公开(公告)号：US07754534B2

公开(公告)日：2010-07-13

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US07268433B2

公开(公告)日：2007-09-11

申请号：US11256273

申请日：2005-10-24

申请人： Yoshihiro Matsuoka ,  Kazuyuki Imamura ,  Masao Oshima ,  Takashi Suzuki ,  Toyoji Sawada

发明人： Yoshihiro Matsuoka ,  Kazuyuki Imamura ,  Masao Oshima ,  Takashi Suzuki ,  Toyoji Sawada

IPC分类号： H01L23/482 ,  H01L23/485

CPC分类号： H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05011 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H01L2924/00014

摘要： A wiring layer is provided on a semiconductor substrate and extends in a predetermined direction. An external connection electrode terminal is provided on the wiring layer through a plurality of column-shaped conductors. The column-shaped conductors are located under the external connection electrode terminal. A density of arrangement of the column-shaped conductors is varied according to a direction of extension of the wiring layer.

摘要翻译： 布线层设置在半导体基板上并沿预定方向延伸。 外部连接电极端子通过多个列状导体设置在布线层上。 柱状导体位于外部连接电极端子的下方。 柱状导体的排列密度根据布线层的延伸方向而变化。

公开(公告)号：US20070001317A1

公开(公告)日：2007-01-04

申请号：US11256273

申请日：2005-10-24

申请人： Yoshihiro Matsuoka ,  Kazuyuki Imamura ,  Masao Oshima ,  Takashi Suzuki ,  Toyoji Sawada

发明人： Yoshihiro Matsuoka ,  Kazuyuki Imamura ,  Masao Oshima ,  Takashi Suzuki ,  Toyoji Sawada

IPC分类号： H01L21/44 ,  H01L23/48

CPC分类号： H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/05001 ,  H01L2224/05011 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/3025 ,  H01L2924/00014

摘要： A wiring layer is provided on a semiconductor substrate and extends in a predetermined direction. An external connection electrode terminal is provided on the wiring layer through a plurality of column-shaped conductors. The column-shaped conductors are located under the external connection electrode terminal. A density of arrangement of the column-shaped conductors is varied according to a direction of extension of the wiring layer.

公开(公告)号：US20110089579A1

公开(公告)日：2011-04-21

申请号：US12902527

申请日：2010-10-12

申请人： Masateru KOIDE ,  Daisuke MIZUTANI ,  Aiichiro INOUE ,  Hideo YAMASHITA ,  Iwao YAMAZAKI ,  Masayuki KATO ,  Seiji UENO ,  Kazuyuki IMAMURA

发明人： Masateru KOIDE ,  Daisuke MIZUTANI ,  Aiichiro INOUE ,  Hideo YAMASHITA ,  Iwao YAMAZAKI ,  Masayuki KATO ,  Seiji UENO ,  Kazuyuki IMAMURA

IPC分类号： H01L23/52

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.

摘要翻译： 多芯片模块包括：板; 布线板，其布置在所述板上并且包括布线图案; 以及配置在配线基板上的多个芯片。 多个芯片中的每一个与其他芯片中的至少一个连接，并且多个芯片和板通过布线板的布线图案之外的部分彼此电连接。

公开(公告)号：US06566748B1

公开(公告)日：2003-05-20

申请号：US09615728

申请日：2000-07-13

申请人： Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaharu Minamizawa

发明人： Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaharu Minamizawa

IPC分类号： H01L2312

CPC分类号： H01L23/06 ,  H01L21/563 ,  H01L23/04 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105

摘要： A BGA semiconductor device includes a package substrate carrying thereon a semiconductor chip in a face-down state and a cap member covering the semiconductor chip on the package substrate, wherein the cap member has a optimized Young modulus smaller than about 20 GPa and a thermal conductivity exceeding about 100 W/(m·K).

摘要翻译： BGA半导体器件包括在其上承载有面朝下状态的半导体芯片的封装基板和覆盖封装基板上的半导体芯片的盖构件，其中该盖构件具有小于约20GPa的优化的杨氏模量和导热系数 超过100W /（mK）。

公开(公告)号：US08446020B2

公开(公告)日：2013-05-21

申请号：US12902527

申请日：2010-10-12

申请人： Masateru Koide ,  Daisuke Mizutani ,  Aiichiro Inoue ,  Hideo Yamashita ,  Iwao Yamazaki ,  Masayuki Kato ,  Seiji Ueno ,  Kazuyuki Imamura

发明人： Masateru Koide ,  Daisuke Mizutani ,  Aiichiro Inoue ,  Hideo Yamashita ,  Iwao Yamazaki ,  Masayuki Kato ,  Seiji Ueno ,  Kazuyuki Imamura

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/0001 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.

摘要翻译： 多芯片模块包括：板; 布线板，其布置在所述板上并且包括布线图案; 以及配置在配线基板上的多个芯片。 多个芯片中的每一个与其他芯片中的至少一个连接，并且多个芯片和板通过布线板的布线图案之外的部分彼此电连接。

公开(公告)号：US20090297645A1

公开(公告)日：2009-12-03

申请号：US12083834

申请日：2006-10-17

申请人： Azuma Watanabe ,  Kazuyuki Imamura

发明人： Azuma Watanabe ,  Kazuyuki Imamura

IPC分类号： A61K36/87 ,  A61K8/97 ,  A61P17/16

CPC分类号： A61K36/87 ,  A61K8/97 ,  A61K2800/70 ,  A61L27/60 ,  A61Q19/08

摘要： The present invention relates to a fibroblast activator comprising grape sap as an active ingredient, a method of activating a fibroblast, using grape sap, and a method of using grape sap as a fibroblast activator. The present invention further relates to a collagen synthesis promoter comprising grape sap as an active ingredient, a method of promoting collagen synthesis using grape sap, and a method of using grape sap as a collagen synthesis promoter. The present invention further relates to a skin antiaging agent comprising grape sap as an active ingredient, a method of preventing aging of skin using grape sap, and a method of using grape sap as a skin antiaging agent. The present invention provides highly safe and effective means of preventing aging.

