公开(公告)号：US5829125A

公开(公告)日：1998-11-03

申请号：US698163

申请日：1996-08-07

申请人： Masayuki Fujimoto ,  Matsuo Nakazawa ,  Hiroshi Takahashi ,  Kazutaka Suzuki ,  Koichiro Isuzuku

发明人： Masayuki Fujimoto ,  Matsuo Nakazawa ,  Hiroshi Takahashi ,  Kazutaka Suzuki ,  Koichiro Isuzuku

IPC分类号： B23K1/005 ,  H01L21/60 ,  H01L23/13 ,  H01L23/485 ,  H01L25/18 ,  H05K3/34

CPC分类号： H01L23/13 ,  B23K1/0056 ,  H01L24/05 ,  H01L24/81 ,  H01L25/18 ,  H05K3/3494 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05566 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/05609 ,  H01L2224/05613 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/08057 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14155 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75262 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81385 ,  H01L2224/81405 ,  H01L2224/81409 ,  H01L2224/81413 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/8184 ,  H01L2224/81868 ,  H01L2224/81874 ,  H01L2224/83224 ,  H01L24/13 ,  H01L24/75 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/351 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2203/107 ,  H05K3/3431 ,  Y10T29/49144

摘要： The present invention relates to a method of manufacturing a circuit module through the use of a wireless bonding technique. In this invention, in order to achieve component assembly without experiencing thermal and mechanical stresses, in the circuit module manufacturing method in which an external electrode of a component and a conductor of a substrate are connected with each other according to the wireless bonding technique, the substrate has a laser beam transmissible property, and after the component is placed on an assembly surface of the substrate, a laser beam is applied from a surface of the substrate opposite to the assembly surface thereof to a connecting spot. The laser beam passing through the substrate heats the connecting spot so that the connection between the external electrode of the component and the conductor of the substrate is made by phase transition or diffusion.

摘要翻译： 本发明涉及通过使用无线接合技术制造电路模块的方法。 在本发明中，为了实现不经受热和机械应力的部件组装，在根据无线接合技术将部件的外部电极和基板的导体彼此连接的电路模块制造方法中， 基板具有激光束透射性质，并且在将部件放置在基板的组装表面上之后，将激光束从与其组装表面相对的基板的表面施加到连接点。 通过基板的激光束加热连接点，使得部件的外部电极与基板的导体之间的连接通过相变或扩散来制造。