公开(公告)号：US6159770A

公开(公告)日：2000-12-12

申请号：US192445

申请日：1998-11-16

申请人： Masafumi Tetaka ,  Shinichiro Maki ,  Nobuo Ohyama ,  Seiichi Orimo ,  Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Akihiro Shigeno ,  Ryoichi Yokoyama ,  Fumitoshi Fujisaki ,  Masao Fukunaga ,  Kazuto Tsuji ,  Terumi Kamifukumoto ,  Kenji Itasaka ,  Masanori Onodera

发明人： Masafumi Tetaka ,  Shinichiro Maki ,  Nobuo Ohyama ,  Seiichi Orimo ,  Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Akihiro Shigeno ,  Ryoichi Yokoyama ,  Fumitoshi Fujisaki ,  Masao Fukunaga ,  Kazuto Tsuji ,  Terumi Kamifukumoto ,  Kenji Itasaka ,  Masanori Onodera

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L21/44 ,  H01L21/50 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L24/85 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.

摘要翻译： 提供了一种制造半导体器件的方法，其包括树脂封装，密封半导体元件和外部连接端子，分别形成在树脂封装上的树脂突起和设置在树脂突起上的金属膜部分。 半导体元件安装到具有位于与树脂突起的位置对应的位置的凹部的引线框架上，金属膜部件设置在凹部中。 半导体元件电连接到金属膜部件。 密封半导体元件和栅极部分的树脂封装与树脂封装件一体形成。 引线框架被蚀刻，使得树脂封装件与金属层部件一起与引线框架分离。 树脂封装件附接到设置在框架上的胶带并用作载体。

公开(公告)号：US06191494B1

公开(公告)日：2001-02-20

申请号：US09342500

申请日：1999-06-29

申请人： Nobuo Ooyama ,  Shinichiro Maki ,  Fumitoshi Fujisaki ,  Syunichi Kuramoto ,  Yukio Saigo ,  Yasuo Yatsuda ,  Youichi Matae ,  Atsushi Yano ,  Kazuto Tsuji ,  Masafumi Tetaka

发明人： Nobuo Ooyama ,  Shinichiro Maki ,  Fumitoshi Fujisaki ,  Syunichi Kuramoto ,  Yukio Saigo ,  Yasuo Yatsuda ,  Youichi Matae ,  Atsushi Yano ,  Kazuto Tsuji ,  Masafumi Tetaka

IPC分类号： H01L2328

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H05K3/20 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.

摘要翻译： 提供半导体器件及其制造方法。 半导体器件包括：半导体芯片; 密封半导体芯片的树脂封装; 信号通道，其将半导体芯片的信号端子从树脂封装向外引导; 与半导体芯片的底面接触的接地金属膜; 以及连接到接地金属膜并从树脂封装向外引导的接地通道。