公开(公告)号：US06259155B1

公开(公告)日：2001-07-10

申请号：US09290311

申请日：1999-04-12

申请人： Mario John Interrante ,  Raymond Alan Jackson ,  Sudipta Kumar Ray ,  Paul A. Zucco ,  Scott R. Dwyer

发明人： Mario John Interrante ,  Raymond Alan Jackson ,  Sudipta Kumar Ray ,  Paul A. Zucco ,  Scott R. Dwyer

IPC分类号： H01L2348

CPC分类号： H05K3/3436 ,  H01L23/49811 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H05K2201/10977 ,  H05K2203/0415 ,  H05K2203/176 ,  Y02P70/613

摘要： A ceramic column grid array package suitable for mounting application specific integrated circuits or microprocessor chips onto a printed circuit board employing polymer reinforced columns on the substrate module is described. The polymer enhancement is formed by coating a thin conformal film of a polymer, such as, a polyimide onto the substrate module after the formation of the ceramic column grids to mechanically enhance the column to substrate attachment of the column to the substrate prior to mounting on a printed circuit card. Upon curing of the polymer film at a temperature below the melting point of the solder bond attaching the column grid to the substrate, the columns will be mechanically reinforced in their attachment to the substrate. Upon removal of the substrate module from a printed circuit card during rework, the columns of the grid array will remain with the substrate module, leaving no columns on the printed circuit card.

摘要翻译： 描述了一种适用于将专用集成电路或微处理器芯片安装在使用基板模块上的聚合物增强柱的印刷电路板上的陶瓷柱栅格阵列封装。 在形成陶瓷柱网格之后，通过在形成陶瓷柱网格之后，将诸如聚酰亚胺等聚合物的薄的共形膜涂覆在基板组件上，以在安装到基板之前机械地增强柱与基板的连接，从而形成聚合物增强。 印刷电路卡。 当聚合物膜在低于焊接粘合点的温度下固化时，将柱格栅连接到基底上，柱将被附着到基底上机械地增强。 在返工过程中从打印电路卡移除基板模块后，网格阵列将保留在基板模块上，在印刷电路板上不留列。

公开(公告)号：US6015955A

公开(公告)日：2000-01-18

申请号：US879718

申请日：1997-06-20

申请人： Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

发明人： Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

IPC分类号： G01R1/04 ,  H01L21/60 ,  H01L23/498 ,  H01L23/64 ,  H05K7/02

CPC分类号： G01R1/0408 ,  H01L23/49816 ,  H01L23/642 ,  H01L24/75 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

摘要： A device and method for enabling the reworkability of an integrated circuit. The device includes a wirebond chip having a bottom surface and a carrier substrate having a first surface and a second surface. The first surface and second surface of the carrier substrate are electrically connected through a series of vias. A bonding agent is used to mechanically attach the wirebond chip to the carrier substrate in addition to wirebonds for electrically connecting the wirebond chip to the substrate. The substrate is attached to a multi-chip module (MCM) by ball grid array (BGA) or controlled collapse chip connection (C4) attaching process.

摘要翻译： 一种用于实现集成电路的可再加工性的装置和方法。 该器件包括具有底表面的引线键合芯片和具有第一表面和第二表面的载体衬底。 载体基板的第一表面和第二表面通过一系列通孔电连接。 除了用于将引线芯片电连接到基板的引线之外，还使用粘合剂将引线键合芯片机械地附接到载体基板。 基板通过球栅阵列（BGA）或受控的崩溃芯片连接（C4）连接工艺连接到多芯片模块（MCM）。

公开(公告)号：US06226863B1

公开(公告)日：2001-05-08

申请号：US09366980

申请日：1999-08-04

申请人： Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

发明人： Mukta Shaji Farooq ,  Raymond Alan Jackson ,  Sudipta Kumar Ray

IPC分类号： H05K334

CPC分类号： G01R1/0408 ,  H01L23/49816 ,  H01L23/642 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/30105 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/0401

摘要： A device and method for enabling the reworkability of an integrated circuit comprising a wirebond chip having a bottom surface and a carrier substrate having a first surface and a second surface. The first surface and second surface of the carrier substrate are electrically connected through a series of vias. A bonding agent is used to mechanically attach the wirebond chip to the carrier substrate in addition to wirebonds for electrically connecting the wirebond chip to the substrate. The substrate is attached to a multi-chip module (MCM) by ball grid array (BGA) or controlled collapse chip connection (C4) attaching process.

