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公开(公告)号：US07176506B2
公开(公告)日：2007-02-13
申请号：US10746810
申请日：2003-12-24
申请人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae M. Park , Yoichi Kubota
发明人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae M. Park , Yoichi Kubota
IPC分类号： H01L27/148
CPC分类号： G06F21/10 , G06F2221/2129 , H01F17/0033 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/36 , H01L23/3675 , H01L23/4334 , H01L23/49531 , H01L23/49575 , H01L23/49822 , H01L23/49838 , H01L23/49861 , H01L23/5387 , H01L23/552 , H01L23/645 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6611 , H01L2224/05569 , H01L2224/05571 , H01L2224/05573 , H01L2224/16145 , H01L2224/16235 , H01L2224/32245 , H01L2224/45014 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/4911 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85207 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19103 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/05599
摘要： A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.
摘要翻译： 射频芯片封装通过将诸如电路板的连接元件或其上具有芯片的柔性电路带与诸如引入框架的底部平面元件组合而形成，该引线框架包括大的导热板，并且从该平面 盘子。 组装步骤将芯片的后表面放置在连接元件的底侧，与导热体接近，并将连接元件上的导电迹线与导线连接。 所得的组件被封装，导致引线的底端处的端子被暴露。 封装的组件可以表面安装到电路板。 引线在连接元件和电路板之间提供牢固的电连接。
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公开(公告)号：US20070096160A1
公开(公告)日：2007-05-03
申请号：US11640765
申请日：2006-12-18
申请人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae Park , Yoichi Kubota
发明人： Masud Beroz , Michael Warner , Lee Smith , Glenn Urbish , Teck-Gyu Kang , Jae Park , Yoichi Kubota
IPC分类号： H01L27/148
摘要： A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.
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公开(公告)号：US08329581B2
公开(公告)日：2012-12-11
申请号：US13183122
申请日：2011-07-14
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号： H01L21/44
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US07453157B2
公开(公告)日：2008-11-18
申请号：US11140312
申请日：2005-05-27
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.
摘要翻译： 微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括多个蚀刻的导电柱，其暴露在所述柔性基板的表面处并与所述微电子元件电互连，其中所述导电柱中的至少一个设置在所述柔性基板的外部区域中，并且设置柔性层 在微电子元件的第一面和柔性基板之间，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的封装模具材料，由此封装模具材料覆盖在柔性基板的外部区域上。
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公开(公告)号：US20110269272A1
公开(公告)日：2011-11-03
申请号：US13183122
申请日：2011-07-14
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号： H01L21/56
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US20100258956A1
公开(公告)日：2010-10-14
申请号：US12789683
申请日：2010-05-28
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US07745943B2
公开(公告)日：2010-06-29
申请号：US11799771
申请日：2007-05-03
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US07999397B2
公开(公告)日：2011-08-16
申请号：US12789683
申请日：2010-05-28
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US20070205496A1
公开(公告)日：2007-09-06
申请号：US11799771
申请日：2007-05-03
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
IPC分类号： H01L23/02
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US20050285246A1
公开(公告)日：2005-12-29
申请号：US11140312
申请日：2005-05-27
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John Riley , Ilyas Mohammed
IPC分类号： H01L23/02 , H01L23/31 , H01L23/367 , H01L23/498 , H01L25/10
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.
摘要翻译： 微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括暴露在所述柔性基板的表面处并与所述微电子元件电互连的多个导电柱，其中至少一个所述导电柱设置在所述柔性基板的外部区域中，并且柔性层设置在所述柔性基板之间 微电子元件和柔性基板的第一面，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的支撑元件，由此支撑元件覆盖在柔性基板的外部区域上。
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