公开(公告)号：US10593823B2

公开(公告)日：2020-03-17

申请号：US16061937

申请日：2016-12-13

Applicant: ROHM CO., LTD.

Inventor： Hideyuki Utsumi ,  Yuki Tanuma

IPC: H01L31/173 ,  G01V8/12 ,  G01J1/04 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/58

Abstract: An optical device includes a light-emitting unit and a light-receiving unit. The light-emitting unit emits light forward in a first direction. The light-emitting unit has a light-emitting-side through hole that causes light traveling backward in the first direction to pass through. The light-receiving unit is arranged backward in the first direction relative to the light-emitting unit. The light-receiving unit has a light receiver that receives light after the light has passed through the light-emitting-side through hole.

公开(公告)号：US09954143B2

公开(公告)日：2018-04-24

申请号：US14924415

申请日：2015-10-27

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L31/167 ,  H01L33/52 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L33/483 ,  H01L24/73 ,  H01L25/0753 ,  H01L31/167 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.

公开(公告)号：US11799266B2

公开(公告)日：2023-10-24

申请号：US16673519

申请日：2019-11-04

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma

IPC: H01S5/02257 ,  H01S5/02315 ,  H01S5/02216 ,  H01S5/42 ,  H01S5/0237 ,  H01S5/343 ,  H01S5/02335 ,  H01S5/183 ,  H01S5/02345

CPC classification number: H01S5/02257 ,  H01S5/02216 ,  H01S5/02315 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2924/16195 ,  H01S5/0237 ,  H01S5/02335 ,  H01S5/02345 ,  H01S5/18313 ,  H01S5/18347 ,  H01S5/3432 ,  H01S5/34353 ,  H01S5/423

Abstract: A semiconductor light-emitting device, includes: a semiconductor light-emitting element; a support including a base and a conductive part and configured to support the semiconductor light-emitting element; and a cover configured to overlap the semiconductor light-emitting element as viewed in a first direction, and to transmit light from the semiconductor light-emitting element, wherein the cover includes a base layer having a front surface and a rear surface which transmit the light from the semiconductor light-emitting element and face opposite sides to each other in the first direction, wherein the rear surface faces the semiconductor light-emitting element, wherein the base layer includes a plurality of undulation parts bonded to the support by a bonding material, and wherein the undulation parts are more uneven than the rear surface.

公开(公告)号：US10090448B2

公开(公告)日：2018-10-02

申请号：US14613969

申请日：2015-02-04

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma ,  Satoshi Uchida ,  Norio Yoshizawa ,  Hiroaki Watanabe ,  Takeyuki Adachi

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60 ,  H05K3/34 ,  F21Y115/10

Abstract: A light-emitting module is provided with a light-emitting element, a base, and a wiring pattern. The base includes an installation surface facing in a first direction and a mounting surface facing in a second direction which is at right angles to the first direction. The light-emitting element is installed on the installation surface. The wiring pattern is formed on the base and is in electrical contact with the light-emitting element. The base includes a pair of mounting recesses recessed from the mounting surface and spaced from each other in a third direction which is at right angles to both the first direction and the second direction. The wiring pattern includes a pair of mounting-surface electrodes respectively covering at least a part of the pair of mounting recesses.

公开(公告)号：US09458982B2

公开(公告)日：2016-10-04

申请号：US14486385

申请日：2014-09-15

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma ,  Tomoharu Horio

IPC: F21V3/00 ,  F21V5/00 ,  F21V5/04 ,  H01L33/48 ,  H05B33/02 ,  H01L23/00 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire, and a substrate. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface. The light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface. The wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract translation: 发光器件包括发光元件，导线和基板。 衬底形成有在衬底的公共表面中开口的第一凹部和第二凹部。 第一凹部包括第一底表面和连接到第一底表面的第一侧表面。 发光元件设置在第一底面上。 第二凹部包括第二底表面和连接到第二底表面的第二侧表面。 导线被接合到第二底面。 第一侧表面和第二侧表面都到达公共表面。 第一侧表面连接到第二底表面和第二侧表面。 第一凹部的开口面积大于第二凹部的开口面积。

公开(公告)号：US20160064619A1

公开(公告)日：2016-03-03

申请号：US14924415

申请日：2015-10-27

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L24/73 ,  H01L25/0753 ,  H01L31/167 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention provides a light emitting device which is capable of enhancing the radiant intensity on a single direction. The light emitting device comprises a substrate, a lens bonded to the substrate, and an LED chip bonded to the substrate and exposed in a gap clipped between the substrate and the lens, wherein the lens has a light output surface which bulges in a direction that is defined from the substrate toward the LED chip and is contained in a thickness direction of the substrate to transmit the light emitted from the LED chip.