摘要翻译： 一种能够实现包括具有底表面的引线键合芯片和具有第一表面和第二表面的载体基板的集成电路的可再加工性的装置和方法。 载体基板的第一表面和第二表面通过一系列通孔电连接。 除了用于将引线芯片电连接到基板的引线之外，还使用粘合剂将引线键合芯片机械地附接到载体基板。 基板通过球栅阵列（BGA）或受控的崩溃芯片连接（C4）连接工艺连接到多芯片模块（MCM）。

公开(公告)号：US5868304A

公开(公告)日：1999-02-09

申请号：US674559

申请日：1996-07-02

申请人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

发明人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

IPC分类号： H01L23/12 ,  B23K3/06 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L23/49816 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/11334 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0557 ,  H05K3/3478 ,  Y02P70/613

摘要： An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of opening corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

摘要翻译： 具有包括成型焊料涂覆的金属球体的可插座凸块网格阵列的电子部件通过一种方法提供，该方法包括将焊接涂覆的金属球定位在具有对应于阵列的多个开口的对准装置中，所述开口优选地呈锥形 锥体的底部位于对准装置的上表面并且具有大于焊料涂覆的金属球的直径的直径。 开口构造成使得定位在开口中的球体部分地在对准装置的上表面上方延伸。 然后将衬底的焊盘与定位的球体接触，并且当焊料回流时，焊料在与焊料涂覆的金属球接触的衬底上的导电层之间形成结合，并且采取对准装置的形状和 其在金属球体的整个表面上保持焊料涂层。 还提供了一种用于制造这种可插座凸块网格阵列的装置。

公开(公告)号：US5779133A

公开(公告)日：1998-07-14

申请号：US641661

申请日：1996-05-01

申请人： Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  David Clyde Linnell ,  Raj Navinchandra Master

发明人： Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  David Clyde Linnell ,  Raj Navinchandra Master

IPC分类号： B23K1/018 ,  H05K13/04 ,  B23K3/00

CPC分类号： H05K13/0486 ,  B23K1/018 ,  B23K2201/40

摘要： Deformation of a lifting ring of bimetallic structure or memory metal is matched to a solder softening or melting temperature to apply forces to lift a chip from a supporting structure, such as a substrate or multi-chip module, only when the solder connections between the chip and the supporting structure are softened or melted. The temperature of the chip, module and solder connections there between is achieved in a commercially available box oven or belt furnace or the like and results in much reduced internal chip temperatures and thermal gradients within the chip as compared to known hot chip removal processes. Tensile and/or shear forces at solder connections and chip and substrate contacts are much reduced in comparison with known cold chip removal processes. Accordingly, the process is repeatable at will without significant damage to or alteration of electrical characteristics of the chip or substrate.

公开(公告)号：US6070782A

公开(公告)日：2000-06-06

申请号：US113044

申请日：1998-07-09

申请人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

发明人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

IPC分类号： H01L23/498 ,  H05K3/34 ,  B23K101/38 ,  H01L23/48 ,  H05K1/00

CPC分类号： H01L23/49816 ,  H05K3/3478 ,  H01L2924/0002 ,  H05K2201/10234 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3436

摘要： An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of openings corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

摘要翻译： 具有包括成形焊料涂覆的金属球体的可插座凸块网格阵列的电子部件通过一种方法提供，该方法包括将焊接涂覆的金属球定位在具有对应于阵列的多个开口的对准装置中，所述开口优选地呈锥形 锥体的底部位于对准装置的上表面并且具有大于焊料涂覆的金属球的直径的直径。 开口构造成使得定位在开口中的球体部分地在对准装置的上表面上方延伸。 然后将衬底的焊盘与定位的球体接触，并且当焊料回流时，焊料在与焊料涂覆的金属球接触的衬底上的导电层之间形成结合，并且采取对准装置的形状和 其在金属球体的整个表面上保持焊料涂层。 还提供了一种用于制造这种可插座凸块网格阵列的装置。