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    Organic thin-film transistor backplane with multi-layer contact structures and data lines
    1.
    发明申请
    Organic thin-film transistor backplane with multi-layer contact structures and data lines 有权
    具有多层接触结构和数据线的有机薄膜晶体管背板

    公开(公告)号：US20070158644A1

    公开(公告)日：2007-07-12

    申请号：US11316551

    申请日：2005-12-21

    申请人： Michael Chabinyc ,  Rene Lujan ,  Ana Arias ,  Jackson Ho

    发明人： Michael Chabinyc ,  Rene Lujan ,  Ana Arias ,  Jackson Ho

    IPC分类号： H01L29/08

    CPC分类号： H01L27/283 ,  H01L51/0037 ,  H01L51/0541 ,  H01L51/0545 ,  H01L51/105

    摘要： A backplane circuit includes an array of organic thin-film transistors (OTFTs), each OTFT including a source contact, a drain contact, and an organic semiconductor region extending between the source and drain contacts. The drain contacts in each row are connected to an address line. The source and drain contacts and the address lines are fabricated using a multi-layer structure including a relatively thick base portion formed of a relatively inexpensive metal (e.g., aluminum or copper), and a relatively thin contact layer formed of a high work function, low oxidation metal (e.g., gold) that exhibits good electrical contact to the organic semiconductor, is formed opposite at least one external surface of the base, and is located at least partially in an interface region where the organic semiconductor contacts an underlying dielectric layer.

    摘要翻译： 背板电路包括有机薄膜晶体管（OTFT）的阵列，每个OTFT包括源极接触，漏极接触以及在源极和漏极接触之间延伸的有机半导体区域。 每行的漏极触点连接到地址线。 源极和漏极触点和地址线使用包括由相对便宜的金属（例如，铝或铜）形成的相对厚的基部的多层结构以及由高功函数形成的相对较薄的接触层制造， 与有机半导体呈现良好的电接触的低氧化金属（例如，金）形成在与基底的至少一个外表面相对的位置，并且至少部分地位于有机半导体与下面的介电层接触的界面区域中。

    Sub-resolution gaps generated by controlled over-etching
    2.
    发明申请
    Sub-resolution gaps generated by controlled over-etching 有权
    通过控制过蚀刻产生的子分辨率间隙

    公开(公告)号：US20060063369A1

    公开(公告)日：2006-03-23

    申请号：US10943624

    申请日：2004-09-17

    申请人： JengPing Lu ,  Jackson Ho ,  Chinwen Shih ,  Michael Chabinyc ,  William Wong

    发明人： JengPing Lu ,  Jackson Ho ,  Chinwen Shih ,  Michael Chabinyc ,  William Wong

    IPC分类号： H01L21/4763 ,  H01L21/302

    CPC分类号： H01L21/76838 ,  B82Y30/00 ,  H01L21/28506 ,  H01L27/124

    摘要： Controlled overetching is utilized to produce metal patterns having gaps that are smaller than the resolution limits of the feature patterning (e.g., photolithography) process utilized to produce the metal patterns. A first metal layer is formed and masked, and exposed regions are etched away. The etching process is allowed to continue in a controlled manner to produced a desired amount of over-etching (i.e., undercutting the mask) such that an edge of the first metal layer is offset from an edge of the mask by a predetermined gap distance. A second metal layer is then deposited such that an edge of the second metal layer is spaced from the first metal layer by the predetermined gap distance. The metal gap is used to define, for example, transistor channel lengths, thereby facilitating the production of transistors having channel lengths defined by etching process control that are smaller than the process resolution limits.

    摘要翻译： 控制过蚀刻用于产生具有小于用于产生金属图案的特征图案化（例如，光刻）工艺的分辨率限制的间隙的金属图案。 第一金属层被形成并被掩蔽，并且暴露的区域被蚀刻掉。 允许蚀刻处理以受控的方式继续，以产生期望量的过蚀刻（即，底切掩模），使得第一金属层的边缘以预定的间隙距离偏离掩模的边缘。 然后沉积第二金属层，使得第二金属层的边缘与第一金属层隔开预定的间隙距离。 金属间隙用于限定例如晶体管沟道长度，由此有助于生产具有小于工艺分辨率极限的蚀刻工艺控制定义的沟道长度的晶体管。

    Variable volume between flexible structure and support surface
    3.
    发明授权
    Variable volume between flexible structure and support surface 失效
    柔性结构和支撑表面之间的可变体积

    公开(公告)号：US07710371B2

    公开(公告)日：2010-05-04

    申请号：US11014490

    申请日：2004-12-16

    申请人： Ping Mei ,  Jurgen Daniel ,  James B. Boyce ,  Kathleen Dore Boyce, legal representative ,  Jackson Ho ,  Rachel Lau ,  Yu Wang

    发明人： Ping Mei ,  Jurgen Daniel ,  James B. Boyce ,  Jackson Ho ,  Rachel Lau ,  Yu Wang