Abstract translation: 本发明提供能够提高单个方向的辐射强度的发光装置。 发光装置包括基板，结合到基板的透镜以及结合到基板并在夹在基板和透镜之间的间隙中露出的LED芯片，其中透镜具有光输出表面，该光输出表面沿着 从基板朝向LED芯片定义，并且被包含在基板的厚度方向上，以透射从LED芯片发射的光。

公开(公告)号：US09202989B2

公开(公告)日：2015-12-01

申请号：US14474839

申请日：2014-09-02

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L31/167 ,  H01L33/52 ,  H01L25/075

CPC classification number: H01L33/483 ,  H01L24/73 ,  H01L25/0753 ,  H01L31/167 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting device is capable of enhancing the radiant intensity on a single direction. The light emitting device includes a substrate and an LED chip bonded to the substrate, wherein the substrate has a first cavity formed thereon having a first bottom surface for disposing the LED chip and a first lateral connecting to the first bottom surface, and the substrate has a second cavity formed thereon having a second bottom surface for bonding the metal wire and a second lateral connecting to the second bottom surface; and the first lateral has a notch formed thereon, which connects to the second bottom surface and the second lateral, and an area of the second bottom surface of the second cavity is smaller than that of the first bottom surface of the first cavity.

Abstract translation: 发光器件能够在单个方向上增强辐射强度。 发光器件包括衬底和结合到衬底的LED芯片，其中衬底具有形成在其上的第一腔，其具有用于布置LED芯片的第一底表面和与第一底表面的第一横向连接，并且衬底具有 形成在其上的第二空腔具有用于接合金属线的第二底面和与第二底面的第二横向连接; 并且第一侧面具有形成在其上的凹口，其连接到第二底表面和第二侧面，并且第二腔的第二底表面的区域小于第一腔的第一底表面的面积。

公开(公告)号：US20140374777A1

公开(公告)日：2014-12-25

申请号：US14474839

申请日：2014-09-02

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma

IPC: H01L33/48 ,  H01L31/167 ,  H01L33/60 ,  H01L33/62 ,  H01L33/52 ,  H01L33/58

CPC classification number: H01L33/483 ,  H01L24/73 ,  H01L25/0753 ,  H01L31/167 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting device is capable of enhancing the radiant intensity on a single direction. The light emitting device includes a substrate and an LED chip bonded to the substrate, wherein the substrate has a first cavity formed thereon having a first bottom surface for disposing the LED chip and a first lateral connecting to the first bottom surface, and the substrate has a second cavity formed thereon having a second bottom surface for bonding the metal wire and a second lateral connecting to the second bottom surface; and the first lateral has a notch formed thereon, which connects to the second bottom surface and the second lateral, and an area of the second bottom surface of the second cavity is smaller than that of the first bottom surface of the first cavity.

Abstract translation: 发光器件能够在单个方向上增强辐射强度。 发光器件包括衬底和结合到衬底的LED芯片，其中衬底具有形成在其上的第一腔，其具有用于布置LED芯片的第一底表面和与第一底表面的第一横向连接，并且衬底具有 形成在其上的第二空腔具有用于接合金属线的第二底面和与第二底面的第二横向连接; 并且第一侧面具有形成在其上的凹口，其连接到第二底表面和第二侧面，并且第二腔的第二底表面的区域小于第一腔的第一底表面的面积。

公开(公告)号：US10084117B2

公开(公告)日：2018-09-25

申请号：US15276508

申请日：2016-09-26

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma ,  Tomoharu Horio

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H05B33/02 ,  H01L23/00 ,  F21V5/04 ,  F21V7/22 ,  F21V17/10 ,  H01L33/56 ,  H01L33/60 ,  F21Y105/00 ,  F21Y101/00 ,  F21Y115/10

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

公开(公告)号：US09435931B2

公开(公告)日：2016-09-06

申请号：US13937859

申请日：2013-07-09

Applicant: ROHM CO., LTD.

Inventor： Yuki Tanuma

IPC: F21V7/04 ,  F21V8/00 ,  G02F1/1335

CPC classification number: G02B6/0035 ,  G02B6/0051 ,  G02B6/0055 ,  G02B6/0083 ,  G02B6/0088 ,  G02F1/133615

Abstract: An LED lighting apparatus of the invention includes a substrate having a length in a first direction and a width in a second direction. LED chips are supported on the substrate along the first direction. A light guide, having a thickness in the second direction, includes an incident surface, a reflective surface and an emitting surface. The incident surface faces in a third direction perpendicular to the first and second directions for receiving light emitted from the LED chips. The reflective surface spreads in the first and third directions and reflects light from the incident surface in the second direction. The emitting surface spreads in the first and third directions and allows light from the reflective surface to exit. The substrate is supported by a case that includes side plates around the light guide and a bottom plate connecting the side plates.

Abstract translation: 本发明的LED照明装置包括具有在第一方向上的长度和在第二方向上的宽度的基板。 LED芯片沿着第一方向支撑在基板上。 具有第二方向厚度的导光体包括入射表面，反射表面和发射表面。 入射表面面向与第一和第二方向垂直的第三方向，用于接收从LED芯片发出的光。 反射表面在第一和第三方向上扩展，并且在第二方向上反射来自入射表面的光。 发射表面在第一和第三方向上扩展，并允许来自反射表面的光离开。 基板由包括光导周围的侧板和连接侧板的底板的壳体支撑。