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公开(公告)号：US06911599B2
公开(公告)日：2005-06-28
申请号：US10795597
申请日：2004-03-08
申请人： Paul K. Rosenberg , Giorgio Giaretta , Stefano Schiaffino , James Stewart , Rudolf J. Hofmeister
发明人： Paul K. Rosenberg , Giorgio Giaretta , Stefano Schiaffino , James Stewart , Rudolf J. Hofmeister
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01L2924/19107 , H01S5/02248 , H01S5/024 , H01S5/02415 , H01S5/06804 , H01S5/06837 , H01S5/183 , H01L2924/00
摘要： A header assembly is provided that includes a base having a device side and a connector side. The header assembly further includes a platform attached to the base and positioned in a predetermined orientation with respect to the base. The device side of the base cooperates with a cap to define a hermetic chamber wherein one or more optoelectronic components, such as optical transmitters and optical receivers, are disposed. The platform includes an inside portion proximate the device side of the base and an outside portion proximate the connector side of the base, and the platform further includes at least one conductive pathway extending substantially through the platform so as to facilitate electrical communication between components disposed on the device side of the base, and circuits, devices and systems disposed on the connector side of the base.
摘要翻译： 提供一种头部组件，其包括具有装置侧和连接器侧的底座。 集管组件还包括附接到基座并相对于基座以预定取向定位的平台。 基座的装置侧与盖配合以限定密封室，其中设置有一个或多个光电子部件，例如光发射器和光接收器。 平台包括靠近基座的装置侧的内部部分和靠近基座的连接器侧的外部部分，并且平台还包括基本上延伸通过平台延伸的至少一个导电通路，以便于设置在基座上的部件之间的电气连通 基座的装置侧以及设置在基座的连接器侧上的电路，装置和系统。
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公开(公告)号：US06703561B1
公开(公告)日：2004-03-09
申请号：US10231395
申请日：2002-08-29
申请人： Paul K. Rosenberg , Giorgio Giaretta , Stefano Schiaffino , James Stewart , Rudolf J. Hofmeister
发明人： Paul K. Rosenberg , Giorgio Giaretta , Stefano Schiaffino , James Stewart , Rudolf J. Hofmeister
IPC分类号： H01L2302
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01L2924/19107 , H01S5/02248 , H01S5/024 , H01S5/02415 , H01S5/06804 , H01S5/06837 , H01S5/183 , H01L2924/00
摘要： A header assembly including a base and a platform extending through the base and substantially perpendicular thereto. The platform includes conductive pathways that connect electrical components on either side of the base, and the conductive pathways cooperate to form a connector at the first end of the platform. A laser is mounted on top of a thermoelectric cooler that is directly joined to the second end of the platform. The laser and thermoelectric cooler are enclosed in a hermetic chamber cooperatively defined by the base, the platform, and a cap that is joined to the base. A photodiode optically coupled with the laser and a thermistor thermally coupled with the laser cooperate with the thermoelectric cooler and a control circuit to facilitate control of the performance of the laser.
摘要翻译： 一种头部组件，其包括底座和延伸穿过底座并且基本垂直于其的平台。 平台包括连接基座两侧的电气部件的导电通路，并且导电通路协作以在平台的第一端形成连接器。 激光器安装在直接连接到平台第二端的热电冷却器的顶部上。 激光和热电冷却器封闭在由基座，平台和与基座接合的盖协同地限定的密封室中。 与激光器光学耦合的光电二极管和与激光器热耦合的热敏电阻器与热电冷却器和控制电路配合以便于控制激光器的性能。
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公开(公告)号：US06586678B1
公开(公告)日：2003-07-01
申请号：US10077067
申请日：2002-02-14
IPC分类号： H01L2302
CPC分类号： H01S5/02212 , H01L23/055 , H01L23/10 , H01L2924/0002 , H01S5/02415 , H01S5/02469 , H01L2924/00
摘要： An improved transistor header assembly incorporating a rectangular platform perpendicularly bisecting the base of the transistor header. The ceramic platform provides the ability to house multiple electrical components and/or devices on either side of the base. The platform has a higher thermal conductivity than the base of a standard header. In addition, the platform increases the electrical input/output density of the header by increasing the number of potential electrical connections between the two sides of the base.
