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    MULTI-STEP ANNEAL OF THIN FILMS FOR FILM DENSIFICATION AND IMPROVED GAP-FILL
    2.
    发明申请
    MULTI-STEP ANNEAL OF THIN FILMS FOR FILM DENSIFICATION AND IMPROVED GAP-FILL 审中-公开
    薄膜薄膜多层退化和改良胶圈

    公开(公告)号：US20070000897A1

    公开(公告)日：2007-01-04

    申请号：US11423651

    申请日：2006-06-12

    申请人： Nitin Ingle ,  Zheng Yuan ,  Vikash Banthia ,  Xinyun Xia ,  Hali Forstner ,  Rong Pan

    发明人： Nitin Ingle ,  Zheng Yuan ,  Vikash Banthia ,  Xinyun Xia ,  Hali Forstner ,  Rong Pan

    IPC分类号： H01L21/324 ,  H05B3/00

    CPC分类号： H01L21/324 ,  H01L21/02164 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/31612 ,  H01L21/31662 ,  H01L21/67115 ,  H01L21/76224 ,  H01L21/76283

    摘要： A method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 200° C. to about 800° C. in a first atmosphere comprising an oxygen containing gas, and annealing the substrate at a second temperature of about 800° C. to about 1400° C. in a second atmosphere lacking oxygen. In addition, a method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 400° C. to about 800° C. in the presence of an oxygen containing gas, purging the oxygen containing gas away from the substrate, and raising the substrate to a second temperature from about 900° C. to about 1100° C. to further anneal the substrate in an atmosphere that lacks oxygen.

    摘要翻译： 一种退火包括含有电介质材料的沟槽的衬底的方法，所述方法包括在包含含氧气体的第一气氛中在大约200℃至大约800℃的第一温度下对衬底退火，以及退火衬底 在约800℃至约1400℃的第二温度下在不含氧气的第二气氛中。 另外，包括含有电介质材料的沟槽的衬底的退火方法，该方法包括在含氧气体存在下，在约400℃至约800℃的第一温度下退火衬底， 含氧气体离开衬底，并将衬底升高至约900℃至约1100℃的第二温度，以在缺氧的气氛中进一步对衬底进行退火。

    Multi-step anneal of thin films for film densification and improved gap-fill
    3.
    发明申请
    Multi-step anneal of thin films for film densification and improved gap-fill 有权
    用于膜致密化和改善间隙填充的薄膜的多步退火

    公开(公告)号：US20060030165A1

    公开(公告)日：2006-02-09

    申请号：US10990002

    申请日：2004-11-16

    申请人： Nitin Ingle ,  Zheng Yuan ,  Vikash Banthia ,  Xinyun Xia ,  Hali Forstner ,  Rong Pan

    发明人： Nitin Ingle ,  Zheng Yuan ,  Vikash Banthia ,  Xinyun Xia ,  Hali Forstner ,  Rong Pan

    IPC分类号： H01L21/324

    CPC分类号： H01L21/324 ,  H01L21/02164 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/31612 ,  H01L21/31662 ,  H01L21/67115 ,  H01L21/76224 ,  H01L21/76283

    摘要： A method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 200° C. to about 800° C. in a first atmosphere comprising an oxygen containing gas, and annealing the substrate at a second temperature of about 800° C. to about 1400° C. in a second atmosphere lacking oxygen. In addition, a method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 400° C. to about 800° C. in the presence of an oxygen containing gas, purging the oxygen containing gas away from the substrate, and raising the substrate to a second temperature from about 900° C. to about 1100° C. to further anneal the substrate in an atmosphere that lacks oxygen.

    摘要翻译： 一种退火包括含有电介质材料的沟槽的衬底的方法，所述方法包括在包含含氧气体的第一气氛中在大约200℃至大约800℃的第一温度下对衬底退火，以及退火衬底 在约800℃至约1400℃的第二温度下在不含氧气的第二气氛中。 另外，包括含有电介质材料的沟槽的衬底的退火方法，该方法包括在含氧气体存在下，在约400℃至约800℃的第一温度下退火衬底， 含氧气体离开衬底，并将衬底升高至约900℃至约1100℃的第二温度，以在缺氧的气氛中进一步对衬底进行退火。

    Multi-step anneal of thin films for film densification and improved gap-fill
    5.
    发明授权
    Multi-step anneal of thin films for film densification and improved gap-fill 有权
    用于膜致密化和改善间隙填充的薄膜的多步退火

    公开(公告)号：US07642171B2

    公开(公告)日：2010-01-05

    申请号：US10990002

    申请日：2004-11-16

    申请人： Nitin K. Ingle ,  Zheng Yuan ,  Vikash Banthia ,  Xinyun Xia ,  Hali J. L. Forstner ,  Rong Pan

    发明人： Nitin K. Ingle ,  Zheng Yuan ,  Vikash Banthia ,  Xinyun Xia ,  Hali J. L. Forstner ,  Rong Pan

    IPC分类号： H01L21/76

    CPC分类号： H01L21/324 ,  H01L21/02164 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/31612 ,  H01L21/31662 ,  H01L21/67115 ,  H01L21/76224 ,  H01L21/76283

    摘要： A method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 200° C. to about 800° C. in a first atmosphere comprising an oxygen containing gas, and annealing the substrate at a second temperature of about 800° C. to about 1400° C. in a second atmosphere lacking oxygen. In addition, a method of annealing a substrate comprising a trench containing a dielectric material, the method including annealing the substrate at a first temperature of about 400° C. to about 800° C. in the presence of an oxygen containing gas, purging the oxygen containing gas away from the substrate, and raising the substrate to a second temperature from about 900° C. to about 1100° C. to further anneal the substrate in an atmosphere that lacks oxygen.

