摘要:
Methods of depositing silicon oxide layers on substrates involve flowing a silicon-containing precursor, an oxidizing gas, water and an additive precursor into a processing chamber such that a uniform silicon oxide growth rate is achieved across the substrate surface. The surface of silicon oxide layers grown according to embodiments may have a reduced roughness when grown with the additive precursor. In other aspects of the disclosure, silicon oxide layers are deposited on a patterned substrate with trenches on the surface by flowing a silicon-containing precursor, an oxidizing gas, water and an additive precursor into a processing chamber such that the trenches are filled with a reduced quantity and/or size of voids within the silicon oxide filler material.
摘要:
In a method and apparatus for testing a head-gimbal assembly (HGA), a HGA is placed in contact with force transducers mounted on a rotational stage. The force transducers are adjusted to position the transducers around a rotational center of the rotational stage. The rotational stage is rotated, and the torque and variations in torque exerted by the HGA on the force transducers during rotation are measured.
摘要:
The improved disk drive system has an improved head gimbal assembly having a mounting plate with an attachment portion for attachment to an actuator arm and a distal end for mounting the read/write heads, or load beam assemblies, thereto. The mounting portion and distal end of the mounting plate are vertically offset such that when the attachment portion is attached to the actuator arm, the distal end of the mounting plate is centered between opposing sides of adjacent disks, thereby permitting a smaller spacing between adjacent disks. The new swage type connection between the mounting plate and the actuator arm has a hole in the actuator arm and has a spud located on the attachment portion of the mounting plate. The spud has a cylinder having an outer diameter such that the cylinder can fit inside the actuator arm hole. A distal end of the cylinder has a lip protruding inwardly from an inside diameter of the cylinder. The cylinder has a length such that when the cylinder is inserted into the actuator arm hole, the lip and the distal end of the cylinder extend beyond the thickness of the actuator arm around the actuator arm hole so that when the spud is swaged while in the actuator arm hole, the lip and the distal end of the cylinder expand into an area outside the actuator arm hole.
摘要:
Methods for doping a non-planar structure by forming a conformal doped silicon glass layer on the non-planar structure are disclosed. A substrate having the non-planar structure formed thereon is positioned in chemical vapor deposition process chamber to deposit a conformal SACVD layer of doped glass (e.g. BSG or PSG). The substrate is then exposed to RTP or laser anneal step to diffuse the dopant into the non-planar structure and the doped glass layer is then removed by etching.
摘要:
A semiconductor processing system is described. The system includes a processing chamber having an interior capable of holding an internal chamber pressure below ambient atmospheric pressure. The system also includes a pumping system coupled to the chamber and adapted to remove material from the processing chamber. The system further includes a substrate support pedestal, where the substrate support pedestal is rigidly coupled to a substrate support shaft extending through a wall of the processing chamber. A bracket located outside the processing chamber is provided which is rigidly and sometimes rotatably coupled to the substrate support shaft. A motor coupled to the bracket can be actuated to vertically translate the substrate support pedestal, shaft and bracket from a first position to a second position closer to a processing plate. A piston mounted on an end of the bracket provides a counter-balancing force to a tilting force, where the tilting force is generated by a change in the internal chamber pressure and causes a deflection in the position of the bracket and the substrate support. The counter-balancing force reduces the deflection of the bracket and the substrate support.
摘要:
In a method and apparatus for testing a head-gimbal assembly (HGA), a HGA is placed in contact with force transducers mounted on a rotational stage. The force transducers are adjusted to position the transducers around a rotational center of the rotational stage. The rotational stage is rotated, and the torque and variations in torque exerted by the HGA on the force transducers during rotation are measured.
摘要:
A system and method are described for processing a slider (e.g., one to be used in a disk drive apparatus). Corners of the sliders are abraded while still a part of a row of sliders in a part-off operation. By abrading the corners of the sliders, head slap events between the slider and the recording media result in less damage to the recording media and less particulate matter from the slider being left on the recording media, improving data integrity for the recording media.
摘要:
The improved disk drive system has an improved head gimbal assembly having a mounting plate with an attachment portion for attachment to an actuator arm and a distal end for mounting the read/write heads, or load beam assemblies, thereto. The mounting portion and distal end of the mounting plate are vertically offset such that when the attachment portion is attached to the actuator arm, the distal end of the mounting plate is centered between opposing sides of adjacent disks, thereby permitting a smaller spacing between adjacent disks. The new swage type connection between the mounting plate and the actuator arm has a hole in the actuator arm and has a spud located on the attachment portion of the mounting plate. The spud has a cylinder having an outer diameter such that the cylinder can fit inside the actuator arm hole. A distal end of the cylinder has a lip protruding inwardly from an inside diameter of the cylinder. The cylinder has a length such that when the cylinder is inserted into the actuator arm hole, the lip and the distal end of the cylinder extend beyond the thickness of the actuator arm around the actuator arm hole so that when the spud is swaged while in the actuator arm hole, the lip and the distal end of the cylinder expand into an area outside the actuator arm hole.
摘要:
A method for improving conformality of oxide layers along sidewalls of vias in semiconductor substrates includes forming a nitride layer over an upper surface of a semiconductor substrate and forming a via extending through the nitride layer and into the semiconductor substrate. The via may have a depth of at least about 50 μm from a top surface of the nitride layer and an opening of less than about 10 μm at the top surface of the nitride layer. The method also includes forming an oxide layer over the nitride layer and along sidewalls and bottom of the via. The oxide layer may be formed using a thermal chemical vapor deposition (CVD) process at a temperature of less than about 450° C., where a thickness of the oxide layer at the bottom of the via is at least about 50% of a thickness of the oxide layer at the top surface of the nitride layer.
摘要:
A method for forming a multi-layer silicon oxide film on a substrate includes performing a deposition cycle that comprises depositing a silicon oxide layer using a thermal chemical vapor deposition (CVD) process and depositing a silicon oxide layer using a plasma enhanced chemical vapor deposition (PECVD) process. The deposition cycle is repeated a specified number of times to form the multi-layer silicon oxide film comprising a plurality of silicon oxide layers formed using the thermal CVD process and a plurality of silicon oxide layers formed using the PECVD process. Each silicon oxide layer formed using the thermal CVD process is adjacent to at least one silicon oxide layer formed using the PECVD process.