    IPC分类号： G09G3/34 ,  C25B9/00 ,  F04B17/00 ,  B41J2/14 ,  G02F1/153 ,  H04R19/00

    CPC分类号： C25D5/02 ,  C23C18/28 ,  C25D5/56 ,  H04R19/04

    摘要： Cells can include variable volumes defined between a flexible structure, such as a polymer layer, and a support surface, with the flexible structure and support surface being attached in a first region that surrounds a second region in which they are unattached. Various adhesion structures can attach the flexible structure and the support surface. When unstretched, the flexible structure can lie in a flat position on the support surface. In response to a stretching force away from the support surface, the flexible structure can move out of the flat position, providing the variable volume. Electrodes, such as on the flexible structure, on the support surface, and over the flexible structure, can have charge levels that couple with each other and with the variable volume. A support structure can include a device layer with signal circuitry that provides a signal path between an electrode and external circuitry. One or more ducts can provide fluid communication with each cell's variable volume. Arrays of such cells can be implemented for various applications, such as optical modulators, displays, printheads, and microphones.

    摘要翻译： 细胞可以包括在诸如聚合物层的柔性结构和支撑表面之间限定的可变体积，其中柔性结构和支撑表面附接在围绕其未连接的第二区域的第一区域中。 各种粘合结构可以附接柔性结构和支撑表面。 当未拉伸时，柔性结构可以位于支撑表面上的平坦位置。 响应于远离支撑表面的拉伸力，柔性结构可以移出平坦位置，从而提供可变的体积。 诸如柔性结构的电极，在支撑表面上以及柔性结构上的电极可以具有彼此耦合并且具有可变体积的电荷水平。 支撑结构可以包括具有提供电极和外部电路之间的信号路径的信号电路的器件层。 一个或多个管道可以提供与每个电池的可变体积的流体连通。 可以对诸如光学调制器，显示器，打印头和麦克风的各种应用来实现这种单元的阵列。

    Punching and binding machine
    7.
    发明授权
    Punching and binding machine 失效
    冲孔装订机

    公开(公告)号：US5211522A

    公开(公告)日：1993-05-18

    申请号：US888053

    申请日：1992-05-26

    申请人： Jackson Ho

    发明人： Jackson Ho

    IPC分类号： B42B5/10

    CPC分类号： B42B5/103

    摘要： A punching and binding machine, particularly a machine to punch and bind papers at high speed, comprises including a punching unit and a binding unit adapted for independent operation. The punching unit has an upper clamp element and a lower clamp element for use in punching operations and the binding unit incorporates an adjustment mechanism for selecting the use of either an iron binding ring or a plastic binding ring of appropriate diameter for binding of papers of different thicknesses.

    摘要翻译： 一种冲压装订机，特别是一种高速冲压和装订纸张的机器，包括一个冲孔单元和一个独立操作的装订单元。 冲孔单元具有用于冲压操作的上夹紧元件和下夹紧元件，并且捆绑单元包括调节机构，用于选择使用适当直径的铁结合环或塑料结合环以结合不同的纸 厚度

    Method for fabricating a spring structure on a substrate
    9.
    发明授权
    Method for fabricating a spring structure on a substrate 有权
    在基板上制造弹簧结构的方法

    公开(公告)号：US06658728B2

    公开(公告)日：2003-12-09

    申请号：US09917572

    申请日：2001-07-27

    申请人： David Kirtland Fork ,  Jackson Ho ,  Rachel King-ha Lau ,  JengPing Lu

    发明人： David Kirtland Fork ,  Jackson Ho ,  Rachel King-ha Lau ,  JengPing Lu

    IPC分类号： H05K330

    CPC分类号： G01R1/06716 ,  B81B2203/0118 ,  B81C1/00484 ,  B81C2201/0136 ,  B81C2203/058 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/49811 ,  H01L2924/0002 ,  H01R4/48 ,  H01R12/57 ,  H05K3/4092 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4914 ,  H01L2924/00

    摘要： Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad/via.

    摘要翻译： 通过使用单个掩模通过形成弹簧金属和释放材料层来将含有接触垫或金属通孔的弹性结构光刻制造到衬底上的有效方法。 具体地说，使用光致抗蚀剂掩模或电镀金属图案或使用剥离处理技术，释放材料垫与弹簧金属手指自对准。 然后使用释放掩模释放弹簧金属指，同时保持将弹簧金属指的锚固部分固定到基底的释放材料的一部分。 当释放材料是导电的（例如钛）时，该释放材料部分直接位于接触垫或金属通孔上方，并且用作在完成的弹簧结构中的弹簧金属指的导管。 当释放材料不导电时，形成金属带以将弹簧金属手指连接到接触垫/通孔。

    Spring structure with self-aligned release material
    10.
    发明授权
    Spring structure with self-aligned release material 有权

    公开(公告)号：US06361331B1

    公开(公告)日：2002-03-26

    申请号：US09923600

    申请日：2001-08-06

    申请人： David Kirtland Fork ,  Jackson Ho ,  Rachel King-ha Lau ,  JengPing Lu

    发明人： David Kirtland Fork ,  Jackson Ho ,  Rachel King-ha Lau ,  JengPing Lu

    IPC分类号： H01R909

    摘要： Efficient methods for lithographically fabricating spring structures onto a substrate containing contact pads or metal vias by forming both the spring metal and release material layers using a single mask. Specifically, a pad of release material is self-aligned to the spring metal finger using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.