, the content of S being not more than 20 ppm, and the average particle diameter of precipitates being not larger than 10 .mu.m. As the uses of such copper alloys, lead material for semiconductor elements and connector, socket, spring and terminal for electronic and electric instruments are claimed.

    摘要翻译： 公开了一种电子仪器用铜合金，其包含2.0〜7.0重量％ Sn的％，1.0〜6.0重量％ Ni，Co和Cr中的至少一种的总量的％为0.1〜2.0重量％。 ％的Si，剩余的Cu和不可避免的杂质，因此不可避免的杂质中的O 2含量不大于50ppm，S的含量不超过20ppm，沉淀物的平均粒径不大 超过10亩。 作为这种铜合金的用途，要求用于半导体元件和连接器的铅材料，插座，电子和电气仪器的弹簧和端子。

    Plasma processing device for circuit supports
    6.
    发明授权
    Plasma processing device for circuit supports 有权
    电路支架等离子体处理装置

    公开(公告)号：US06198067B1

    公开(公告)日：2001-03-06

    申请号：US09387126

    申请日：1999-08-31

    申请人： Hiroyuki Ikeda ,  Shoji Shiga ,  Ryoichi Mori

    发明人： Hiroyuki Ikeda ,  Shoji Shiga ,  Ryoichi Mori

    IPC分类号： B23K1000

    CPC分类号： H01J37/32192 ,  H05K3/0055 ,  H05K2203/095

    摘要： Many boards 7 to be processed are disposed within a metal chamber 1 in an isolated state, and many ground electrode plates 9 are disposed near by both surfaces of the boards 7 so as to be at the same potential as the chamber 1. While a microwave generated by a magnetron 3 from an upper portion of the chamber 1 is applied in the chamber 1, both surfaces of the boards 7 are processed at a time with plasma by using glow discharges produced between the boards 7 and plates 9 due to a difference in high-frequency potential between the boards 7 and plates 9 under presence of reaction gas.

    摘要翻译： 许多待处理的板7以隔离状态设置在金属室1内，并且许多接地电极板9设置在板7的两个表面附近，以便与室1处于相同的电位。微波 由腔室1的上部由磁控管3产生的电路板1被施加到腔室1中，由于在板7和板9之间产生的辉度放电，板7的两个表面都被等离子体处理 在反应气体存在下，板7和板9之间的高频电位。

    Ceramic superconductor wire and method of manufacturing the same
    7.
    发明授权
    Ceramic superconductor wire and method of manufacturing the same 失效
    陶瓷超导线及其制造方法

    公开(公告)号：US5296456A

    公开(公告)日：1994-03-22

    申请号：US562205

    申请日：1990-08-03

    申请人： Shoji Shiga ,  Naoki Uno ,  Hiroyuki Kikuchi

    发明人： Shoji Shiga ,  Naoki Uno ,  Hiroyuki Kikuchi

    IPC分类号： H01L39/14 ,  H01L39/12

    CPC分类号： H01L39/248 ,  H01L39/143 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/704 ,  Y10T428/12611 ,  Y10T428/12889 ,  Y10T428/12896

    摘要： Disclosed herein is a ceramic superconductor comprising a ceramic superconductive member, and a high-conductivity metal layer covering the ceramic superconductive member. At least one portion of the metal layer having low electrical conductivity or low thermal conductivity. Also disclosed is a method of manufacturing a ceramic superconductor, comprising the steps of filling a ceramic superconductor or a precursor thereof in a high-conductivity metal pipe, thereby forming a composite member, rolling the composite member into a ceramic superconductor element of a desired shape, which comprises a ceramic superconductive member and a high-conductivity metal layer covering the ceramic superconductive member, performing a predetermined heat treatment on the ceramic superconductor element, and alloying a predetermined portion of the high-conductivity metal layer, thereby rendering the portion less conductive either electrically or thermally.

    摘要翻译： 本文公开了一种陶瓷超导体，其包括陶瓷超导体和覆盖陶瓷超导体的高导电性金属层。 金属层的至少一部分具有低导电性或低热导率。 还公开了一种制造陶瓷超导体的方法，包括以下步骤：将陶瓷超导体或其前体填充在高导电性金属管中，从而形成复合构件，将复合构件滚压成所需形状的陶瓷超导体元件 ，其包括陶瓷超导体和覆盖陶瓷超导体的高导电性金属层，对陶瓷超导体元件进行预定的热处理，并使高导电性金属层的规定部分合金化，由此使该部分导电性差 电或热。

    Method of manufacturing a metal-contained composite material and a metal-contained composite material produced thereby
    9.
    发明授权
    Method of manufacturing a metal-contained composite material and a metal-contained composite material produced thereby 失效
    制备含金属复合材料的方法及其生产的含金属复合材料

    公开(公告)号：US5230138A

    公开(公告)日：1993-07-27

    申请号：US667394

    申请日：1991-03-22

    申请人： Shoji Shiga ,  Minoru Suzuki ,  Masanori Ozaki

    发明人： Shoji Shiga ,  Minoru Suzuki ,  Masanori Ozaki

    IPC分类号： B22F7/08 ,  C04B35/645 ,  C04B37/02

    CPC分类号： C04B35/6455 ,  B22F7/08 ,  C04B35/645 ,  Y10T29/4956 ,  Y10T29/49705 ,  Y10T29/49982

    摘要： This invention relates to a method of producing a metal-contained composite material from a metal and a sinterable material such as a ceramic material, and to a metal-contained composite material produced by the method. Conventional composite materials consisting of metal and ceramic material do not have sufficient mechanical and electrical properties, under some conditions in use, and are too expensive to be applied extensively. To solve this problem, the invention provides a manufacturing method comprising a process of fabricating a roll of a laminate consisting of a metal strip and a sinterable material, by winding up the laminate, and a process of subjecting the roll to plastic working; a manufacturing method including a heat treatment process carried out at a predetermined temperature, in addition to the above processes; and metal-contained composite materials produced by these methods. The metal-contained composite materials produced by the methods of the invention can be suitably used for machine parts, electrical sliding contact materials, electrical and thermal conductors, electromagnetic shielding materials, and the like.

    摘要翻译： PCT No.PCT / JP90 / 00949 Sec。 371日期1991年3月22日 102（e）1991年3月22日PCT文件1990年7月26日PCT公布。 第WO91 / 01954号公报 日本1991年2月21日。本发明涉及一种由金属和可烧结材料如陶瓷材料制备含金属复合材料的方法，以及通过该方法制备的含金属复合材料。 由金属和陶瓷材料组成的常规复合材料在使用中的某些条件下不具有足够的机械和电学性质，并且太昂贵，不能广泛应用。 为了解决这个问题，本发明提供一种制造方法，该方法包括通过卷绕该层叠体来制造由金属带和可烧结材料组成的层压辊的工艺，以及使辊进行塑性加工的工艺; 除了上述方法之外，还包括在预定温度下进行的热处理工艺的制造方法; 和通过这些方法制备的含金属复合材料。 通过本发明的方法制造的含金属复合材料可以适用于机器部件，电滑动接触材料，电热导体，电磁屏蔽材料等。