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    Method and system for vertical optical coupling on semiconductor substrate
    1.
    发明申请
    Method and system for vertical optical coupling on semiconductor substrate 有权
    半导体衬底垂直光耦合方法及系统

    公开(公告)号：US20060067607A1

    公开(公告)日：2006-03-30

    申请号：US10955891

    申请日：2004-09-30

    申请人： Ming Fang ,  Larry Tullos ,  Hai Ding

    发明人： Ming Fang ,  Larry Tullos ,  Hai Ding

    IPC分类号： G02B6/12

    CPC分类号： G02B6/4204 ,  G02B6/4214

    摘要： Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.

    摘要翻译： 半导体衬底内的光纤和光学部件之间的连接。 在半导体基板的前面形成透镜。 在基板的背面产生露出透镜的一部分或全部表面的锥形孔。 在基板的前表面上形成或固定光学部件。 将一定体积的透明粘合剂放置在孔中，随后是光纤，其由此耦合到透镜的表面。 在衬底的前面形成一个导光体，该导光体覆盖在透镜上，以将插入锥形孔中的光纤与基片表面上的光学部件之间的光信号引导。

    Method and system for vertical optical coupling on semiconductor substrate
    2.
    发明授权
    Method and system for vertical optical coupling on semiconductor substrate 有权
    半导体衬底垂直光耦合方法及系统

    公开(公告)号：US07389013B2

    公开(公告)日：2008-06-17

    申请号：US10955891

    申请日：2004-09-30

    申请人： Ming Fang ,  Larry R. Tullos ,  Hai Ding

    发明人： Ming Fang ,  Larry R. Tullos ,  Hai Ding

    IPC分类号： G02B6/12 ,  G02B6/124 ,  G02B6/00

    CPC分类号： G02B6/4204 ,  G02B6/4214

    摘要： Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.

    摘要翻译： 半导体衬底内的光纤和光学部件之间的连接。 在半导体基板的前面形成透镜。 在基板的背面产生露出透镜的一部分或全部表面的锥形孔。 在基板的前表面上形成或固定光学部件。 将一定体积的透明粘合剂放置在孔中，随后是光纤，其由此耦合到透镜的表面。 在衬底的前面形成一个导光体，该导光体覆盖在透镜上，以将插入锥形孔中的光纤与基片表面上的光学部件之间的光信号引导。

    Microlens integration
    3.
    发明授权
    Microlens integration 有权
    微透镜整合

    公开(公告)号：US06953925B2

    公开(公告)日：2005-10-11

    申请号：US10424482

    申请日：2003-04-28

    申请人： Ming Fang ,  Fuchao Wang ,  Hai Ding

    发明人： Ming Fang ,  Fuchao Wang ,  Hai Ding

    IPC分类号： G02B3/00 ,  G02B27/10 ,  H01L27/00 ,  H01L27/14 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/062 ,  H01L31/10 ,  H01L31/113

    CPC分类号： H01L27/14685 ,  H01L27/14601 ,  H01L27/14627 ,  H01L31/02327

    摘要： A microlens of an inorganic material having a relatively high index of refraction is formed with a convex lower surface for refracting light from above through an underlying spacer layer to converge on a photodiode therebelow. The microlens and photodiode may be replicated in an array of such elements along with color filters and CMOS circuit elements on a semiconductor chip to provide an image sensor. The spacer layer, which has a relatively low refractive index, is subjected to a selective isotropic etch through an opening in an etch mask to define a concave surface that forms an interface with the convex lower surface of the microlens upon subsequent conformal deposition of the material of the microlens.

