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1.发明申请Electronic circuit device, and method and apparatus for manufacturing the same 审中-公开电子电路装置及其制造方法和装置公开(公告)号：US20050093172A1
公开(公告)日：2005-05-05
申请号：US10959324
申请日：2004-10-07
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56 , H01L21/60 , H01L23/29 , H01L23/31 , H01L23/498 , H05K3/28 , H01L21/48 , H01L23/52
CPC分类号： G06K19/07718 , G06K19/07728 , G06K19/07745 , G06K19/07749 , G06K19/0775 , H01L23/49855 , H01L24/81 , H01L2224/1134 , H01L2224/16225 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81395 , H01L2224/83192 , H01L2224/8388 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/14 , H05K3/281 , H05K3/284 , H01L2924/00
摘要： An electronic circuit device has a substrate having a wiring pattern, an electronic component electrically connected to a terminal section of the wiring pattern by contacting a projection electrode with it, a cover that is disposed at a position facing the substrate and grapples the electronic component between it and the substrate, and a resin layer made of thermoplastic resin filled in a gap between the substrate and the cover. The gap includes a space in a connection region except an electric connection part between the projection electrode and the terminal section. The electronic component is adhered to the substrate and the substrate is adhered to the cover through the resin layer. Thus, the electronic circuit device having high connection reliability and high mass productivity, and a method and apparatus for manufacturing the electronic circuit device can be provided.
摘要翻译： 电子电路器件具有布线图案的基板，通过与突起电极接触而与布线图案的端子部分电连接的电子部件，设置在面向基板的位置并且将电子部件与第二电路部件之间抓握的盖 以及填充在基板和盖之间的间隙中的由热塑性树脂制成的树脂层。 间隙包括除了突起电极和端子部之间的电连接部分以外的连接区域中的空间。 电子部件粘附到基板上，并且基板通过树脂层粘附到盖上。 因此，可以提供具有高连接可靠性和高质量生产率的电子电路装置，以及用于制造电子电路装置的方法和装置。
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公开(公告)号：US5917156A
公开(公告)日：1999-06-29
申请号：US521047
申请日：1995-08-29
CPC分类号： H05K3/3421 , H05K3/363 , H01R12/7076 , H01R43/0256 , H05K1/11 , H05K2201/0394 , H05K2201/10681 , H05K2203/0126 , H05K2203/0195 , H05K3/3489 , Y02P70/613
摘要： Copper electrodes are formed on a circuit board to be bonded with leads of a TAB driving liquid crystal. A pre-deposit solder receiver having solder printed thereon is also provided on the circuit board in alignment with and prior to an electrode to be first bonded with a lead, to form a sufficient solder pool between plural electrodes and a bottom wall of a soldering iron. Solder/bonding is accordingly realized efficiently even from a starting electrode E1. Also, an excessive solder receiver may be provided in alignment with and after an electrode to be last bonded with a lead.
摘要翻译： 铜电极形成在与TAB驱动液晶的引线接合的电路板上。 在其上印刷有焊料的预沉积焊料接收器也在电路板上设置，以与首先与引线接合的电极对齐并在其之前，以在多个电极和烙铁底壁之间形成足够的焊料池 。 因此，即使从起动电极E1而有效地实现焊接/接合。 此外，可以提供与最后与铅接合的电极对准和之后的过量焊料接收器。
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公开(公告)号：US07381902B2
公开(公告)日：2008-06-03
申请号：US10951620
申请日：2004-09-29
IPC分类号： H05K1/09
CPC分类号： H05K3/249 , H05K1/095 , H05K3/207 , H05K2201/035
摘要： A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon covering the surface of the patterned wiring. The wiring board of this structure is superior in resistance to moisture absorption and water, prevents silver migration attributable to the moisture, and reduces contact resistance in the connection between a terminal portion of the wiring board and an external apparatus.
摘要翻译： 布线板包括由主要由银构成并以其表面暴露在基板上方的方式嵌入到基板中的导电树脂形成的图案布线，以及主要由覆盖图案化布线表面的碳形成的覆盖导体。 该结构的布线基板具有优异的耐吸湿性和防水性，防止由于水分引起的银迁移，并且降低了布线板的端子部分与外部设备之间的连接中的接触电阻。
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公开(公告)号：US07375421B2
公开(公告)日：2008-05-20
申请号：US11147864
申请日：2005-06-08
CPC分类号： H01L25/50 , H01L23/5384 , H01L23/5387 , H01L23/5389 , H01L24/97 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06593 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H05K1/185 , H05K1/189 , H05K2201/055 , H01L2924/00014 , H01L2924/00
摘要： Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.
