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    SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME
    1.
    发明申请
    SEMICONDUCTOR PACKAGE AND DISPLAY PANEL ASSEMBLY HAVING THE SAME 审中-公开
    半导体封装和显示面板组件

    公开(公告)号：US20120138968A1

    公开(公告)日：2012-06-07

    申请号：US13240759

    申请日：2011-09-22

    申请人： Na-Rae Shin ,  So-Young Lim ,  Chul-Woo Kim ,  Ye-Chung Chung

    发明人： Na-Rae Shin ,  So-Young Lim ,  Chul-Woo Kim ,  Ye-Chung Chung

    IPC分类号： H01L23/02 ,  H01L33/48

    CPC分类号： H01L23/3107 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49572 ,  H01L23/49861 ,  H01L2224/73204

    摘要： Provided are a semiconductor package with a reduced lead pitch, and a display panel assembly having the semiconductor package. The semiconductor package includes a film having a hole formed therein, a plating pattern formed under the film and forming a wire; a semiconductor chip placed in the hole and electrically connected to the plating pattern; and a first passivation layer formed at a side opposite to the semiconductor chip about the plating pattern and protecting the plating pattern.

    摘要翻译： 提供了具有减小的引线间距的半导体封装以及具有半导体封装的显示面板组件。 半导体封装包括形成有孔的膜，形成在膜下方并形成导线的电镀图案; 放置在所述孔中并电连接到所述电镀图案的半导体芯片; 以及在电镀图案周围形成在与半导体芯片相对的一侧的第一钝化层，并保护电镀图案。

    Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same
    2.
    发明申请
    Test pad structure, a pad structure for inspecting a semiconductor chip and a wiring subtrate for a tape package having the same 有权
    测试垫结构，用于检查半导体芯片的焊盘结构和具有该衬垫结构的带封装

    公开(公告)号：US20090322362A1

    公开(公告)日：2009-12-31

    申请号：US12457775

    申请日：2009-06-22

    申请人： So-Young Lim ,  Sang-Heui Lee

    发明人： So-Young Lim ,  Sang-Heui Lee

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2884 ,  G01R1/06 ,  G09G3/006 ,  H01L22/32 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K1/189 ,  H05K3/0052 ,  H05K2201/10681 ,  H01L2924/00

    摘要： A test pad structure may include a plurality of test pads and a plurality of connection leads. A plurality of the test pads may be sequentially arranged from a wiring pattern on a substrate and arranged in rows parallel with one another. The plurality of the test pads may include a first group of test pads having at least one pad arranged in a first row and a second group of test pads having at least two pads. A plurality of the connection leads may extend from end portions of the wiring pattern to be connected to the plurality of test pads. A plurality of the connection leads may include at least one inner lead passing between the at least two pads of the second group of the test pads arranged in a second row closest to the first group of the test pads. The at least one inner lead may be connected to at least one pad of the at least two pads of the second group of the test pads arranged in a third row next to the second row.

    摘要翻译： 测试焊盘结构可以包括多个测试焊盘和多个连接引线。 多个测试焊盘可以从衬底上的布线图形顺序地布置并且彼此平行布置。 多个测试焊盘可以包括第一组测试焊盘，其具有布置在第一行中的至少一个焊盘和具有至少两个焊盘的第二组测试焊盘。 多个连接引线可以从要连接到多个测试焊盘的布线图案的端部延伸。 多个连接引线可以包括通过第二组测试焊盘的至少两个焊盘之间的至少一个内引线，该焊盘布置在最靠近第一组测试焊盘的第二行中。 所述至少一个内引线可以连接到布置在第二行旁边的第三行中的第二组测试焊盘的至少两个焊盘中的至少一个焊盘。

    SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    太阳能电池模块及其制造方法

    公开(公告)号：US20120085383A1

    公开(公告)日：2012-04-12

    申请号：US13159663

    申请日：2011-06-14

    申请人： Young-Sang Cho ,  So-Young Lim ,  Tae-Hong Min ,  Ki-Won Choi

    发明人： Young-Sang Cho ,  So-Young Lim ,  Tae-Hong Min ,  Ki-Won Choi

    IPC分类号： H01L31/05

    CPC分类号： H01L31/0512 ,  H01L31/0201 ,  H01L31/048 ,  H01L31/0504 ,  H01L31/0508 ,  Y02E10/50

    摘要： A solar cell module having a reduced thickness using a flip-chip approach includes a transparent substrate, a transparent electrode interconnection disposed on the transparent substrate, and a plurality of solar cells disposed on the transparent electrode interconnection, each solar cell having at least one protrusion formed on one surface of the solar cell, the protrusion being bonded to the transparent electrode interconnection.

    摘要翻译： 使用倒装芯片方法具有减小的厚度的太阳能电池模块包括透明基板，布置在透明基板上的透明电极互连以及设置在透明电极互连上的多个太阳能电池，每个太阳能电池具有至少一个突起 形成在太阳能电池的一个表面上，该突起与透明电极互连结合。

    SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    太阳能电池模块及其制造方法

    公开(公告)号：US20120085393A1

    公开(公告)日：2012-04-12

    申请号：US13154696

    申请日：2011-06-07

    申请人： Young-Sang Cho ,  So-Young Lim ,  Tae-Hong Min

    发明人： Young-Sang Cho ,  So-Young Lim ,  Tae-Hong Min

    IPC分类号： H01L31/05 ,  H01L31/048

    CPC分类号： H01L31/0504 ,  H01L31/02013 ,  H01L31/048 ,  Y02E10/50

    摘要： A solar cell module includes a circuit board, a plurality of solar cells disposed on a first surface of the circuit board, a plurality of metal terminals formed on the first surface of the circuit board, and a plurality of wires electrically connecting the plurality of solar cells and the metal terminals. The circuit board has a second surface opposite to the first surface, the rear surface comprising openings corresponding to the metal terminals, the openings exposing the metal terminals to an exterior of the solar cell module, thus forming contact terminals for the solar cell module.

    摘要翻译： 太阳能电池模块包括电路板，设置在电路板的第一表面上的多个太阳能电池，形成在电路板的第一表面上的多个金属端子，以及电连接多个太阳能电池 电池和金属端子。 电路板具有与第一表面相对的第二表面，后表面包括对应于金属端子的开口，开口将金属端子暴露于太阳能电池模块的外部，从而形成用于太阳能电池模块的接触端子。