公开(公告)号：US20100044863A1

公开(公告)日：2010-02-25

申请号：US12311027

申请日：2007-12-20

申请人： Masaki Kasai ,  Hiroshi Okumura

发明人： Masaki Kasai ,  Hiroshi Okumura

IPC分类号： H01L23/498

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/3171 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05007 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05082 ,  H01L2224/05541 ,  H01L2224/05547 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/19043 ,  H01L2924/207 ,  H01L2924/00

摘要： An inventive semiconductor device includes: a semiconductor chip; an internal pad provided on a surface of the semiconductor chip for electrical connection; a surface protective film covering the surface of the semiconductor chip and having a pad opening from which the internal pad is exposed; a stress relief layer provided on the surface protective film and having an opening portion through which the internal pad exposed from the pad opening is exposed; a connection pad including an anchor buried in the pad opening and the opening portion and connected to the internal pad, and a projection provided integrally with the anchor as projecting on the stress relief layer, the projection having a width greater than an opening width of the opening portion; and a metal ball provided for external electrical connection as covering the projection of the connection pad.

摘要翻译： 本发明的半导体器件包括：半导体芯片; 设置在所述半导体芯片的表面上用于电连接的内部焊盘; 覆盖半导体芯片的表面并具有衬垫开口的表面保护膜，内部焊盘从该开口露出; 设置在所述表面保护膜上并具有开口部的应力消除层，从所述焊盘开口露出的所述内部焊盘暴露在所述开口部中; 连接垫，其包括埋在所述焊盘开口中的锚固件和所述开口部分并且连接到所述内部焊盘;以及突出部，其与所述锚固件一体地突出设置在所述应力消除层上，所述突出部的宽度大于所述 开口部分 以及设置用于外部电连接的金属球，以覆盖连接垫的突起。

公开(公告)号：US08446008B2

公开(公告)日：2013-05-21

申请号：US12311027

申请日：2007-12-20

申请人： Masaki Kasai ,  Hiroshi Okumura

发明人： Masaki Kasai ,  Hiroshi Okumura

IPC分类号： H01L23/48

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/3171 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05007 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05082 ,  H01L2224/05541 ,  H01L2224/05547 ,  H01L2224/05552 ,  H01L2224/05557 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/19043 ,  H01L2924/207 ,  H01L2924/00

摘要： An inventive semiconductor device includes: a semiconductor chip; an internal pad provided on a surface of the semiconductor chip for electrical connection; a surface protective film covering the surface of the semiconductor chip and having a pad opening from which the internal pad is exposed; a stress relief layer provided on the surface protective film and having an opening portion through which the internal pad exposed from the pad opening is exposed; a connection pad including an anchor buried in the pad opening and the opening portion and connected to the internal pad, and a projection provided integrally with the anchor as projecting on the stress relief layer, the projection having a width greater than an opening width of the opening portion; and a metal ball provided for external electrical connection as covering the projection of the connection pad.

公开(公告)号：US20160329548A1

公开(公告)日：2016-11-10

申请号：US15096500

申请日：2016-04-12

申请人： Aya Harada ,  Eiji Hojo ,  Yasuhide Nakayama ,  Shin Osaki ,  Hiroshi Okumura ,  Katsuya Noguchi

发明人： Aya Harada ,  Eiji Hojo ,  Yasuhide Nakayama ,  Shin Osaki ,  Hiroshi Okumura ,  Katsuya Noguchi

IPC分类号： H01M2/30 ,  H01M2/02

CPC分类号： H01M2/305 ,  H01M2/0242 ,  H01M2/30 ,  H01M2220/20 ,  H01R43/00 ,  Y10T29/49208

摘要： A storage battery includes a terminal portion for storage batteries having a plurality of bolt insertion holes bored in one or a plurality of directions, a nut insertion opening through which a nut is inserted, a hollow in communication with the bolt insertion holes and the nut insertion opening and the nut having at least one screw hole threaded in a direction coincident with at least one or the plurality of directions. A fixation portion is formed to fix the nut by deforming the terminal portion with the nut being inserted through the nut insertion opening into the hollow and the at least one screw hole of the nut being in communication respectively with the at least one of the plurality of bolt insertion holes.