摘要翻译： 变薄和堆叠对于用于各种移动设备，智能卡，存储卡等的电路模块是必不可少的。 这些要求使得电路模块的制造由于分层而更复杂或更不可靠。 提供了一种多层结构的电路模块，其通过将半导体芯片和无源部件嵌入由热塑性树脂制成的片材中而形成; 在电路块的边界处折叠由在其上设置有布线图案的电路块形成的模块片，以堆叠成层; 并通过施加热和压力进行热粘合和集成模块片。 结果，可以以简单的方式制造高可靠性的电路模块。
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公开(公告)号：US06971167B2
公开(公告)日：2005-12-06
申请号：US10611868
申请日：2003-07-03
CPC分类号： H05K3/0017 , H05K3/002 , H05K3/0041 , H05K3/4644 , H05K2201/0179 , H05K2201/0376 , H05K2203/0278 , H05K2203/0582 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A multilayered circuit board and a method of forming the multilayered circuit board are provided. In a first circuit forming process, a first circuit is formed on an insulating board with a conductor; in a circuit embedding process, the first circuit is embedded in the insulating board so as to have a predetermined surface flatness and a predetermined parallelism; in a masking process, a pilot hole for a via hole is masked at a part of a surface of the circuit; in an insulating layer forming process P5p, an insulating material is applied as a layer to the surface except that portion thereof covered by the mask; in an insulating material layer flattening process, the surface of the insulating material layer is flattened so as to have the predetermined surface flatness and the predetermined parallelism; and in a pilot hole forming process, the mask is removed.
摘要翻译： 提供多层电路板和形成多层电路板的方法。 在第一电路形成工艺中，在具有导体的绝缘板上形成第一电路; 在电路嵌入处理中，第一电路被嵌入绝缘板中以具有预定的表面平坦度和预定的平行度; 在掩模处理中，用于通孔的导向孔在电路的表面的一部分被掩蔽; 在绝缘层形成工艺P 5 p中，除了被掩模覆盖的部分之外，绝缘材料作为层施加到表面; 在绝缘材料层平坦化处理中，绝缘材料层的表面被平坦化以具有预定的表面平坦度和预定的平行度; 并且在导向孔形成处理中，去除掩模。
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公开(公告)号：US07353600B2
公开(公告)日：2008-04-08
申请号：US10940933
申请日：2004-09-15
CPC分类号： H05K3/005 , H05K3/0011 , H05K3/4015 , H05K3/4644 , H05K2201/0108 , H05K2201/083 , H05K2201/10242 , H05K2203/0108 , H05K2203/104 , H05K2203/1189 , H05K2203/308 , Y10T29/49147 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165
摘要： A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 so as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and forming second conductive interconnection 6 onto interlevel insulator layer 42 to include opening 5.
摘要翻译： 一种电路板制造方法，包括：在绝缘体基板1上形成第一导电布线2; 将用于将第一导电互连2和第二导电互连6电绝缘的层间绝缘体层42的树脂膜41施加到绝缘体基板1上; 在施加树脂膜41之前，使柱状构件3立在第一导电布线2的规定位置上，或者将柱状构件3压入树脂膜41中，以到达第一导电布线2的附近或第 在施加树脂膜41之后的第一导电互连2的部分; 硬化树脂膜41以形成层间绝缘体层42; 拉出柱状构件3以在层间绝缘体层42中形成开口5; 以及在层间绝缘体层42上形成第二导电布线6以包括开口5。
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公开(公告)号：US20070127224A1
公开(公告)日：2007-06-07
申请号：US11699433
申请日：2007-01-30
IPC分类号： H01L21/8242
CPC分类号： H01L24/83 , H01L21/563 , H01L24/11 , H01L24/29 , H01L24/31 , H01L24/81 , H01L2224/05573 , H01L2224/056 , H01L2224/1148 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83101 , H01L2224/83192 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H05K3/305 , H05K3/321 , H05K2201/10378 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/4921 , H01L2924/00 , H01L2924/00014
摘要： An electronic component having connection terminals on one side thereof is bonded to a circuit board via an adhesive sheet having through-holes. The connection terminals on the electronic component are connected to electrode pads provided on the circuit board via a conductive adhesive in the through-holes. Thus, an electronic circuit device is formed. Using a polymeric resin film sheet for the circuit board and mounting an electronic component, e.g. an LSI, onto the circuit board can provide a small, light, thin, and inexpensive electronic circuit device.
