摘要:
A process and circuit for the bipolar pulse-shaped feeding of energy into low-pressure plasmas is provided. Within an average time period, a power which is to be as high as possible is to be fed into the low pressure discharge. In each polarization, the same power is to be fed although the impedance differs considerably. In a system for plasma and surface treatment techniques having at least two electrodes and one power supply, the outputs of at least two potential-free direct current supplies are switched such that an output of one direct current supply is conductively connected with an output of the same polarity of the other direct current supply. By means of a switch which is connected with each feed line to the electrodes and whose other outputs are led in a combined manner to the other outputs of the direct current source, these switches are operated via a timing generator in synchronism with the pole changing frequency. The switches are opened up in the event of the occurrence of an arcing. The process is used for the bipolar pulse sputtering for depositing electrically insulating layers on workpieces. Preferably, such layers are used for a mechanical protection, protection against wear and the improvement of sliding characteristics.
摘要:
Magnetron discharges are pulse-operated to avoid the so-called “arcing”. In the case of magnetron discharges from alternating current-fed magnetrons, the process is limited to the minor power of the energy supply because of the load-carrying capacity of the required electric components. When the magnetron discharges are fed by direct current, their effectiveness deteriorates because of the deposition of layers on the anode surfaces. The new process should enable a high supply power and prevent arcing. In magnetron discharges with at least two magnetron electrodes, the energy is supplied in such a way that at least one magnetron electrode is a cathode or anode and a number n1 of direct current pulses of said polarity is supplied. The poles of at least one magnetron electrode are then reversed and a number n2 of direct currents of this polarity are supplied. The process is carried on in this manner, the frequency of the direct current pulses being higher than that of the polarity reversals. The energy supply effectiveness is thus improved. This process and system enable the production of layers having the most different properties, for example for the glass, packaging, electronic, and machine construction industries.
摘要:
A procedure and apparatus for the application of carbon layers using reactive magnetron sputtering is described. The process includes sputtering of at least two targets made of carbon in a reactive atmosphere with a pulsed energy feed. During a pattern period of the pulses all targets (magnetrons) are once switched on as an anode and at least one target is switched as an anode at all times Various embodiments include detection and limitation of the "microarcs"; executing of regeneration processes according to fixed predetermined time intervals for at least 5 seconds. In one embodiment a microarc is detected on a magnetron and if a next pulse-off time is more than a selected time period away, then the magnetron is connected to a positive pole of the power supply. In another embodiment of the invention a pulsed negative voltage is applied to a substrate being sputtered by connecting the substrate to a negative pole of a pulsed power supply having a positive pole connected to a positive pole of a power supply for a magnetron. In another embodiment of the invention there is an electrode insulated from an installation mass which is connected to at least one positive pole of a power supply during the periodic pausing sputtering of substrates for regeneration.
摘要:
Production of a thin-film system containing at least one ultra-thin film, preferentially in the film thickness range from 1 to 10 nm, which is deposited by plasma-aided chemical or physical vapor-phase deposition using magnetron discharges. The method is characterized in that in the course of deposition of the ultra-thin film the power output is introduced into the plasma in the form of a controlled number of power pulses and that the average power output during the pulse-on time is set higher by a factor of at least 3 than the averaged power output over the entire coating time during deposition of the ultra-thin film.
摘要:
Process for monitoring an alternating-voltage discharge between the electrodes of a double electrode and an apparatus. The process includes measuring values of at least one of a discharge current and a discharge voltage for each half-wave within an alternating-voltage discharge period, determining a difference between the measured values of a second half-wave and the measured values of the first half-wave, and comparing the determined differences to specific tolerance values. When the specific tolerance values are exceeded by the determined differences, a power supply is reduced, whereby the discharge is at least briefly suppressed. The apparatus includes a double magnetron including first and second targets arranged to form a double electrode, and a power supply coupled to supply power to the first and second targets. The power supply includes a measurement unit for measuring values of at least one of discharge current and discharge voltage, such that at least one of a discharge current and a discharge voltage for each half-wave within an alternating-voltage discharge period is measured. A device for determining a difference between the measured values of a second half-wave and the measured values of the first half-wave is provided, as well as a device for comparing the determined differences to specific tolerance values, and a device for at least briefly suppressing the discharge when the specific tolerance values are exceeded by the determined differences.