摘要翻译： 蓄电池包括：具有多个在一个或多个方向上钻孔的螺栓插入孔的蓄电池的端子部分，插入有螺母的螺母插入口，与螺栓插入孔连通的中空部， 所述螺母具有沿与至少一个或多个方向一致的方向螺纹的至少一​​个螺纹孔。 固定部分形成为通过使螺母插入通过螺母插入口进入中空部的螺母使端子部分变形来固定螺母，并且螺母的至少一个螺纹孔分别与多个 螺栓插孔。

公开(公告)号：US09263406B2

公开(公告)日：2016-02-16

申请号：US13509264

申请日：2010-11-09

申请人： Hiroshi Okumura

发明人： Hiroshi Okumura

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L23/552 ,  H01L29/06 ,  H01L23/525

CPC分类号： H01L24/13 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/525 ,  H01L23/552 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/94 ,  H01L29/0657 ,  H01L2221/6834 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/0502 ,  H01L2224/05099 ,  H01L2224/05541 ,  H01L2224/05555 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/141 ,  H01L2224/94 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device according to the present invention includes a semiconductor chip having a front surface and a rear surface, a sealing resin layer stacked on the front surface of the semiconductor chip, a post passing through the sealing resin layer in the thickness direction and having a side surface flush with a side surface of the sealing resin layer and a forward end surface flush with a front surface of the sealing resin layer, and an external connecting terminal provided on the forward end surface of the post.

摘要翻译： 根据本发明的半导体器件包括具有前表面和后表面的半导体芯片，层叠在半导体芯片的前表面上的密封树脂层，沿厚度方向穿过密封树脂层的柱，并且具有 侧表面与密封树脂层的侧表面齐平，前端表面与密封树脂层的前表面齐平，以及设置在柱的前端表面上的外部连接端子。

公开(公告)号：US08643180B2

公开(公告)日：2014-02-04

申请号：US12003424

申请日：2007-12-26

申请人： Hiroyuki Shinkai ,  Hiroshi Okumura

发明人： Hiroyuki Shinkai ,  Hiroshi Okumura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor device of the present invention includes a semiconductor chip; an internal pad for electrical connection formed on a surface of the semiconductor chip; a stress relaxation layer formed on the semiconductor chip and having an opening for exposing the internal pad; an under-bump layer formed so as to cover a face exposed in the opening on the internal pad, an inner face of the opening and a circumference of the opening on the stress relaxation layer; a solder terminal for electrical connection with outside formed on the under-bump layer; and a protective layer formed on the stress relaxation layer, encompassing a periphery of the under-bump layer and covering a side face of the under-bump layer.

摘要翻译： 本发明的半导体器件包括半导体芯片; 用于电连接的内部焊盘，形成在所述半导体芯片的表面上; 形成在所述半导体芯片上并且具有用于使所述内部焊盘露出的开口的应力松弛层; 形成为覆盖露出在内部焊盘上的开口中的面的凸起下层，开口的内表面和应力松弛层上的开口的周边; 用于与凹凸层上形成的外部电连接的焊接端子; 以及形成在所述应力松弛层上的保护层，包围所述凸点下层的周边并覆盖所述凸点下层的侧面。

公开(公告)号：US20130107152A1

公开(公告)日：2013-05-02

申请号：US13807405

申请日：2011-04-20

申请人： Hiroshi Okumura

发明人： Hiroshi Okumura

IPC分类号： G02F1/133

CPC分类号： G02F1/13306 ,  G09G3/3677 ,  G09G2310/067 ,  G09G2320/0219 ,  G09G2320/0233

摘要： A liquid crystal display device (1) includes: a plurality of groups of scanning lines (Gia) and (Gib) via which gate signals are outputted to a plurality of pixels (PIX); and scanning line driving circuits (5a) and (5b) which generate the gate signals and which are disposed for each separate one of a plurality of groups of scanning lines (Gia) and (Gib), the liquid crystal display device (1) further including potential control circuits (15a) and (15b), placed in front of the scanning line driving circuits (5a) and (5b), respectively which incline, for each separate one of the groups of scanning lines (Gia) and (Gib), falling edges of high-potential signals (VGH1) and (VGH2) in accordance with which the gate signals are generated and which are composed of pulse waves. This prevents luminance unevenness from occurring in each display region.