    摘要翻译： 一种退火包括含有电介质材料的沟槽的衬底的方法，所述方法包括在包含含氧气体的第一气氛中在大约200℃至大约800℃的第一温度下对衬底退火，以及退火衬底 在约800℃至约1400℃的第二温度下在不含氧气的第二气氛中。 另外，包括含有电介质材料的沟槽的衬底的退火方法，该方法包括在含氧气体存在下，在约400℃至约800℃的第一温度下退火衬底， 含氧气体离开衬底，并将衬底升高至约900℃至约1100℃的第二温度，以在缺氧的气氛中进一步对衬底进行退火。

    Gap-fill depositions in the formation of silicon containing dielectric materials
    7.
    发明授权
    Gap-fill depositions in the formation of silicon containing dielectric materials 失效
    在形成含硅介电材料时的间隙填充沉积

    公开(公告)号：US07456116B2

    公开(公告)日：2008-11-25

    申请号：US11018381

    申请日：2004-12-20

    申请人： Nitin K. Ingle ,  Shan Wong ,  Xinyun Xia ,  Vikash Banthia ,  Won B. Bang ,  Yen-Kun V. Wang ,  Zheng Yuan

    发明人： Nitin K. Ingle ,  Shan Wong ,  Xinyun Xia ,  Vikash Banthia ,  Won B. Bang ,  Yen-Kun V. Wang ,  Zheng Yuan

    IPC分类号： H01L21/31

    CPC分类号： C23C16/45512 ,  C23C16/401 ,  C23C16/45523 ,  C23C16/52

    摘要： A method to form a silicon oxide layer, where the method includes the step of providing a continuous flow of a silicon-containing precursor to a chamber housing a substrate, where the silicon-containing precursor is selected from TMOS, TEOS, OMTS, OMCTS, and TOMCATS. The method may also include the steps of providing a flow of an oxidizing precursor to the chamber, and causing a reaction between the silicon-containing precursor and the oxidizing precursor to form a silicon oxide layer. The method may further include varying over time a ratio of the silicon-containing precursor:oxidizing precursor flowed into the chamber to alter a rate of deposition of the silicon oxide on the substrate.

    摘要翻译： 一种形成氧化硅层的方法，其中该方法包括提供含硅前体连续流入容纳衬底的室的步骤，其中含硅前驱体选自TMOS，TEOS，OMTS，OMCTS， 和TOMCATS。 该方法还可以包括以下步骤：向室提供氧化前体流，并使含硅前体和氧化前体之间的反应形成氧化硅层。 该方法可以进一步包括随着时间的推移改变硅含量的前体：氧化前体流入室中以改变氧化硅在衬底上的沉积速率。

    Gas flow control in a wafer processing system having multiple chambers for performing same process
    10.
    发明授权
    Gas flow control in a wafer processing system having multiple chambers for performing same process 失效
    在具有用于执行相同处理的多个室的晶片处理系统中的气体流量控制

    公开(公告)号：US06843882B2

    公开(公告)日：2005-01-18

    申请号：US10263556

    申请日：2002-10-02

    申请人： Karthik Janakiraman ,  Victor Wang ,  Vikash Banthia ,  Teresa Winson ,  Nitin Ingle

    发明人： Karthik Janakiraman ,  Victor Wang ,  Vikash Banthia ,  Teresa Winson ,  Nitin Ingle

    IPC分类号： C23C16/44 ,  C23C16/455 ,  C23C16/52 ,  H01L21/00 ,  H01L21/677 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306

    CPC分类号： H01L21/67754 ,  C23C16/4412 ,  C23C16/455 ,  C23C16/52 ,  H01L21/67017 ,  H01L21/67178 ,  H01L21/6719

    摘要： A system for processing substrates comprises a plurality of process chambers. Each process chamber includes an inlet gas distribution member connected to an inlet gas line to distribute gas from the inlet gas line into the process chamber, and a gas outlet. The inlet gas distribution member has an inlet gas distribution member impedance to a gas flow through the inlet gas distribution member into the process chamber. The plurality of process chambers are substantially identical. A source gas delivery line is connected to the inlet gas lines of the plurality of process chambers to supply a gas flow to be divided into the inlet gas lines. A plurality of tunable upstream gas restrictors are each disposed in one of the inlet gas lines connected to the inlet gas distribution members of the process chambers and are configured to adjust a flow rate into the corresponding process chamber.

    摘要翻译： 用于处理衬底的系统包括多个处理室。 每个处理室包括连接到入口气体管线以将气体从入口气体管线分配到处理室中的入口气体分配构件和气体出口。 入口气体分配构件具有入口气体分配构件对通过入口气体分配构件的气体流入处理室的阻抗。 多个处理室基本相同。 源气体输送管线连接到多个处理室的入口气体管线，以供应待分成入口气体管线的气流。 多个可调节的上游气体限制器分别设置在连接到处理室的入口气体分配构件的入口气体管线中的一个中，并且被配置为调节进入相应处理室的流量。