摘要:
A bidirectional transmission circuit for inputting/outputting a signal from/onto a bidirectional transmission line includes: a transceiver for transmitting/receiving a signal; a first element having an impedance; a second element being a short line; and a switching unit for coupling the transceiver to the bidirectional transmission line via the first element when the transceiver transmits a signal, and coupling the transceiver to the bidirectional transmission line via the second element when the transceiver receives a signal.
摘要:
According to the present invention, the setting height position of a first terminal is set to be lower than the setting height position of a second terminal on the terminal formation surface of a printed substrate, so that the protection of an internal circuit and the transmission of a high-speed signal can be both achieved.
摘要:
A signal line, being in a six-layer board and connecting terminal 102 of component 101 with terminal 115 of component 114, requires tamper-resistance. The signal line is composed of foil 103 on an outside layer, a via 104, foil 111 on the third layer, via 105, foil 112 on the fourth layer, via 106, and foil 113 on the sixth layer. Portions of the signal line that exist on outside layers are all hidden under circuit components. Foil 103 and an end of via 104 are placed under component 101 on first layer 116, an end of via 105 is placed under component 107 on layer 116, an end of via 106 is placed under component 108 on layer 116, the other end of via 104 is placed under component 109 on sixth layer 121, the other end of via 105 is placed under component 110 on layer 121, and foil 113 and the other end of via 106 are placed under component 114 on layer 121.
摘要:
A design aiding apparatus and a method, and a storage medium storing a design aiding program enable the efficient layout design of components in a multilayer wiring board formed by laminating a plurality of wiring layers. The design aiding apparatus includes (a) a first acquiring unit for acquiring information showing a first location in a lamination direction of the wiring layers, (b) a second acquiring unit for acquiring information showing a second location on a two-dimensional plane that is orthogonal to the lamination direction, and (c) a placement unit for generating information showing a space to be occupied when the component is placed in such a manner that a placement reference point of the component coincides with the second location that is on the two-dimensional plane including the first location. According to the above construction, the present invention is capable of aiding layout design of components in the wiring board.
摘要:
An object of the present invention is to realize reduction in an area of an output stage driver in an interface circuit that switches between two transmission systems. The interface circuit has two driver circuits and a drive control circuit that can switch between two driving systems that are a voltage driving system and a current driving system. The two driver circuits are connected to a power supply potential via the drive control circuit. Two input signals and inverted logic signals of the input signals are inputted via a selection circuit. According to a control signal inputted into the drive control circuit, the interface circuit switches between the voltage-driving type single-ended transmission system and current driving type differential transmission system.
摘要:
An object of the present invention is to realize reduction in an area of an output stage driver in an interface circuit that switches between two transmission systems. The interface circuit has two driver circuits and a drive control circuit that can switch between two driving systems that are a voltage driving system and a current driving system. The two driver circuits are connected to a power supply potential via the drive control circuit. Two input signals and inverted logic signals of the input signals are inputted via a selection circuit. According to a control signal inputted into the drive control circuit, the interface circuit switches between the voltage-driving type single-ended transmission system and current driving type differential transmission system.
摘要:
Fine-pitch first and second bonding pads are formed on a chip along its perimeter. The first bonding pads are formed at the peripheral parts on the chip, while the second bonding pads are formed inside the peripheral parts. An ESD protection circuit is connected to the first bonding pad, and an I/O circuit is connected to the second bonding pad. First and second bonding wires connect the first and second bonding pads to the same package pin, respectively. The second bonding wire is configured to be sufficiently longer than the first bonding wire, regardless of the pitch of the first bonding pads.
摘要:
A signal receiver (11) receives an analog signal via a twisted pair cable (31). An A/D converter (12) converts the analog signal to a digital signal. A phase detection unit (14) detects the phase of the digital signal, and generates a reception timing signal. A transmission timing generation unit (15) controls, based on the reception timing signal, timing for a transmission processing unit (16) to output the digital signal such that the reception signal (point A) and a transmission signal (point D) are different in phase by a predetermined degree. The transmission processing unit (16) outputs, in accordance with the timing, a digital signal obtained by performing mapping on data inputted from a connection device (20). A D/A converter (17) converts the digital signal to an analog signal. A signal transmitter (18) transmits the analog signal via a twisted pair cable (32).
摘要翻译:信号接收器(11)经由双绞线电缆(31)接收模拟信号。 A / D转换器(12)将模拟信号转换成数字信号。 相位检测单元(14)检测数字信号的相位,并产生接收定时信号。 发送定时生成单元(15)基于接收定时信号,控制发送处理单元(16)输出数字信号的定时,使得接收信号(点A)和发送信号(点D)不同 同时预定的程度。 发送处理单元(16)根据定时输出通过对从连接装置(20)输入的数据进行映射而获得的数字信号。 D / A转换器(17)将数字信号转换成模拟信号。 信号发送器(18)经由双绞线电缆(32)发送模拟信号。
摘要:
First and second transmission lines and are connected to each other in series. A first terminator is connected to the first transmission line in parallel, and is provided externally of a semiconductor device. A second terminator is connected to the second transmission line in parallel, and is provided inside the semiconductor device. The values of the first and second terminator are adjusted so that the combined resistance value of first and second terminator and the second transmission line matches with the impedance of the first transmission line. Impedance matching of the entire transmission line can be achieved with this simple construction, thus, a stable, high quality signal can be transmitted.
摘要:
An object of the present invention is to provide a technique to improve the data transmission efficiency which allows correct reception of the data at the same time. A removable memory device that transmits/receives data to and from a host terminal, which includes: a clock reception section that receives a transmission/reception clock, which is used for transmitting/receiving data between the host terminal and the removable memory device, from the host terminal; a phase synchronization pattern generation section that generates a phase synchronization pattern, which is for adjusting a phase of internal reception clock which the host terminal incorporates for receiving data from the removable memory device, based on the transmission/reception clock; and a transmission section that transmits the generated phase synchronization pattern to the host terminal, and in which the phase synchronization pattern includes a first level signal which lasts for at least two cycles, and a second level signal which follows the first level signal and lasts for one cycle, is provided.