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    Plating apparatus and plating method
    1.
    发明申请
    Plating apparatus and plating method 有权
    电镀装置及电镀方法

    公开(公告)号：US20090139870A1

    公开(公告)日：2009-06-04

    申请号：US12314080

    申请日：2008-12-03

    申请人： Mizuki Nagai ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Akira Fukunaga

    发明人： Mizuki Nagai ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Akira Fukunaga

    IPC分类号： C25D5/02 ,  C25D17/00

    CPC分类号： H01L21/76847 ,  C23C14/046 ,  C23C14/16 ,  C23C14/584 ,  C25D5/003 ,  C25D5/022 ,  C25D5/08 ,  C25D5/10 ,  C25D7/123 ,  C25D17/001 ,  C25D21/10 ,  H01L21/2885 ,  H01L21/76849 ,  H01L21/76879 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2203/1476

    摘要： A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.

    摘要翻译： 一种方法可以形成导电结构，其可用于具有通孔塞的三维封装，在更短的时间内缩短常规的长电镀时间，这是阻碍电镀实际使用的障碍。 该方法包括在具有形成在表面中的通孔的基板的整个表面上形成导电膜，包括通孔的内表面; 在导电膜上的预定位置处形成抗蚀剂图案; 在第一电镀条件下进行第一次电镀，使用导电膜作为供电层，从而将第一镀膜填充到通孔中; 并且在第二电镀条件下进行第二次电镀，使用导电膜和第一镀膜作为供电层，从而允许第二镀膜在导电膜和第一镀膜上生长，两者都暴露在 抗蚀图案

    Plating apparatus and plating method
    2.
    发明授权
    Plating apparatus and plating method 有权
    电镀装置及电镀方法

    公开(公告)号：US08784636B2

    公开(公告)日：2014-07-22

    申请号：US12314080

    申请日：2008-12-03

    申请人： Mizuki Nagai ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Akira Fukunaga

    发明人： Mizuki Nagai ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Akira Fukunaga

    IPC分类号： C25D7/12 ,  C25D5/10 ,  C25D5/08 ,  C25D21/10 ,  C25D5/00

    CPC分类号： H01L21/76847 ,  C23C14/046 ,  C23C14/16 ,  C23C14/584 ,  C25D5/003 ,  C25D5/022 ,  C25D5/08 ,  C25D5/10 ,  C25D7/123 ,  C25D17/001 ,  C25D21/10 ,  H01L21/2885 ,  H01L21/76849 ,  H01L21/76879 ,  H05K3/108 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2203/1476

    摘要： A method can form a conductive structure, which is useful for three-dimensional packaging with via plugs, in a shorter time by shortening the conventional long plating time that is an impediment to the practical use of electroplating. The method includes forming a conductive film on an entire surface, including interior surfaces of via holes, of a substrate having the via holes formed in the surface; forming a resist pattern at a predetermined position on the conductive film; carrying out first electroplating under first plating conditions, using the conductive film as a feeding layer, thereby filling a first plated film into the via holes; and carrying out second electroplating under second plating conditions, using the conductive film and the first plated film as a feeding layer, thereby allowing a second plated film to grow on the conductive film and the first plated film, both exposed in the resist openings of the resist pattern.

    摘要翻译： 一种方法可以形成导电结构，其可用于具有通孔塞的三维封装，在更短的时间内缩短常规的长电镀时间，这是阻碍电镀实际使用的障碍。 该方法包括在具有形成在表面中的通孔的基板的整个表面上形成导电膜，包括通孔的内表面; 在导电膜上的预定位置处形成抗蚀剂图案; 在第一电镀条件下进行第一次电镀，使用导电膜作为供电层，从而将第一镀膜填充到通孔中; 并且在第二电镀条件下进行第二次电镀，使用导电膜和第一镀膜作为供电层，从而允许第二镀膜在导电膜和第一镀膜上生长，两者都暴露在 抗蚀图案

    Plating method and apparatus
    4.
    发明申请
    Plating method and apparatus 审中-公开
    电镀方法和装置