摘要翻译： 液晶显示装置（1）包括：多个扫描线组（Gia）和（Gib）组，通过该组扫描线将栅极信号输出到多个像素（PIX）; 和扫描线驱动电路（5a）和（5b），所述扫描线驱动电路（5a）和（5b）产生所述栅极信号，并且被设置用于多组扫描线（Gia）和（Gib）中的每一个分离的所述液晶显示装置（1） 包括对于扫描线组（Gia）和（Gib）中的每一个分别放置在扫描线驱动电路（5a）和（5b）的前面的电位控制电路（15a）和（15b） ，根据其生成栅极信号并由脉冲波组成的高电位信号（VGH1）和（VGH2）的下降沿。 这防止了在每个显示区域中发生亮度不均匀。

公开(公告)号：US20060246632A1

公开(公告)日：2006-11-02

申请号：US10558073

申请日：2004-03-15

申请人： Hiroshi Okumura

发明人： Hiroshi Okumura

IPC分类号： H01L21/84 ,  H01L21/00 ,  H01L29/04 ,  H01L29/10 ,  H01L31/00

CPC分类号： H01L21/02675 ,  H01L21/2026 ,  H01L27/12 ,  H01L27/1251 ,  H01L27/1281 ,  H01L29/04 ,  H01L29/66757 ,  H01L29/78606 ,  H01L29/78609 ,  H01L29/78621 ,  H01L29/78675 ,  H01L29/78696

摘要： A TFT and the like capable of realizing performances such as a low threshold voltage value, high carrier mobility and a low leak current easily. A TFT consists of a polycrystalline Si film having a small heat capacity part and a large heat capacity part, and the small heat capacity part is used at least as a channel part. The polycrystalline Si film is formed of a crystal grain film through laser annealing of an energy density with which the small heat capacity part melts completely but the large heat capacity part does not melt completely. Since the channel part is formed of large crystal grains grown from the boundaries between the small heat capacity part and the large heat capacity parts, it is possible to realize performances such as a low threshold voltage value, high carrier mobility and a low leak current by using a typical laser annealing device.

摘要翻译： 能够容易地实现低阈值电压值，高载流子迁移率和低泄漏电流等性能的TFT等。 TFT由具有小热容部分和大热容部分的多晶Si膜组成，并且小热容部分至少用作通道部分。 多晶硅膜通过激光退火由能量密度形成，其中小热量部分完全熔化，但是大的热容部分不会完全熔化。 由于通道部分由从小热容部分和大热容部分之间的边界生长的大晶粒形成，所以可以通过以下方式实现诸如低阈值电压值，高载流子迁移率和低泄漏电流的性能 使用典型的激光退火装置。

公开(公告)号：US07123337B2

公开(公告)日：2006-10-17

申请号：US11110081

申请日：2005-04-19

申请人： Hiroshi Okumura ,  Masayoshi Suzuki

发明人： Hiroshi Okumura ,  Masayoshi Suzuki

IPC分类号： G02F1/1335 ,  G02F1/1368

CPC分类号： G02F1/1393 ,  G02F1/133526 ,  G02F2001/133638

摘要： A LCD device is provided. On the input side, the collimated-light generator generates collimated light from incident light and then, the first polarizer plate of the first polarized-light controller generates first polarized light from the collimated light. The first quarter wavelength plate of the first polarized-light controller generates second polarized light from the first polarized light. The second polarized light thus generated passes through the liquid crystal layer to reach the output side. On the output side, the second polarized light passes through the second quarter wavelength plate of the second polarized-light controller and the second quarter wavelength plate thereof. Thus, the polarization state of the second polarized light is returned to its original one.