    摘要翻译： 具有较高折射率的无机材料的微透镜形成有用于通过下面的间隔层从上方折射光以会聚在其下的光电二极管上的凸下表面。 微透镜和光电二极管可以与半导体芯片上的滤色器和CMOS电路元件一起复制在这样的元件的阵列中，以提供图像传感器。 具有相对较低折射率的间隔层通过蚀刻掩模中的开口进行选择性各向同性蚀刻，以限定在随后的材料共形沉积时与微透镜的凸下表面形成界面的凹面 的微透镜。

    SURFACE ALLOY PROCESS FOR MEMS AND NEMS
    5.
    发明申请
    SURFACE ALLOY PROCESS FOR MEMS AND NEMS 有权
    用于MEMS和NEMS的表面合金工艺

    公开(公告)号：US20120161573A1

    公开(公告)日：2012-06-28

    申请号：US12979160

    申请日：2010-12-27

    申请人： Ming Fang

    发明人： Ming Fang

    IPC分类号： H02N1/00 ,  B05D5/12

    CPC分类号： B81C1/00666 ,  B81B7/0029 ,  B81B2203/0181 ,  B81C1/0019 ,  B81C2201/0169 ,  B81C2201/112

    摘要： A method of manufacturing microstructures, such as MEMS or NEMS devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on one or more surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure. The process may be self-aligning.

    摘要翻译： 一种制造微结构的方法，例如MEMS或NEMS器件，包括在微结构的可移动部件的表面上形成保护层。 例如，可以在可相对于微结构的基板移动的多晶硅块的一个或多个表面上形成硅化物层。 该过程可以是自对准的。

    Heating system and method for microfluidic and micromechanical applications
    6.
    发明申请
    Heating system and method for microfluidic and micromechanical applications 有权
    微流控和微机械应用的加热系统和方法

    公开(公告)号：US20090169190A1

    公开(公告)日：2009-07-02

    申请号：US12005862

    申请日：2007-12-27

    申请人： Ming Fang ,  Fuchao Wang

    发明人： Ming Fang ,  Fuchao Wang

    IPC分类号： F24H1/10 ,  H01L21/02

    CPC分类号： B81C1/00119 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/14137 ,  B41J2/16 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B81B1/006 ,  B81B2201/052 ,  B81B2201/058 ,  B81C2201/013 ,  B81C2203/075 ,  H01L28/20 ,  Y10T29/41 ,  Y10T29/49401 ,  Y10T29/49826

    摘要： An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

    摘要翻译： 集成半导体加热组件包括半导体衬底，形成在其中的腔室以及与腔室流体连通的出口，允许流体响应于加热室而离开腔室。 集成加热组件包括邻近腔室的第一加热元件，该第一加热元件可以产生高于选定阈值的热量，并将腔室中的流体朝向出口偏压。 第二加热元件邻近出口定位以产生高于所选阈值的热量，便于流体通过出口远离腔室的运动。 添加第二加热元件减少了每个加热元件发出的热量，并使吸热材料的厚度最小化到出口的开口端。 由于这样的材料是昂贵的，所以这降低了组件的制造成本和零售价格，同时提高了其效率和使用寿命。

    Method and system for focus-adaptive reconstruction of spine images
    7.
    发明授权
    Method and system for focus-adaptive reconstruction of spine images 有权
    脊柱图像聚焦自适应重建的方法和系统

    公开(公告)号：US07298923B2

    公开(公告)日：2007-11-20

    申请号：US10974503

    申请日：2004-10-27

    申请人： Bohong Zhang ,  Li Zhang ,  Ming Fang

    发明人： Bohong Zhang ,  Li Zhang ,  Ming Fang

    IPC分类号： G09K9/32 ,  G09G5/00 ,  G06K9/36

    CPC分类号： G06K9/6203

    摘要： A method for aligning a pair of digital images includes providing a pair of digital images, wherein each said image comprises a plurality of intensities corresponding to a domain of points in a D-dimensional space, and the pair of images present adjacent views of a same object of interest. A weighting function is applied to each image of the pair of images, wherein the weighting function is centered on the object of interest, the weighting function has a maximum value on the object of interest, and the value of the weighting function decreases with increasing distance from the object of interest. The pair of images is aligned by correlated the weighted intensities on one image with those in the other image.

