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    Methods of making microelectronic packages
    6.
    发明授权
    Methods of making microelectronic packages 有权
    制造微电子封装的方法

    公开(公告)号：US06959489B2

    公开(公告)日：2005-11-01

    申请号：US09956448

    申请日：2001-09-19

    申请人： Masud Beroz ,  Michael Warner

    发明人： Masud Beroz ,  Michael Warner

    IPC分类号： H05K13/04 ,  H05K3/34

    CPC分类号： H05K13/046 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2224/0401

    摘要： A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends permanently attached to the substrate and second ends remote from the terminal ends, the second ends being movable relative to the first ends of the leads. One or more microelectronic elements having contact bearing surfaces and back surfaces remote therefrom may be juxtaposed with the substrate and the contacts connected with the first ends of the leads. A substantially rigid plate may be attached to the back surfaces of the microelectronic elements. The substantially rigid plate may be moved to a precise height above the substrate to vertically extend the leads. While the plate is maintained at the precise height above the substrate, a spacer material is dispensed between the plate and the substrate. The spacer material is then at least partially cured for holding the plate at the precise height above the substrate.

    摘要翻译： 制造微电子封装的方法包括在衬底的第一表面处提供具有多个导电引线的衬底。 导电引线可以具有永久地附着到基板的第一端和远离端子的第二端，第二端可相对于引线的第一端移动。 具有接触轴承表面和远离其的后表面的一个或多个微电子元件可以与衬底并置，并且与引线的第一端连接。 基本上刚性的板可附接到微电子元件的背面。 基本上刚性的板可以移动到衬底上方的精确高度以垂直地延伸引线。 当板保持在衬底上方的精确高度时，间隔材料被分配在板和衬底之间。 然后将间隔物材料至少部分地固化以将板保持在衬底上方的精确高度。

    Microelectronic assemblies incorporating inductors
    8.
    发明申请
    Microelectronic assemblies incorporating inductors 审中-公开

    公开(公告)号：US20060113645A1

    公开(公告)日：2006-06-01

    申请号：US11327057

    申请日：2006-01-06

    申请人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

    发明人： Michael Warner ,  Belgacem Haba ,  Masud Beroz

    IPC分类号： H01L23/495

    摘要： Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.

    Microelectronic assemblies and methods of making microelectronic assemblies
    9.
    发明申请
    Microelectronic assemblies and methods of making microelectronic assemblies 审中-公开
    微电子组件和制造微电子组件的方法

    公开(公告)号：US20060108698A1

    公开(公告)日：2006-05-25

    申请号：US11196724

    申请日：2005-08-03

    申请人： Masud Beroz ,  Michael Warner

    发明人： Masud Beroz ,  Michael Warner

    IPC分类号： H01L23/48 ,  H01L21/48

    CPC分类号： H05K13/046 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2224/0401

    摘要： A microelectronic subassembly includes a substrate having a first surface, and one or more microelectronic elements positioned above the first surface of the substrate, each microelectronic element having a contact bearing face confronting the first surface of the substrate and a back surface remote therefrom. The subassembly includes a substantially rigid plate attached to the back surfaces of the microelectronic elements, an array of flexible leads extending between the substrate and the microelectronic elements, the leads having first ends attached to the substrate and second ends attached to the contacts of the microelectronic elements, and an at least partially cured spacer material sandwiched between the substantially rigid plate and the substrate for holding the contact bearing faces of the microelectronic elements at a precise height above the substrate.

    摘要翻译： 微电子子组件包括具有第一表面的衬底和位于衬底的第一表面上方的一个或多个微电子元件，每个微电子元件具有面对衬底的第一表面的接触支承面和远离衬底的后表面。 子组件包括附接到微电子元件的后表面的基本上刚性的板，在衬底和微电子元件之间延伸的柔性引线的阵列，引线具有连接到衬底的第一端和附接到微电子器件的触点的第二端 元件以及夹在基本上刚性的板和基底之间的至少部分固化的间隔物材料，用于将微电子元件的接触支承面保持在衬底上方的精确高度。