摘要翻译： 在其一侧具有连接端子的电子部件通过具有通孔的粘合片与电路板接合。 电子部件上的连接端子通过通孔中的导电粘合剂连接到设置在电路板上的电极焊盘。 因此，形成电子电路装置。 使用用于电路板的聚合物树脂膜片和安装电子部件，例如， 电路板上的LSI可以提供小型，轻便，薄型和廉价的电子电路装置。
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公开(公告)号：US20050275088A1
公开(公告)日：2005-12-15
申请号：US11147864
申请日：2005-06-08
IPC分类号： H01L21/98 , H01L23/48 , H01L23/538 , H01L25/065 , H01R4/58 , H05K1/18
CPC分类号： H01L25/50 , H01L23/5384 , H01L23/5387 , H01L23/5389 , H01L24/97 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06593 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H05K1/185 , H05K1/189 , H05K2201/055 , H01L2924/00014 , H01L2924/00
摘要： Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.
摘要翻译： 变薄和堆叠对于用于各种移动设备，智能卡，存储卡等的电路模块是必不可少的。 这些要求使得电路模块的制造由于分层而更复杂或更不可靠。 提供了一种多层结构的电路模块，其通过将半导体芯片和无源部件嵌入由热塑性树脂制成的片材中而形成; 在电路块的边界处折叠由在其上设置有布线图案的电路块形成的模块片，以堆叠成层; 并通过施加热和压力进行热粘合和集成模块片。 结果，可以以简单的方式制造高可靠性的电路模块。
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公开(公告)号：US20050079707A1
公开(公告)日：2005-04-14
申请号：US10947177
申请日：2004-09-23
CPC分类号： H05K3/247 , H01L2924/0002 , H05K1/095 , H05K2201/0266 , H05K2201/035 , H01L2924/00
摘要： An interconnection substrate include: interconnection layer 12 region where at least first conductor layer 16 and second conductor layer 18 are vertically stacked in that order on substrate 10, first conductor layer 16 and second conductor layer 18 containing conductive particles and a binder, wherein first conductor layer 16 and second conductor layer 18 stacked in the interconnection layer 12 region have conductive particles different in average particle size from each other. As a result, only intended region can have low resistance.
摘要翻译： 互连基板包括：互连层12，其中至少第一导体层16和第二导体层18在基板10上依次垂直堆叠，第一导体层16和包含导电颗粒和粘合剂的第二导体层18，其中第一导体 堆叠在互连层12区域中的层16和第二导体层18具有彼此平均粒径不同的导电粒子。 结果，只有预期的区域可以具有低电阻。
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公开(公告)号：US20050060886A1
公开(公告)日：2005-03-24
申请号：US10940933
申请日：2004-09-15
CPC分类号： H05K3/005 , H05K3/0011 , H05K3/4015 , H05K3/4644 , H05K2201/0108 , H05K2201/083 , H05K2201/10242 , H05K2203/0108 , H05K2203/104 , H05K2203/1189 , H05K2203/308 , Y10T29/49147 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165
摘要： A circuit board fabrication method comprising the steps of: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 in such a manner as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and (f) forming second conductive interconnection 6 onto interlevel insulator layer 42 in such a manner as to include opening 5.
摘要翻译： 一种电路板制造方法，包括以下步骤：在绝缘体基板1上形成第一导电布线2; 将用于将第一导电互连2和第二导电互连6电绝缘的层间绝缘体层42的树脂膜41施加到绝缘体基板1上; 在施加树脂膜41之前，使柱状构件3在第一导电布线2上的规定位置上立起，或者将柱状构件3按压到树脂膜41中，使其到达第一导电互连 2或第一导电互连2的一部分; 硬化树脂膜41以形成层间绝缘体层42; 拉出柱状构件3以在层间绝缘体层42中形成开口5; 和（f）以包括开口5的方式在层间绝缘体层42上形成第二导电布线6。
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