摘要翻译： 一种改进的晶体管集管组件，其包括垂直地平分晶体管集管的基极的矩形平台。 陶瓷平台提供在基座的两侧容纳多个电气部件和/或设备的能力。 该平台具有比标准头部的基座更高的热导率。 此外，该平台通过增加基座两侧之间的潜在电气连接的数量来增加集管的电输入/输出密度。
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公开(公告)号：US07042067B2
公开(公告)日：2006-05-09
申请号：US10393164
申请日：2003-03-19
CPC分类号： G02B6/4201 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/48137 , H01L2224/49171 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/023 , H05K1/0243 , H05K1/189 , H05K3/306 , H05K3/3447 , H05K2201/09809 , H05K2201/10022 , H05K2201/10121 , H05K2201/10522 , H05K2201/2036 , H01L2924/00
摘要： An optoelectronic assembly includes a circuit board having a set of signal traces, where one or more of the signal traces has a junction point that integrates a pad of a circuit element. Exemplary circuit elements include a resistor, capacitor, and an inductor. The junction point has a first width and a first thickness, and the one or more signal traces have a second width and a second thickness. The dimensions of the junction point and the dimensions of the one or more signal traces are configured such that the first width and the second width are substantially similar, and that the first thickness and the second thickness are substantially similar. In one embodiment, the first width is no greater than 125% of the second width.
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5.发明授权Submount, pedestal, and bond wire assembly for a transistor outline package with reduced bond wire inductance 有权用于晶体管外形封装的底座，基座和接合线组件，具有降低的接合线电感公开(公告)号：US07254149B2
公开(公告)日：2007-08-07
申请号：US10393218
申请日：2003-03-19
IPC分类号： H01S3/04
CPC分类号： H01S5/02212 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/48137 , H01L2924/30107 , H01L2924/3011 , H01S5/02276 , H01S5/0427 , H01L2924/00
摘要： The present invention relates generally to optoelectronic devices, and particularly to a submount, pedestal, and bond wire assembly for a transistor outline package. A bottom surface of the submount is connected to a top surface of the pedestal. Each bond wire in a bond wire set is connected to a position on the top surface of the submount, and to a position on the signal line. The signal line is positioned a first distance from the position on the top surface of the submount and a second distance from the pedestal. The submount is sized such that a portion of the bottom and the top surface of the submount extends beyond the top surface of the pedestal such that the first distance is less than the second distance.
摘要翻译： 本发明一般涉及光电器件，尤其涉及用于晶体管轮廓封装的基座，基座和接合线组件。 底座的底面连接到基座的顶面。 接合线组中的每个接合线连接到子安装座的顶表面上的位置，并连接到信号线上的位置。 信号线位于距离底座的顶表面上的位置的第一距离处，并且距离基座的第二距离。 底座的尺寸使得底座的一部分和底座的顶表面延伸超过基座的顶表面，使得第一距离小于第二距离。
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公开(公告)号：US07333199B2
公开(公告)日：2008-02-19
申请号：US11125918
申请日：2005-05-10
申请人： Chris Togami , Gary Sasser , Rudolf J. Hofmeister , Paul K. Rosenberg , Frank H. Levinson , Axel Mehnert
发明人： Chris Togami , Gary Sasser , Rudolf J. Hofmeister , Paul K. Rosenberg , Frank H. Levinson , Axel Mehnert
CPC分类号： G02B6/4204 , G02B6/423 , G02B6/4246
摘要： The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.
