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    Apparatus for maximizing light beam utilization
    2.
    发明授权
    Apparatus for maximizing light beam utilization 失效
    用于使光束利用最大化的装置

    公开(公告)号：US5290992A

    公开(公告)日：1994-03-01

    申请号：US957969

    申请日：1992-10-07

    Applicant: How T. Lin ,  Mark V. Pierson

    Inventor： How T. Lin ,  Mark V. Pierson

    IPC: B23K26/06 ,  B23K26/067 ,  G03F7/20

    CPC classification number: B23K26/0673 ,  B23K26/066 ,  B23K26/067 ,  G03F7/2002 ,  G03F7/70291 ,  G03F7/70991

    Abstract: The present invention is an apparatus and method for maximizing light beam utilization in patterning applications by positioning a plurality of mask mirrors in the light beam path to form patterned light onto a plurality of work pieces. Each mask mirror is designed so that a portion of the light beam area needed for exposing a work piece to patterned light is reflected from the mask mirror, while the remainder is passed through the mask mirror to another mask mirror. Alternatively, each mask mirror can be designed so that a portion of the light beam area needed for exposing a work piece to patterned light is passed through the mask mirror, while the remainder is reflected to another mask mirror.

    Abstract translation: 本发明是一种用于通过在光束路径中定位多个掩模反射镜以在多个工件上形成图案化光来最大化图案化应用中的光束利用的装置和方法。 每个掩模镜被设计成使得用于将工件暴露于图案化光所需的光束区域的一部分从掩模反射镜反射，而其余部分通过掩模镜到另一个掩模反射镜。 或者，每个掩模反射镜可被设计成使得将工件暴露于图案化光所需的光束区域的一部分通过掩模反射镜，而剩余部分被反射到另一个掩模反射镜。

    Circuitized substrate with internal cooling structure and electrical assembly utilizing same
    5.
    发明授权
    Circuitized substrate with internal cooling structure and electrical assembly utilizing same 失效
    具有内部冷却结构的电路化基板和利用其的电气组件

    公开(公告)号：US07738249B2

    公开(公告)日：2010-06-15

    申请号：US11976468

    申请日：2007-10-25

    Applicant: Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    Inventor： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    IPC: H05K7/20

    CPC classification number: H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

    Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

    Abstract translation: 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

    Multi-functional fiber optic coupler
    7.
    发明授权
    Multi-functional fiber optic coupler 有权

    公开(公告)号：US06635866B2

    公开(公告)日：2003-10-21

    申请号：US09838645

    申请日：2001-04-19

    Applicant: Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

    Inventor： Benson Chan ,  Richard R. Hall ,  How T. Lin ,  John H. Sherman

    IPC: H01J502

    CPC classification number: G02B6/4292 ,  G02B6/3885 ,  G02B6/3897 ,  G02B6/4232 ,  G02B6/4249

    Abstract: An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.

    Method of making circuitized substrate with internal optical pathway using photolithography
    8.
    发明申请
    Method of making circuitized substrate with internal optical pathway using photolithography 失效
    使用光刻法制造具有内部光学路径的电路化衬底的方法

    公开(公告)号：US20090093073A1

    公开(公告)日：2009-04-09

    申请号：US11907004

    申请日：2007-10-09

    Applicant: Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    Inventor： Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    IPC: H01L21/77

    CPC classification number: G02B6/43 ,  G02B6/132 ,  G02B6/136 ,  H05K1/0274

    Abstract: A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum. The formed substrate is capable of being both optically and electrically coupled to one or more other substrates possessing similar capabilities, thereby forming an electro-optical assembly of such substrates.

    Abstract translation: 一种制造电路化衬底（例如，PCB）的方法，其包括至少一个可能的几个内部光学路径作为其一部分，使得所得到的衬底将能够传输和/或接收电信号和光信号。 该方法包括在光学核心的一侧和相邻的直立构件之间形成至少一个开口，使得开口由至少一个角形侧壁限定。 通过光学芯材料（或从上方进入芯体）的光从该角形侧壁反射。 因此，开口内的介质（例如空气）由于其相对于相邻的光学芯材料的反射率而与反射介质一样起作用。 该方法利用了常规PCB制造中使用的许多工艺，从而将成本降至最低。 所形成的基底能够光学和电耦合到具有相似能力的一个或多个其它基底，从而形成这种基底的电光学组件。

    Method of making circuitized substrate with internal optical pathway
    9.
    发明申请
    Method of making circuitized substrate with internal optical pathway 有权
    制造具有内部光通路的电路化基板的方法

    公开(公告)号：US20090092353A1

    公开(公告)日：2009-04-09

    申请号：US11907006

    申请日：2007-10-09

    Applicant: Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    Inventor： Benson Chan ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  Mark D. Poliks

    IPC: G02B6/122

    CPC classification number: G02B6/1221 ,  G02B6/132 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  H05K1/0274

    Abstract: A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.

    Abstract translation: 包括作为其一部分的内部光学路径的电路化衬底（例如，PCB），使得衬底能够传输和/或接收电信号和光信号。 衬底包括在一个包覆层上的角反射器，使得穿过光学核心的光信号将撞击角形反射器的成角度的反射表面，并通过开口（包括其中具有光学透明材料的一个）反射，例如 涉及另外还具有至少一个内部光学路径作为其一部分的第二电路化基板，从而光学地连接两个基板。 还提供了制造基板的方法。

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