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1.发明授权公开(公告)号：US11939447B2
公开(公告)日：2024-03-26
申请号：US17050449
申请日：2019-04-02
发明人： Yoshihiro Nakazumi , Kentaro Takano
CPC分类号： C08K3/013 , C08J5/244 , C08J5/249 , C08K3/38 , H05K1/0366 , C08K2003/385 , H05K2201/0209
摘要： A thermosetting composition including a thermosetting compound and hexagonal boron nitride D, wherein the thermosetting compound contains a cyanate compound A and/or a maleimide compound B, and a modified polyphenylene ether C having a substituent with a carbon-carbon unsaturated double bond at at least one terminal, and a content of the hexagonal boron nitride D is 0.1 parts by mass or more and 25 parts by mass or less based on 100 parts by mass of the thermosetting compound.
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公开(公告)号：US11008420B2
公开(公告)日：2021-05-18
申请号：US16960181
申请日：2019-01-08
发明人： Masahiko Shigaki , Kentaro Takano
摘要： Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C): wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1
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3.发明授权公开(公告)号：US10689496B2
公开(公告)日：2020-06-23
申请号：US16063429
申请日：2017-08-23
IPC分类号： C08J5/24 , B32B15/08 , C08K3/38 , H05K1/03 , C01B21/064 , C08G18/38 , C08G18/76 , C08L35/00 , C08F22/40 , C08L79/00 , C08G73/00 , B32B15/088 , H05K1/02
摘要： The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.
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公开(公告)号：US10550244B2
公开(公告)日：2020-02-04
申请号：US15521062
申请日：2015-11-04
IPC分类号： C08K5/315 , C08J5/24 , C08K5/3415 , C08K3/36 , H05K1/03 , C08L79/04 , C08G59/40 , C08L79/08 , C08G73/06 , C08L63/00 , H01L23/29 , H05K3/46
摘要： A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).
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公开(公告)号：US09907166B2
公开(公告)日：2018-02-27
申请号：US15501995
申请日：2016-02-19
发明人： Takashi Kobayashi , Kentaro Takano
IPC分类号： B32B27/38 , C08G59/50 , H05K1/03 , B32B15/14 , B32B15/20 , B32B37/06 , B32B37/10 , D06M15/55 , H05K3/00 , C08J5/24 , C08G61/02 , C08L65/00 , C08L63/00 , D06M101/00
CPC分类号： H05K1/0373 , B32B15/08 , B32B15/092 , B32B15/14 , B32B15/20 , B32B37/06 , B32B37/10 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2305/076 , B32B2307/202 , B32B2307/206 , B32B2309/02 , B32B2309/12 , B32B2311/12 , B32B2315/085 , B32B2363/00 , B32B2457/08 , C08G14/12 , C08G59/40 , C08G61/02 , C08G2261/3424 , C08G2261/592 , C08G2261/65 , C08G2261/74 , C08G2261/76 , C08J5/24 , C08J2361/14 , C08J2361/34 , C08J2363/00 , C08J2365/00 , C08J2461/14 , C08J2461/34 , C08J2463/00 , C08J2465/00 , C08K3/36 , C08L61/14 , C08L61/34 , C08L63/00 , C08L65/00 , C08L2201/02 , C08L2201/08 , D06M15/55 , D06M2101/00 , H05K1/0366 , H05K3/007 , H05K2201/0209
摘要： The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).
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6.发明授权公开(公告)号：US11166370B2
公开(公告)日：2021-11-02
申请号：US16480088
申请日：2018-01-19
发明人： Shota Koga , Kentaro Takano
摘要： A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).
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7.发明授权公开(公告)号：US11122685B2
公开(公告)日：2021-09-14
申请号：US16480088
申请日：2018-01-19
发明人： Shota Koga , Kentaro Takano
摘要： A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).
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8.发明授权公开(公告)号：US11098195B2
公开(公告)日：2021-08-24
申请号：US16097413
申请日：2018-01-19
发明人： Yoshihiro Nakazumi , Kentaro Takano
IPC分类号： C08L79/04 , C08J5/24 , C08K3/38 , C08G59/40 , C08L65/00 , C08L61/06 , C08L71/02 , C08L63/00 , B32B15/082 , H05K1/03 , C08K5/3415 , C08L61/14 , C09D163/00 , B32B15/08 , B32B27/42 , C08G59/68 , C08G73/06 , B32B27/20 , C08K5/315
摘要： A resin composition according to the present invention contains a cyanate compound (A). Further, the resin composition according to the present invention contains a maleimide compound (B) and/or an epoxy resin (C); and primary hexagonal boron nitride particles (D) having an average aspect ratio of 4 to 10.
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9.发明授权公开(公告)号：US10703855B2
公开(公告)日：2020-07-07
申请号：US16079353
申请日：2017-09-01
发明人： Shota Koga , Daisuke Ueyama , Kentaro Takano
IPC分类号： C08G59/06 , C08J5/24 , C08L63/00 , B32B15/092 , C08G59/40 , C08G59/32 , H05K1/03 , C08K5/315 , B32B15/08 , C08K5/29 , H05K3/02
摘要： A resin composition containing: an epoxy resin (A) represented by the following formula (1); and a cyanate compound (B), wherein Ar represents a polycyclic aromatic group, R represents a hydrogen atom or a methyl group, G represents a glycidyl group, and n represents an integer of 0 to 15.
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10.发明授权公开(公告)号：US10174149B2
公开(公告)日：2019-01-08
申请号：US15519306
申请日：2015-11-24
IPC分类号： C08G14/12 , B32B15/098 , B32B15/14 , B32B5/22 , B32B7/12 , C08G73/06 , C08L61/34 , C08L63/00 , C08J5/24 , H01L23/29 , B32B5/02
摘要： The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): wherein n represents an integer of 1 or larger.
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