摘要翻译： 本发明的原理涉及将具有三个平移自由度的光学部件对准。 透镜销，透镜基座和模制封装在第一方向，第二方向和第三方向上对准，使得在包括在透镜销的透镜和模制封装之间传输的光信号的信号强度被优化 。 透镜销被机械联接到透镜基座，以在第一方向上固定透镜相对于模制包装的位置。 随后，透镜基座和模制封装在第二和第三方向上重新对准，使得信号强度再次被优化。 透镜基座机械耦合到模制封装件，以在第二和第三方向上固定透镜基座相对于模制封装件的位置。
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公开(公告)号：US07044657B2
公开(公告)日：2006-05-16
申请号：US10393215
申请日：2003-03-19
IPC分类号： G02B6/42
CPC分类号： H01L25/167 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/48137 , H01L2924/30107 , H01L2924/3011 , H01S5/02212 , H01S5/02276 , H01S5/0427 , H01L2924/00
摘要： An optoelectronic assembly includes an optoelectronic device, housed in a transistor outline (TO) package having a base and a signal lead traversing an aperture in the base, and a circuit interconnect coupled to the optoelectronic device and TO package. The circuit interconnect substantially comprises an insulator, and includes a data signal trace, a resistor, and a conductor. The data signal trace, on a first side of the insulator, transmits data signal current between the optoelectronic device and an external device. The resistor, also on the first side, transmits the data signal current between the optoelectronic device and the data signal trace. The resistor is electrically and mechanically connected to the signal lead and to data signal trace. The conductor, on a second side of the insulator, transmits a ground current between the TO package and the external device, and forms a current path substantially parallel to the data signal trace.
摘要翻译： 光电组件包括一个光电器件，该光电器件容纳在晶体管轮廓（TO）封装中，该晶体管外形（TO）封装具有基极和穿过基极中的孔的信号引线，以及耦合到光电器件和TO封装的电路互连。 电路互连基本上包括绝缘体，并且包括数据信号迹线，电阻器和导体。 在绝缘体的第一侧上的数据信号迹线在光电器件和外部器件之间传输数据信号电流。 电阻器，也在第一侧，在光电器件和数据信号迹线之间传输数据信号电流。 电阻器电气和机械连接到信号引线和数据信号跟踪。 在绝缘体的第二侧上的导体在TO封装和外部器件之间传输接地电流，并且形成基本上平行于数据信号迹线的电流路径。
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公开(公告)号：US07211830B2
公开(公告)日：2007-05-01
申请号：US11030412
申请日：2005-01-06
IPC分类号： H01L29/267 , G02B6/36 , G02F1/29
CPC分类号： G02B6/4201 , H01L24/45 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/49111 , H01L2224/49175 , H01L2924/01013 , H01L2924/01028 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K1/0243 , H05K1/189 , H05K3/3447 , H05K2201/0715 , H05K2201/10121 , H05K2201/10166 , H05K2201/10371 , H05K2203/1147 , H01L2924/00014 , H01L2924/00
摘要： This disclosure concerns systems and devices configured to implement impedance matching schemes in a high speed data transmission environment. In one example, an optoelectronic assembly is provided that includes a TO package having a base through which one or more leads pass. The leads are electrically coupled to an optoelectronic device in the TO package, and are electrically isolated from the base. Some or all of the leads include a ground ring that is electrically isolated from the lead and electrically coupled with the base. A circuit interconnect is also included that is electrically coupled to the optoelectronic device and the TO package. The circuit interconnect includes a dielectric substrate having signal traces that are electrically coupled to the signal leads. A ground signal conductor disposed on the dielectric substrate is electrically coupled with the ground rings.
