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    Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
    1.
    发明授权
    Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same 有权

    公开(公告)号：US11631790B2

    公开(公告)日：2023-04-18

    申请号：US17193239

    申请日：2021-03-05

    Applicant: NICHIA CORPORATION

    Inventor： Masafumi Kuramoto ,  Tomohisa Kishimoto

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56 ,  H01L23/00 ,  H01L33/64

    Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

    Light emitting device
    2.
    发明授权
    Light emitting device 有权

    公开(公告)号：US10319889B2

    公开(公告)日：2019-06-11

    申请号：US15832779

    申请日：2017-12-06

    Applicant: NICHIA CORPORATION

    Inventor： Taiki Yuasa ,  Tomohisa Kishimoto

    IPC: H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/32

    Abstract: A light emitting device includes a light emitting element having a light emitting surface from which the light emitting element is configured to emit a first light having a first peak wavelength. A light transform layer is provided on the light emitting surface to transform the first light to a second light having a second peak wavelength longer than the first peak wavelength. A light-transmissive layer is provided on the light transform layer and includes a first surface that has a substantially flat shape and that is opposite to the light emitting surface and a second surface connected to the first surface and having a curved shape to surround the light emitting element. A reflecting film is provided between the light transform layer and the light-transmissive layer to extend along the first surface and the second surface so as to reflect the first light and to transmit the second light.

    Lens, light emitting device and method of manufacturing the lens and the light emitting device
    4.
    发明授权
    Lens, light emitting device and method of manufacturing the lens and the light emitting device 有权

    公开(公告)号：US11640038B2

    公开(公告)日：2023-05-02

    申请号：US16558275

    申请日：2019-09-02

    Applicant: NICHIA CORPORATION

    Inventor： Tomohisa Kishimoto ,  Tsuyoshi Okahisa ,  Toshiyuki Fujii

    IPC: G02B7/02 ,  B29D11/00 ,  G02B7/00 ,  H01L33/10

    Abstract: A lens includes a cover part and a light-shielding part. The cover part includes a lens part, a connection part extending downward from lateral sides of the lens part, and one or more flange parts each extending outward from a lower-end portion of the connection part. The lens part and the connection part define a recess having an opening facing downward. The flange parts extend outward from a periphery of the opening of the recess. The lens part, the flange parts, and the connection part are formed of a thermosetting first resin and continuous to one another. The light-shielding part covers outer lateral surface of the connection part and is formed of a thermosetting second resin having a greater light-absorptance or a greater light-reflectance than the thermosetting first resin. The flange parts have a greater thickness than the connection part.

    Method for manufacturing package, and method for manufacturing light emitting device
    5.
    发明授权
    Method for manufacturing package, and method for manufacturing light emitting device 有权

    公开(公告)号：US10804449B2

    公开(公告)日：2020-10-13

    申请号：US16209339

    申请日：2018-12-04

    Applicant: NICHIA CORPORATION

    Inventor： Koji Abe ,  Tomohisa Kishimoto

    IPC: H01L33/60 ,  H01L33/48

    Abstract: A method for manufacturing a package includes molding a precursor of a package including a cup-shaped resin component having a bottom surface and side walls, an opening opened at an upper part of the side walls, and a pair of leads exposed on the bottom surface. The side walls include a side wall that extends along the Y axis and the X axis and that has a first outer surface, and a side wall that extends along the Y axis and the Z axis. A thickness of the side wall extending along Y axis and the X axis is less than a thickness of the side wall extending along axis and the Z axis. The first outer surface has a recess which is recessed in the Z axis direction and arranged in a position corresponding to the opening. The method further includes forming a reflective film in the recess.

    Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
    6.
    发明授权
    Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same 有权

    公开(公告)号：US10686102B2

    公开(公告)日：2020-06-16

    申请号：US16356789

    申请日：2019-03-18

    Applicant: NICHIA CORPORATION

    Inventor： Masafumi Kuramoto ,  Tomohisa Kishimoto

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/26 ,  H01L33/32 ,  H01L33/34 ,  H01L33/44 ,  H01L33/56 ,  H01L23/00 ,  H01L33/64

    Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

    Method for manufacturing package, method for manufacturing light emitting device, package, and light emitting device
    8.
    发明授权
    Method for manufacturing package, method for manufacturing light emitting device, package, and light emitting device 有权

    公开(公告)号：US10177282B2

    公开(公告)日：2019-01-08

    申请号：US15371214

    申请日：2016-12-07

    Applicant: NICHIA CORPORATION

    Inventor： Mayumi Fukuda ,  Tomohisa Kishimoto

    IPC: H01L33/48 ,  H01L23/495 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

    Abstract: A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

    Surface light source device and transmission display device
    9.
    发明授权
    Surface light source device and transmission display device 有权

    公开(公告)号：US10466537B2

    公开(公告)日：2019-11-05

    申请号：US16425952

    申请日：2019-05-30

    Applicant: NICHIA CORPORATION

    Inventor： Kazuhiro Kamada ,  Yusaku Achi ,  Tomohisa Kishimoto ,  Satoshi Yoshinaga

    IPC: G02F1/1335 ,  G02F3/00 ,  G02B5/00 ,  G02B3/00 ,  F21V7/00 ,  G02B5/04

    Abstract: A base has a base surface. Light emitting elements are disposed on the base surface along an X-axis with an X pitch and along the Y axis with a Y pitch to form a matrix. The X pitch is smaller than the Y pitch. Lenses has a batwing illumination distribution. Each of the lenses covers each of the light emitting elements. A first lenticular lens sheet is provided on the base such that a first lenticular lens sheet lower surface is opposite to the base surface. A second lenticular lens sheet is provided on the first lenticular lens sheet such that a second lenticular lens sheet lower surface is opposite to a first lenticular lens sheet upper surface. A third lenticular lens sheet is provided on the second lenticular lens sheet such that a third lenticular lens sheet lower surface is opposite to a second lenticular lens sheet upper surface.

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