公开(公告)号：US08173488B2

公开(公告)日：2012-05-08

申请号：US12241093

申请日：2008-09-30

申请人： Michael Bauer ,  Ludwig Heitzer ,  Daniel Porwol

发明人： Michael Bauer ,  Ludwig Heitzer ,  Daniel Porwol

IPC分类号： H01L21/44 ,  H01L23/22

CPC分类号： H01L24/96 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

摘要： This application relates to a method of manufacturing a semiconductor device comprising: providing multiple chips each comprising contact elements on a first main face of each of the multiple chips, and a first layer applied to each of the first main faces of the multiple chips; placing the multiple chips over a carrier with the first layers facing the carrier; applying encapsulation material to the multiple chips and the carrier to form an encapsulation workpiece embedding the multiple chips; and removing the carrier from the encapsulation workpiece.

摘要翻译： 本申请涉及一种制造半导体器件的方法，包括：在多个芯片中的每一个的第一主面上提供各自包括接触元件的多个芯片，以及施加到多个芯片的每个第一主面的第一层; 将多个芯片放置在载体上，其中第一层面向载体; 将封装材料施加到多个芯片和载体上以形成嵌入多个芯片的封装工件; 以及从所述封装工件移除所述载体。

公开(公告)号：US07683460B2

公开(公告)日：2010-03-23

申请号：US11534374

申请日：2006-09-22

申请人： Ludwig Heitzer ,  Christian Stümpfl ,  Michael Bauer

发明人： Ludwig Heitzer ,  Christian Stümpfl ,  Michael Bauer

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module (100) comprises a component (10) and a shielding element (11), which is mounted on a main surface (12) of the component (10) and has a welding contact (13).

摘要翻译： 模块（100）包括安装在部件（10）的主表面（12）上并具有焊接接头（13）的部件（10）和屏蔽元件（11）。

公开(公告)号：US07592236B2

公开(公告)日：2009-09-22

申请号：US11582551

申请日：2006-10-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/6715 ,  H01L23/3128 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer.

摘要翻译： 在制造半导体器件中，将半导体芯片的背面施加接合材料的结构。 接合材料通过接合材料喷射器具以精细计量和结构化的形式施加到分开的半导体晶片的半导体芯片的背面。

公开(公告)号：US07547645B2

公开(公告)日：2009-06-16

申请号：US11504782

申请日：2006-08-16

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L21/20

CPC分类号： H01L21/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.

摘要翻译： 涂覆包括至少一个半导体芯片的结构的方法包括在待涂覆结构的区域上静电沉积涂层颗粒。 首先将涂层颗粒施加到载体上，然后将涂层颗粒带电涂覆颗粒。 包括至少一个半导体芯片的结构被静电充电到与载体相反的极性。 然后将载体和/或结构沿待涂覆结构的区域的方向彼此移动，直到涂层颗粒跳到要涂覆的结构的区域并粘附在那里。 涂覆颗粒通过用涂覆颗粒加热该区域而液化以形成涂层。

公开(公告)号：US07294916B2

公开(公告)日：2007-11-13

申请号：US11465547

申请日：2006-08-18

申请人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Jens Pohl ,  Peter Strobel ,  Christian Stuempfl

IPC分类号： H01L23/02

CPC分类号： H01L23/49562 ,  H01L21/3081 ,  H01L21/78 ,  H01L23/49524 ,  H01L24/32 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

摘要翻译： 公开了一种具有薄型半导体芯片的半导体器件及其制造方法。 在一个实施例中，变薄的半导体芯片具有具有接触区域的顶侧和具有后侧电极的后侧。 在这种情况下，后侧电极经由导电层与电路载体的芯片焊盘粘结地连接。 在另一个实施例中，根据本发明的该半导体器件的薄化半导体芯片具有具有半导体元件结构和通过蚀刻技术图案化的边缘侧的低微细边缘侧区域。

公开(公告)号：US07834460B2

公开(公告)日：2010-11-16

申请号：US11746390

申请日：2007-05-09

申请人： Michael Bauer ,  Ludwig Heitzer ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Christian Stuempfl

IPC分类号： H01L23/52 ,  H01L29/40

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14

摘要： The invention pertains to a method for manufacturing an electronic component with a semiconductor element (1) that is contacted and fixed on a substrate surface (2). The method is characterized in that the rear side of the semiconductor element and/or the substrate surface is coated with an adhesive structure consisting of a first component (3) that solidifies, particularly hardens or cures, and an electrically conductive second component (4) that does not solidify, wherein the semiconductor element is bonded to the substrate surface in a contacting fashion. The electronic component is characterized in that a structured adhesive layer arranged between the semiconductor element and the substrate surface comprises a solidifying first component (3) and an electrically conductive non-solidifying second component (4).