摘要翻译： 该公开涉及被配置为在高速数据传输环境中实现阻抗匹配方案的系统和设备。 在一个示例中，提供了一种光电组件，其包括具有一个或多个引线通过的基极的TO封装。 引线电耦合到TO封装中的光电子器件，并且与基极电隔离。 一些或全部引线包括与引线电隔离并与基极电耦合的接地环。 还包括电耦合到光电器件和TO封装的电路互连。 电路互连包括具有电耦合到信号引线的信号迹线的电介质基片。 设置在电介质基板上的接地信号导体与接地环电耦合。
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9.发明授权Circuit interconnect for optoelectronic device for controlled impedance at high frequencies 有权用于光电子器件的电路互连，用于高频控制阻抗公开(公告)号：US06876004B2
公开(公告)日：2005-04-05
申请号：US10005924
申请日：2001-12-04
CPC分类号： G02B6/4201 , H01L24/45 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/49111 , H01L2224/49175 , H01L2924/01013 , H01L2924/01028 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K1/0243 , H05K1/189 , H05K3/3447 , H05K2201/0715 , H05K2201/10121 , H05K2201/10166 , H05K2201/10371 , H05K2203/1147 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic assembly includes a transistor outline (TO) package that houses an optoelectronic device. The TO package and the optoelectronic device are coupled to a circuit interconnect. The circuit interconnect includes an insulator having a first side for transmitting a signal current between the optoelectronic device and a device external to the TO package, and a second side for transmitting a ground current between the TO package and the external device. For a predefined operating frequency range, the impedance of the circuit interconnect approximately matches the impedance of the signal leads of the TO package and also approximately matches the impedance of the device external to the TO package. The optoelectronic device may include a laser diode or a photo diode. In addition, the present invention is an optoelectronic transceiver including a transmitter optoelectronic assembly and a receiver optoelectronic assembly. The transmitter optoelectronic assembly includes a transmitter TO package and a transmitter circuit interconnect, and the receiver optoelectronic assembly includes a receiver TO package and a receiver circuit interconnect.
摘要翻译： 光电组件包括容纳光电器件的晶体管轮廓（TO）封装。 TO封装和光电子器件耦合到电路互连。 电路互连包括绝缘体，其具有用于在光电器件与TO封装外部的器件之间传输信号电流的第一侧，以及用于在TO封装和外部器件之间传输接地电流的第二侧。 对于预定义的工作频率范围，电路互连的阻抗近似匹配TO封装的信号引线的阻抗，并且大致匹配TO封装外部器件的阻抗。 光电子器件可以包括激光二极管或光电二极管。 另外，本发明是一种包括发射器光电组件和接收器光电组件的光电收发器。 发射器光电组件包括发射器TO封装和发射器电路互连，并且接收器光电组件包括接收器TO封装和接收器电路互连。
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公开(公告)号：US08953160B2
公开(公告)日：2015-02-10
申请号：US13471341
申请日：2012-05-14
申请人： Donald A. Ice , Rudolf J. Hofmeister , Yuxin Zhou , Harold G. Sampson , Qingfeng Huang , James Stewart , Janyce Lipson
发明人： Jan Lipson , Donald A. Ice , Rudolf J. Hofmeister , Yuxin Zhou , Harold G. Sampson , Qingfeng Huang , James Stewart
IPC分类号： G01J3/28
CPC分类号： G01J3/021 , G01J1/32 , G01J3/0297 , G01J3/10 , H01L27/14601 , H01L27/14806
摘要： Various systems and methods of monitoring laser safety by sensing contact of the system with a sample are provided. The system includes a focusing element for focusing an incident light from a laser light source onto a sample, an optical element having a collection zone for collecting a signal from the sample, a reflected light sensor for sensing a reflected light from the sample, wherein the reflected light sensor is located outside the collection zone of the optical element and on an inner surface of a housing of the system, an electrical circuit operably connected to the reflected light sensor and the laser light source and configured to control power to the laser light source in accordance with the reflected light sensed by the reflected light sensor and a spectral analyzer for processing the signal. Methods and other systems are also described and illustrated.
摘要翻译： 提供了通过感测系统与样品的接触来监测激光器安全性的各种系统和方法。 该系统包括用于将来自激光源的入射光聚焦到样本上的聚焦元件，具有用于收集来自样品的信号的收集区域的光学元件，用于感测来自样品的反射光的反射光传感器，其中， 反射光传感器位于光学元件的收集区域的外部和系统的壳体的内表面上，可操作地连接到反射光传感器和激光光源并被配置为控制激光源的功率的电路 根据由反射光传感器感测的反射光和用于处理信号的光谱分析器。 还描述和示出了方法和其他系统。
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