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12 条记录 (耗时 0.028 秒)

    BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAPTURING METHOD, AND SOLDER BALL DISPOSING METHOD
    1.
    发明申请
    BALL CAPTURING APPARATUS, SOLDER BALL DISPOSING APPARATUS, BALL CAPTURING METHOD, AND SOLDER BALL DISPOSING METHOD 有权
    球拍装置，焊球处理装置，球拍方法和焊球处理方法

    公开(公告)号：US20080020561A1

    公开(公告)日：2008-01-24

    申请号：US11864600

    申请日：2007-09-28

    申请人： Masanao FUJII ,  Toru OKADA ,  Yutaka NODA ,  Ryoji MATSUYAMA ,  Hidehiko KOBAYASHI ,  Hisao TANAKA

    发明人： Masanao FUJII ,  Toru OKADA ,  Yutaka NODA ,  Ryoji MATSUYAMA ,  Hidehiko KOBAYASHI ,  Hisao TANAKA

    IPC分类号： H01L21/44

    CPC分类号： H01L21/4853 ,  B23K3/0623 ,  H01L2224/11334 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/081 ,  H05K2203/082

    摘要： The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding member 111 including a holding wall 111a air-tightly closing a space S that holds a plurality of balls B having the same size and in which a hole 1111 larger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup means 112 for blowing the balls B held in the holding member 111 upward; and capturing means 12 for capturing a ball B blown up by the blowup means 112 and reached the hole.

    摘要翻译： 本发明涉及一种从具有相同尺寸的多个球捕获一个球的球捕获装置和方法，以及一种焊球设置装置和将含有焊料的焊球放置在电路板上的预定位置的方法，从而可靠地 从具有相同尺寸的多个球捕获一个球。 该装置包括：保持构件111，其包括保持壁111，气密地封闭保持具有相同尺寸的多个球B的空间S，并且其中具有大于一个球的尺寸的孔1111并且小于一个球的尺寸 两个球形成在保持壁的上部; 用于将保持在保持构件111中的球B向上吹的吹出装置112; 以及捕获装置12，用于捕获由喷射装置112吹起的球B并到达该孔。

    MICRO COMPONENT REMOVING METHOD AND MICRO COMPONENT REMOVING APPARATUS
    2.
    发明申请
    MICRO COMPONENT REMOVING METHOD AND MICRO COMPONENT REMOVING APPARATUS 有权
    微元件拆卸方法和微型元件拆卸设备

    公开(公告)号：US20080099536A1

    公开(公告)日：2008-05-01

    申请号：US11966410

    申请日：2007-12-28

    申请人： Keiichi YAMAMOTO ,  Masakazu TAKESUE ,  Masanao FUJII ,  Toru OKADA

    发明人： Keiichi YAMAMOTO ,  Masakazu TAKESUE ,  Masanao FUJII ,  Toru OKADA

    IPC分类号： B23K1/018 ,  B23K1/20

    CPC分类号： H05K3/303 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2203/0195 ,  H05K2203/176 ,  Y02P70/613

    摘要： A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

    摘要翻译： 一种用于清除微量部件并且保持在衬底上的焊料平整化的方法和装置，而不会对焊盘，衬底和周边部件造成热损伤。 在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有横截面积 落在微型部件（12）的与表面（11）侧相反的表面（12a）内的部分通过热固性粘合剂（15）以抵靠微型部件（12）的表面（12a） 。 随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。 因此，从基板（11）移除微型部件（12）。

    MICRO COMPONENT REMOVING METHOD
    3.
    发明申请
    MICRO COMPONENT REMOVING METHOD 有权
    微元件拆卸方法

    公开(公告)号：US20100213248A1

    公开(公告)日：2010-08-26

    申请号：US12774881

    申请日：2010-05-06

    申请人： Keiichi YAMAMOTO ,  Masakazu TAKESUE ,  Masanao FUJII ,  Toru OKADA

    发明人： Keiichi YAMAMOTO ,  Masakazu TAKESUE ,  Masanao FUJII ,  Toru OKADA

    IPC分类号： B23K1/018

    CPC分类号： H05K3/303 ,  H05K3/3494 ,  H05K13/0486 ,  H05K2203/0195 ,  H05K2203/176 ,  Y02P70/613

    摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

    摘要翻译： 一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。 在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降 在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。 随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。 因此，从基板（11）移除微型部件（12）。

    POULTRY DIET FOR IMPROVING TEXTURE
    4.
    发明申请
    POULTRY DIET FOR IMPROVING TEXTURE 审中-公开
    POULTRY DIET改善纹理

    公开(公告)号：US20110064844A1

    公开(公告)日：2011-03-17

    申请号：US12878685

    申请日：2010-09-09

    申请人： Shinobu FUJIMURA ,  Motoni KADOWAKI ,  Hitomi TOJO ,  Toru OKADA

    发明人： Shinobu FUJIMURA ,  Motoni KADOWAKI ,  Hitomi TOJO ,  Toru OKADA

    IPC分类号： A23K1/18

    CPC分类号： A23K50/75 ,  A23K20/179

    摘要： The present invention aims to provide a poultry diet that can soften the flesh quality of poultry meat and improve the texture, a method of producing a large amount of meat with improved texture by using the diet, and a breeding method of poultry having flesh quality with good texture, and a flesh quality softening agent for poultry to be used by addition to feed.Astaxanthin is contained in a diet to give a poultry diet for improving texture. The present invention can improve texture by decreasing the shear force of poultry meat by breeding the poultry on the diet.