摘要翻译： 公开了一种用于制造电子部件和对应电子部件的方法。 一个实施例提供了接触并固定在基板表面上的半导体元件。 电子部件是布置在半导体元件和基板表面之间的结构化粘合剂层，包括固化的第一部件和导电的非固化的第二部件。

公开(公告)号：US07470601B2

公开(公告)日：2008-12-30

申请号：US11543983

申请日：2006-10-06

申请人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

发明人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/05599 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.

摘要翻译： 半导体器件包括半导体芯片和半导体芯片的背面与引线框的芯片焊盘之间的粘合膜。 粘合膜包括膜芯和覆盖膜芯的两侧的粘合剂层。 薄膜芯包括脆性脆弱的硬质材料。

公开(公告)号：US20080017986A1

公开(公告)日：2008-01-24

申请号：US11780827

申请日：2007-07-20

申请人： Michael Bauer ,  Ludwig Heitzer ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Christian Stuempfl

IPC分类号： H01L23/488 ,  H01L21/56

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for producing an electronic component of a VQFN (very thin quad flat pack no-lead) design includes the following method steps: anchoring at least one integrated circuit element on a sacrificial substrate; contact-connecting the at least one integrated circuit element to the sacrificial substrate with formation of contact-connecting points on the sacrificial substrate; forming an encapsulation on a top side of the sacrificial substrate, the at least one anchored integrated circuit element being mounted on the top side of the sacrificial substrate; removing the sacrificial substrate, thereby uncovering a portion of the contact-connecting points on the underside of the encapsulation.

摘要翻译： 用于制造VQFN（非常薄的四边形扁平封装无引线）设计的电子部件的方法包括以下方法步骤：将至少一个集成电路元件固定在牺牲基板上; 将所述至少一个集成电路元件接触连接到所述牺牲基板，同时在所述牺牲基板上形成接触连接点; 在所述牺牲衬底的顶侧上形成封装，所述至少一个锚定集成电路元件安装在所述牺牲衬底的顶侧; 去除牺牲衬底，从而露出封装底面上的接触连接点的一部分。

公开(公告)号：US20070290346A1

公开(公告)日：2007-12-20

申请号：US11746390

申请日：2007-05-09

申请人： Michael Bauer ,  Ludwig Heitzer ,  Christian Stuempfl

发明人： Michael Bauer ,  Ludwig Heitzer ,  Christian Stuempfl

IPC分类号： B32B37/00 ,  H01L23/12

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/83874 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14

摘要： The invention pertains to a method for manufacturing an electronic component with a semiconductor element (1) that is contacted and fixed on a substrate surface (2). The method is characterized in that the rear side of the semiconductor element and/or the substrate surface is coated with an adhesive structure consisting of a first component (3) that solidifies, particularly hardens or cures, and an electrically conductive second component (4) that does not solidify, wherein the semiconductor element is bonded to the substrate surface in a contacting fashion. The electronic component is characterized in that a structured adhesive layer arranged between the semiconductor element and the substrate surface comprises a solidifying first component (3) and an electrically conductive non-solidifying second component (4).

摘要翻译： 本发明涉及一种用于制造具有接触并固定在基板表面（2）上的半导体元件（1）的电子部件的方法。 该方法的特征在于，半导体元件和/或基板表面的后侧涂覆有由固化，特别是硬化或固化的第一组分（3）和导电的第二组分（4）组成的粘合剂结构， 其不固化，其中半导体元件以接触方式结合到衬底表面。 电子部件的特征在于，布置在半导体元件和基板表面之间的结构化粘合剂层包括固化的第一部件（3）和导电的非固化的第二部件（4）。

公开(公告)号：US20070082463A1

公开(公告)日：2007-04-12

申请号：US11543983

申请日：2006-10-06

申请人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

发明人： Michael Bauer ,  Ludwig Heitzer ,  Eric Kuerzel ,  Peter Strobel

IPC分类号： H01L21/30 ,  H01L21/44 ,  H01L21/46

CPC分类号： H01L23/3128 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/49816 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/05599 ,  H01L2224/274 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A semiconductor device includes a semiconductor chip and an adhesive film between the back side of the semiconductor chip and a chip pad of a leadframe. The adhesive film includes a film core and adhesive layers that cover both sides of the film core. The film core includes a brittle, fragile hard material.

摘要翻译： 半导体器件包括半导体芯片和半导体芯片的背面与引线框的芯片焊盘之间的粘合膜。 粘合膜包括膜芯和覆盖膜芯的两侧的粘合剂层。 薄膜芯包括脆性脆弱的硬质材料。