公开(公告)号：US20050190318A1

公开(公告)日：2005-09-01

申请号：US11110081

申请日：2005-04-19

申请人： Hiroshi Okumura ,  Masayoshi Suzuki

发明人： Hiroshi Okumura ,  Masayoshi Suzuki

IPC分类号： G02B5/02 ,  G02B1/04 ,  G02B3/00 ,  G02B5/20 ,  G02B5/30 ,  G02F1/1334 ,  G02F1/1335 ,  G02F1/13363 ,  G02F1/139

CPC分类号： G02F1/1393 ,  G02F1/133526 ,  G02F2001/133638

摘要： A LCD device is provided. On the input side, the collimated-light generator generates collimated light from incident light and then, the first polarizer plate of the first polarized-light controller generates first polarized light from the collimated light. The first quarter wavelength plate of the first polarized-light controller generates second polarized light from the first polarized light. The second polarized light thus generated passes through the liquid crystal layer to reach the output side. On the output side, the second polarized light passes through the second quarter wavelength plate of the second polarized-light controller and the second quarter wavelength plate thereof. Thus, the polarization state of the second polarized light is returned to its original one.

摘要翻译： 提供LCD装置。 在输入侧，准直光发生器从入射光产生准直光，然后第一偏振光控制器的第一偏振板从准直光产生第一偏振光。 第一偏振光控制器的第一四分之一波长板产生来自第一偏振光的第二偏振光。 这样产生的第二偏振光通过液晶层到达输出侧。 在输出侧，第二偏振光通过第二偏振光控制器的第二四分之一波长板和第二偏振光控制器的第二四分之一波长板。 因此，第二偏振光的偏振状态返回到原来的偏振态。

公开(公告)号：US06372039B1

公开(公告)日：2002-04-16

申请号：US09273489

申请日：1999-03-22

申请人： Hiroshi Okumura ,  Hiroshi Tanabe

发明人： Hiroshi Okumura ,  Hiroshi Tanabe

IPC分类号： C30B2802

CPC分类号： H01L21/02686 ,  B23K26/06 ,  B23K26/0604 ,  B23K26/0608 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/066 ,  B23K26/0665 ,  B23K26/067 ,  C30B1/023 ,  C30B29/06 ,  H01L21/02691 ,  H01L21/2026

摘要： A method and device for irradiating a pulse laser beam having a linear shape and a rectangular shape beam spot onto a non-single crystal semiconductor thin film. The method includes scanning the pulse laser beam so that previous and next beam spots are partially overlapped. The laser beam has a profile which includes: a first beam profile region having a first energy density which is lower than a micro-crystallization threshold value Ea of an amorphous semiconductor for forming a polycrystallization region; a second beam profile region having a second energy density which is not lower than the micro-crystallization threshold value Ea and is lower than a micro-crystallization threshold value Ep of a polycrystalline semiconductor for forming a first micro-polycrystallization region from an amorphous semiconductor region; and a third beam profile region having a third energy density which is not lower than the micro-crystallization threshold value Ep for forming a second micro-polycrystallization region from a polycrystalline semiconductor region.

摘要翻译： 一种用于将具有线性形状和矩形形状的光斑的脉冲激光束照射到非单晶半导体薄膜上的方法和装置。 该方法包括扫描脉冲激光束，使得前一个和下一个光束点部分重叠。 激光束具有轮廓，该轮廓包括：具有低于用于形成多晶化区域的非晶半导体的微结晶阈值Ea的第一能量密度的第一光束轮廓区域; 第二光束轮廓区域，其具有不低于微结晶阈值Ea的第二能量密度，并且低于用于从非晶半导体区域形成第一微多晶结晶区域的多晶半导体的微结晶阈值Ep ; 以及具有不低于用于形成来自多晶半导体区域的第二微多晶结晶区域的微结晶阈值Ep的第三能量密度的第三光束轮廓区域。