公开(公告)号：US20110089579A1

公开(公告)日：2011-04-21

申请号：US12902527

申请日：2010-10-12

申请人： Masateru KOIDE ,  Daisuke MIZUTANI ,  Aiichiro INOUE ,  Hideo YAMASHITA ,  Iwao YAMAZAKI ,  Masayuki KATO ,  Seiji UENO ,  Kazuyuki IMAMURA

发明人： Masateru KOIDE ,  Daisuke MIZUTANI ,  Aiichiro INOUE ,  Hideo YAMASHITA ,  Iwao YAMAZAKI ,  Masayuki KATO ,  Seiji UENO ,  Kazuyuki IMAMURA

IPC分类号： H01L23/52

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.

摘要翻译： 多芯片模块包括：板; 布线板，其布置在所述板上并且包括布线图案; 以及配置在配线基板上的多个芯片。 多个芯片中的每一个与其他芯片中的至少一个连接，并且多个芯片和板通过布线板的布线图案之外的部分彼此电连接。

公开(公告)号：US20110044015A1

公开(公告)日：2011-02-24

申请号：US12852696

申请日：2010-08-09

申请人： Masateru KOIDE ,  Daisuke MIZUTANI

发明人： Masateru KOIDE ,  Daisuke MIZUTANI

IPC分类号： H05K7/02 ,  H05K3/36

CPC分类号： H01L23/147 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15192 ,  H01L2924/15311 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/05599

摘要： A multichip module comprising: a base substrate; a wiring board disposed on the base substrate and having a wiring pattern; an adhesive layer configured to bond the base substrate to the wiring board while maintaining an electrical connection between the base substrate and the wiring board; and a plurality of chips connected to a surface of the wiring board, the surface being opposite the adhesive layer, wherein, assuming that α is a coefficient of thermal expansion of the wiring board, β is a coefficient of thermal expansion of the base substrate, and γ is a coefficient of thermal expansion of the adhesive layer, the relationship α

摘要翻译： 一种多芯片模块，包括：基底; 布线板，设置在基底基板上并具有布线图案; 粘合层，其被配置为将基底基板粘合到布线板，同时保持基底基板和布线板之间的电连接; 以及与所述布线板的表面连接的多个芯片，所述表面与所述粘合剂层相对，其中，假设所述布线基板的热膨胀系数α为αbgr; 是基材的热膨胀系数，γ是粘合剂层的热膨胀系数，α<γ<＆bgr; 满意

公开(公告)号：US20110084383A1

公开(公告)日：2011-04-14

申请号：US12903403

申请日：2010-10-13

申请人： Daisuke MIZUTANI

发明人： Daisuke MIZUTANI

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H05K1/147 ,  H01L21/76898 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/222 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

摘要： A semiconductor device includes a first circuit base member including a surface having multiple first electrodes formed thereon, a second circuit base member being provided above the first circuit base member and having first through holes and second through holes formed respectively above the first electrodes, a semiconductor package provided above the second circuit base member, and multiple first bumps provided inside the first through holes and the second through holes to connect the first electrodes to the semiconductor package.

摘要翻译： 半导体器件包括：第一电路基体部件，其包括形成有多个第一电极的表面;第二电路基体部件，设置在第一电路基体的上方，并具有分别形成在第一电极上方的第一通孔和第二通孔; 设置在第二电路基体上方的封装，以及设置在第一通孔内的多个第一凸起和第二通孔，以将第一电极连接到半导体封装。

公开(公告)号：US20090090543A1

公开(公告)日：2009-04-09

申请号：US12243500

申请日：2008-10-01

申请人： Masaharu FURUYAMA ,  Daisuke MIZUTANI ,  Seiki SAKUYAMA ,  Toshiya AKAMATSU

发明人： Masaharu FURUYAMA ,  Daisuke MIZUTANI ,  Seiki SAKUYAMA ,  Toshiya AKAMATSU

IPC分类号： H05K1/09 ,  H05K3/10 ,  H05K1/16

CPC分类号： H05K3/10 ,  H01L23/49811 ,  H01L2224/13023 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/1105 ,  H01L2924/00

摘要： There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.

摘要翻译： 提供了一种电路板，由不含铅（Pb）的焊料组成的焊球将连接到该电路板上，包括电极的半导体器件和由设置在电极上的无铅焊料组成的焊球 以及通过提高由无铅焊料（Pb）构成的焊料球与电极之间的接合强度（粘合强度）可以提高安装可靠性的半导体装置的制造方法。