    公开(公告)号：US20070117365A1

    公开(公告)日：2007-05-24

    申请号：US10571751

    申请日：2004-09-29

    申请人： Fumio Kuriyama ,  Rei Kiumi ,  Nobutoshi Saito ,  Takashi Takemura ,  Masaaki Kimura ,  Sachiko Takeda ,  Yugang Guo

    发明人： Fumio Kuriyama ,  Rei Kiumi ,  Nobutoshi Saito ,  Takashi Takemura ,  Masaaki Kimura ,  Sachiko Takeda ,  Yugang Guo

    IPC分类号： H01L21/44

    CPC分类号： C23C18/182 ,  B05B13/0228 ,  C23C18/1632 ,  C23C18/1689 ,  C23C18/18 ,  C23C18/1824 ,  C23C18/1837 ,  C25D5/34 ,  C25D5/48 ,  C25D7/123 ,  C25D17/001 ,  H01L21/288 ,  H05K3/241 ,  H05K3/244

    摘要： A plating method comprising applying an ultraviolet ray to a surface of a substrate or exposing a surface of a substrate to an ozone gas or bringing a surface to a substrate into contact with ozone water or bringing a surface of a substrate into contact with electrolytic ionized water or performing a team treatment using steam on a surface of a substrate, and plating the surface of the substrate after said applying, exposing, bringing or performing process. A plating method comprising performing a team treatment using steam on a surface of a substrate, and performing a wet process on the surface of the substrate of a substrate with an acidic plating solution, cleaning the surface of the substrate with pure water and cleaning the surface of the substrate with an alkalescent aqueous solution. A plating apparatus adapted to perform at least one of said methods.

    摘要翻译： 一种电镀方法，其包括将紫外线施加到基板的表面或将基板的表面暴露于臭氧气体或使表面与基底接触的方式与臭氧水接触或使基板的表面与电解电离水接触 或者使用蒸镀在基板的表面上进行团队处理，以及在施加，曝光，进行或执行处理之后对基板的表面进行电镀。 一种电镀方法，包括使用蒸镀在基材表面进行团队处理，并用酸性电镀液对基板表面进行湿法处理，用纯水清洗基板的表面并清洗表面 的碱性水溶液。 适于执行所述方法中的至少一种的电镀装置。

    Plating apparatus
    10.
    发明申请
    Plating apparatus 审中-公开
    电镀装置

    公开(公告)号：US20090218231A1

    公开(公告)日：2009-09-03

    申请号：US12453347

    申请日：2009-05-07

    申请人： Toshikazu Yajima ,  Takashi Takemura ,  Rei Kiumi ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Masaaki Kimura

    发明人： Toshikazu Yajima ,  Takashi Takemura ,  Rei Kiumi ,  Nobutoshi Saito ,  Fumio Kuriyama ,  Masaaki Kimura

    IPC分类号： C25D21/10 ,  C25D5/00

    CPC分类号： C25D21/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/008

    摘要： A plating apparatus according to the present invention has a plating tank for holding a plating solution, an anode disposed so as to be immersed in the plating solution in the plating tank, a regulation plate disposed between the anode and a plating workpiece disposed so as to face the anode, and a plating power supply for supply a current between the anode and the plating workpiece to carry out plating. The regulation plate is disposed so as to separate the plating solution held in the plating tank into a plating solution on the anode side and a plating solution on the plating workpiece side, and a through-hole group having a large number of through-holes is formed in the regulation plate.

    摘要翻译： 根据本发明的电镀装置具有用于保持电镀液的电镀槽，设置为浸在电镀槽中的电镀液中的阳极，设置在阳极和电镀工件之间的调节板， 面对阳极，以及用于在阳极和电镀工件之间提供电流以进行电镀的电镀电源。 调整板被设置为将保持在电镀槽中的镀液分离成阳极侧的电镀液和电镀工件侧的电镀液，具有多个通孔的通孔组为 形成在调节板上。