    摘要翻译： 用于对准一对数字图像的方法包括提供一对数字图像，其中每个所述图像包括对应于D维空间中的点的域的多个强度，并且所述一对图像呈现相邻视图 感兴趣的对象 对一对图像的每个图像应用加权函数，其中加权函数以感兴趣对象为中心，加权函数对感兴趣对象具有最大值，加权函数的值随着距离的增加而减小 从感兴趣的对象。 通过将一个图像上的加权强度与另一个图像中的加权强度相关联来对齐该对图像。

    Method and system for ground glass nodule (GGN) segmentation using a Markov random field and shape analysis
    8.
    发明授权
    Method and system for ground glass nodule (GGN) segmentation using a Markov random field and shape analysis 有权
    使用马尔科夫随机场和形状分析的磨玻璃结节（GGN）分割方法和系统

    公开(公告)号：US07289653B2

    公开(公告)日：2007-10-30

    申请号：US11010813

    申请日：2004-12-13

    申请人： Li Zhang ,  Ming Fang

    发明人： Li Zhang ,  Ming Fang

    IPC分类号： G06K9/00

    CPC分类号： G06T7/143 ,  G06T7/11 ,  G06T2207/10081 ,  G06T2207/20132 ,  G06T2207/30064

    摘要： A system and method for ground glass nodule (GGN) segmentation is provided. The method comprises: selecting a point in a medical image, wherein the point is located in a GGN; defining a volume of interest (VOI) around the point, wherein the VOI comprises the GGN; removing a chest wall from the VOI; obtaining an initial state for a Markov random field; segmenting the VOI, wherein the VOI is segmented using the Markov random field; identifying vessels in the volume of interest; segmenting the vessels; and removing segmented vessels from the segmented ground glass nodule.

    摘要翻译： 提供了研磨玻璃结节（GGN）分割的系统和方法。 该方法包括：选择医学图像中的点，其中该点位于GGN中; 定义围绕点的感兴趣体积（VOI），其中VOI包括GGN; 从VOI中取出胸壁; 获得马尔科夫随机场的初始状态; 分割VOI，其中使用马尔可夫随机场分割VOI; 识别感兴趣的船只; 分割血管; 并从分段磨玻璃结节去除分段血管。

    Method for measuring confidence of ball grid array model in surface mounted devices
    9.
    发明授权
    Method for measuring confidence of ball grid array model in surface mounted devices 有权
    用于测量表面安装装置中球栅阵列模型的置信度的方法

    公开(公告)号：US07158663B2

    公开(公告)日：2007-01-02

    申请号：US10420286

    申请日：2003-04-22

    申请人： Tong Fang ,  Ming Fang

    发明人： Tong Fang ,  Ming Fang

    IPC分类号： G06K9/00

    CPC分类号： G06T7/001 ,  G01N21/951 ,  G01N21/95684 ,  G01N2021/8874 ,  G01N2021/8877 ,  G01N2021/8887 ,  G01N2021/95661 ,  G06T7/0006 ,  G06T2207/30148 ,  Y10T29/49131

    摘要： A method for obtaining confidence measure of a ball grid array (BGA) model having a plurality of balls in semiconductor surface mounted devices is provided. The method comprises the steps of extracting BGA images from a real surface mounted device, generating a BGA ball model and a BGA body model, generating a first confidence measure of the BGA ball model wherein the first confidence measure includes a first standard deviation of the BGA ball model and a first local image contrast of each BGA ball, and generating a second confidence measure of the BGA body model wherein the second confidence measure includes a second standard deviation of the BGA body model and a second local image contrast of the BGA body.

    摘要翻译： 提供了一种用于获得半导体表面安装器件中具有多个球的球栅阵列（BGA）模型的置信度测量的方法。 该方法包括以下步骤：从真实表面安装的装置提取BGA图像，产生BGA球模型和BGA体模型，产生BGA球模型的第一置信度，其中第一置信度测量包括BGA的第一标准偏差 球模型和每个BGA球的第一局部图像对比度，并且生成BGA体模型的第二置信度测量，其中第二置信度测量包括BGA体模型的第二标准偏差和BGA体的第二局部图像对比度。