    摘要翻译： 本发明的目的在于提供一种能够软化家禽肉的肉质并提高其质地的家禽饮食，通过使用饮食生产大量具有改善的质地的肉的方法，以及具有肉质的家禽的育种方法 良好的质地，以及用于饲料添加的家禽肉质量的柔软剂。 虾青素被包含在饮食中以提供家禽饮食以改善质地。 本发明可以通过在家禽饲养中减少家禽肉的剪切力来改善质地。

    PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD
    5.
    发明申请
    PACKAGING STRUCTURE, PRINTED CIRCUIT BOARD ASSEMBLY AND FIXING METHOD 审中-公开
    包装结构，印刷电路板组件和固定方法

    公开(公告)号：US20110303449A1

    公开(公告)日：2011-12-15

    申请号：US13044876

    申请日：2011-03-10

    申请人： Hiroshi KOBAYASHI ,  Toru OKADA ,  Satoshi EMOTO ,  Masayuki KITAJIMA

    发明人： Hiroshi KOBAYASHI ,  Toru OKADA ,  Satoshi EMOTO ,  Masayuki KITAJIMA

    IPC分类号： H05K1/18 ,  H05K3/30

    CPC分类号： H05K3/3436 ,  H01L2224/16225 ,  H05K2201/09063 ,  H05K2201/10393 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913

    摘要： A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion.

    摘要翻译： 提供了一种用于将电子部件安装在印刷电路板上的封装结构，其包括连接到印刷电路板的电极焊盘的电子部件的外部连接端子; 穿过印刷电路板的通孔，形成在电子部件安装区域的周边的通孔; 以及夹持构件，其包括延伸穿过所述通孔的中间部分，以及从所述中间部分延伸的第一端部部分和第二端部部分。 第一端部和第二端部弯曲，使得电子部件和印刷电路板被第一端部和第二端部夹持并夹持。

    REPAIR APPARATUS AND METHOD FOR ELECTRONIC COMPONENT AND HEAT-TRANSFER CAP
    6.
    发明申请
    REPAIR APPARATUS AND METHOD FOR ELECTRONIC COMPONENT AND HEAT-TRANSFER CAP 审中-公开
    电子部件和传热帽的修理装置和方法

    公开(公告)号：US20110240720A1

    公开(公告)日：2011-10-06

    申请号：US13037777

    申请日：2011-03-01

    申请人： Toru OKADA ,  Hiroshi KOBAYASHI

    发明人： Toru OKADA ,  Hiroshi KOBAYASHI

    IPC分类号： B23K1/018 ,  B23K3/04 ,  B23K3/08

    CPC分类号： H05K13/0486 ,  B23K1/018 ,  H01L24/799 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00

    摘要： A repair apparatus is provided which is configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board. The repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section. The heat-transfer section is configured to contact the electronic component, and transfer a heat generated from the light in the light-receiving section to the electronic component.

    摘要翻译： 提供了一种修复装置，其被配置为熔化电子部件的焊接部分以从印刷线路板移除电子部件。 修复装置包括被配置为照射光的光源和包括光接收部和传热部的传热帽。 传热部被配置为与电子部件接触，并且将从光接收部中的光产生的热量传递到电子部件。

    BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE
    10.
    发明申请
    BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE 有权
    板材加固结构，板组件和电子设备

    公开(公告)号：US20110303441A1

    公开(公告)日：2011-12-15

    申请号：US13075895

    申请日：2011-03-30

    申请人： Hiroshi KOBAYASHI ,  Satoshi EMOTO ,  Masayuki KITAJIMA ,  Toru OKADA

    发明人： Hiroshi KOBAYASHI ,  Satoshi EMOTO ,  Masayuki KITAJIMA ,  Toru OKADA

    IPC分类号： H05K1/03

    CPC分类号： H05K3/3436 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2009 ,  Y02P70/613

    摘要： Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

    摘要翻译： 公开了一种用于加强其中电子部件安装在第一表面上的电路板的电路板加强结构，该电子部件具有布置在第一表面上的矩形区域中的电极。 板加强结构包括加强构件，该加强构件在设置在与电路板的第一表面相对的一侧上的第二表面上接合到与矩形区域的四个角的角部相对应的位置。 在板加强结构中，在加强构件中，在与矩形区域的四个角的一个角部相对应的位置处形成相应的一个切口，并且加强构件的至少两个顶点指向外部 形成为与其中一个凹口成形其轮廓。