摘要:
Process and control arrangement for introducing pulsing energy introduction into magnetron discharges. The process includes feeding a charge to the electrodes of a magnetron arrangement via a ignition source at a time t0, and, after the feeding of the electric charge, determining an ignition of the magnetron discharge. The process also includes introducing a current, having a predetermined value, from a boost source at a time t1, and, at a time t2, separating the ignition source from the electrodes of the magnetron arrangement. The introduction of the current by the boost source continues for a certain duration tEIN. The process also includes interrupting the introduction of the electric energy for a predetermined time tAUS.
摘要:
A method of coating of thin film coated magnetic disks and thin film magnetic disks made thereby is described. In accordance with the invention, a barrier layer is deposited on the substrate before the underlayer film(s) to increase the corrosion resistance of metallic substrate magnetic disks and, in the case of nonmetallic substrates, to reduce the diffusion of water to the substrate and of freely moveable ions from the substrate. Preferably the barrier layer is deposited by medium frequency pulsed sputtering at a frequency of 10 to 200 kHz and a pulse length to pulse pause ratio from 5:1 to 1:10. Aluminum or chromium are the preferred materials for the barrier layer. Additional improvements may be achieved where the sputtering process gas contains a proportion of oxygen and/or nitrogen.
摘要:
A method and apparatus for depositing an underlayer and/or a magnetic thin film layer on a data storage disk are described. The sputtering power is supplied in the form of pulses during the application of the underlayer and/or magnetic storage to periodically ignite the plasma and increase the charge-carrier density in the sputtering chamber. The repetition frequency and parameters for the pulses and pauses between pulses are adjusted to achieve a desired nominal value for the coercive field strength of the magnetic layer. Preferably the repetition frequency of the power switching is from 10 to 80 kHz and the ratio of pulse length to pulse pause is within 5:1 to 1:5.
摘要:
The present invention relates to a machine tool for machining of workpieces, having a workpiece support for mounting the workpiece, a tool holder, which can be moved at least along one axis, for holding a tool for machining the workpiece, and workpiece holding units for fixing the workpiece during the machining, the workpiece holding units being arranged outside the workpiece support surface of the workpiece support, which is covered by the workpiece in the mounted state, and each having a holding element for fixing the workpiece. In order that also workpieces of greater diameter can be machined, the machine tool otherwise being of the same dimensions, it is provided according to the invention that the holding elements can each be moved, substantially parallel to the workpiece support surface, in the direction of the workpiece, in particular in the direction of a central workpiece axis, which runs perpendicular to the workpiece support surface, for the purpose of centering and fixing the workpiece. The holding elements comprise a clamping surface that is arranged obliquely in relation to the workpiece support surface and that is, in the mounted state, pressed against the workpiece for fixing and centering the workpiece to be machined, thereby exerting a pressure both in the direction of the workpiece support surface and in the direction of the central workpiece axis.
摘要:
The present invention relates to a machine tool for machining of workpieces, having a workpiece support for mounting the workpiece, a tool holder, which can be moved at least along one axis, for holding a tool for machining the workpiece, and workpiece holding units for fixing the workpiece during the machining, the workpiece holding units being arranged outside the workpiece support surface of the workpiece support, which is covered by the workpiece in the mounted state, and each having a holding element for fixing the workpiece. In order that also workpieces of greater diameter can be machined, the machine tool otherwise being of the same dimensions, it is provided according to the invention that the holding elements can each be moved, substantially parallel to the workpiece support surface, in the direction of the workpiece, in particular in the direction of a central workpiece axis, which runs perpendicular to the workpiece support surface, for the purpose of centering and fixing the workpiece. The holding elements comprise a clamping surface that is arranged obliquely in relation to the workpiece support surface and that is, in the mounted state, pressed against the workpiece for fixing and centering the workpiece to be machined, thereby exerting a pressure both in the direction of the workpiece support surface and in the direction of the central workpiece axis.