摘要翻译： 本发明涉及包含葡萄汁作为活性成分的成纤维细胞激活剂，使用葡萄汁激活成纤维细胞的方法，以及使用葡萄汁作为成纤维细胞激活剂的方法。 本发明还涉及包含葡萄汁作为活性成分的胶原合成促进剂，使用葡萄汁促进胶原合成的方法，以及使用葡萄汁作为胶原合成促进剂的方法。 本发明还涉及包含葡萄汁作为活性成分的皮肤抗衰老剂，使用葡萄汁防止皮肤老化的方法，以及使用葡萄汁作为皮肤抗老化剂的方法。 本发明提供了防止老化的高度安全和有效的手段。

公开(公告)号：US20080261336A1

公开(公告)日：2008-10-23

申请号：US12081723

申请日：2008-04-21

申请人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

发明人： Nobukatsu Saito ,  Masaharu Minamizawa ,  Yoshiyuki Yoneda ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Tadahiro Okamoto ,  Eiji Watanabe

IPC分类号： H01L21/66 ,  H01L21/56

CPC分类号： H01L21/6836 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05571 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75315 ,  H01L2224/75755 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor device using a wiring substrate is provided which can facilitate the handling of the wiring substrate. The method includes the steps of forming a peelable resin layer on a silicon substrate, forming the wiring substrate on the peelable resin layer, mounting semiconductor chips on the wiring substrate, forming semiconductor devices by sealing the plurality of semiconductor chips by a sealing resin, individualizing the semiconductor devices by dicing the semiconductor devices from the sealing resin side but leaving the silicon substrate, peeling each of the individualized semiconductor devices from the silicon substrate between the silicon substrate and the peelable resin layer, and exposing terminals on the wiring substrate by forming openings through the peelable resin layer or by removing the peelable resin layer.

摘要翻译： 提供一种使用布线基板制造半导体器件的方法，其可以有助于布线基板的处理。 该方法包括以下步骤：在硅基板上形成可剥离树脂层，在可剥离树脂层上形成布线基板，在布线基板上安装半导体芯片，通过密封树脂密封多个半导体芯片形成半导体器件， 半导体器件通过从密封树脂侧切割半导体器件但离开硅衬底，从硅衬底和可剥离树脂层之间的硅衬底剥离每个单独的半导体器件，并且通过形成开口 通过可剥离树脂层或通过除去可剥离树脂层。

公开(公告)号：US06875638B2

公开(公告)日：2005-04-05

申请号：US10100011

申请日：2002-03-19

申请人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

发明人： Yoshiyuki Yoneda ,  Masaharu Minamizawa ,  Nobutaka Shimizu ,  Kazuyuki Imamura ,  Atsushi Kikuchi ,  Masaru Nukiwa ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Takumi Ihara ,  Muneharu Morioka ,  Yukihiro Kuriki ,  Masaki Uchida

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/36 ,  H01L23/498 ,  H01L25/065 ,  H05K1/14 ,  H05K1/16 ,  H01L21/44

CPC分类号： H05K1/141 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/049 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.

摘要翻译： 包含无源元件的半导体器件的制造方法包括以下步骤：再分布板形成步骤在基板上形成包含无源元件的再分布板; 半导体元件安装步骤安装相对于基板在形成在再分布板的相对侧表面上的至少一个半导体元件; 基板分离步骤将基板与再分布板分离并暴露再分布板的另一个表面; 再分布板安装步骤通过从再分布板的另一表面暴露的电极焊盘将再分布板安装在封装板上。

公开(公告)号：US06796025B2

公开(公告)日：2004-09-28

申请号：US10084370

申请日：2002-02-28

申请人： Kazuyuki Imamura ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Toshiya Akamatsu

发明人： Kazuyuki Imamura ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Toshiya Akamatsu

IPC分类号： H05K334

CPC分类号： H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R4/04 ,  H01R43/0256 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the mounting substrate, the flux paste includes a base flux and metal grains having diameters smaller than the diameters of projection electrodes and having a thickness so as to form a space between the flux paste and the electronic part when the electronic part is mounted on the mounting substrate and the flux paste is arranged on the mounting substrate. A resin is sealed in the space formed between the electronic part and the mounting substrate after the projection electrodes are joined to the connection terminals.

摘要翻译： 在将电子部件安装在安装基板上的方法中，通过熔接焊接设置在电子部件上的突起电极来焊接设置在安装基板上的连接端子，焊剂膏包括基极焊剂和直径小于 投影电极的直径，并且当电子部件安装在安装基板上并且焊剂膏体被布置在安装基板上时具有厚度以形成焊剂糊和电子部件之间的空间。 在突起电极接合到连接端子之后，树脂被密封在形成在电子部件和安装基板之间的空间中。