公开(公告)号：US20070099545A1

公开(公告)日：2007-05-03

申请号：US11556114

申请日：2006-11-02

申请人： Rashid Mavliev ,  Simon Yavelberg ,  Gerald Alonzo

发明人： Rashid Mavliev ,  Simon Yavelberg ,  Gerald Alonzo

IPC分类号： B24B49/00

CPC分类号： B24B49/00 ,  B24B37/34

摘要： Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored in-situ. The characterization tool and the polishing pad can be rotated or moved so that any portion of the polishing pad can be tested.

摘要翻译： 描述了用于原位表征抛光垫表面的工具和方法。 表征工具与抛光工具集成在一起，从而可以原位监测抛光垫。 表征工具和抛光垫可以旋转或移动，以便可以对抛光垫的任何部分进行测试。

公开(公告)号：US11756800B2

公开(公告)日：2023-09-12

申请号：US17219250

申请日：2021-03-31

申请人： Rashid Mavliev

发明人： Rashid Mavliev

IPC分类号： H01L21/48 ,  H01L23/528 ,  H05K3/10 ,  H05K3/24 ,  H01L21/683 ,  C25D17/00 ,  C25D5/02 ,  B29C33/42 ,  H05K3/06 ,  C25D7/06

CPC分类号： H01L21/485 ,  B29C33/424 ,  C25D5/022 ,  C25D7/0678 ,  C25D17/001 ,  H01L21/6835 ,  H01L23/528 ,  H05K3/108 ,  H05K3/241 ,  H01L2221/1084 ,  H01L2221/68359 ,  H01L2224/95115 ,  H05K3/062

摘要： Described herein are methods and systems for forming metal interconnect layers (MILs) on engineered templates and transferring these MILs to device substrates. This “off-device” approach of forming MILs reduces the complexity and costs of the overall process, allows using semiconductor processes, and reduces the risk of damaging the device substrates. An engineered template is specially configured to release a MIL when the MIL is transferred to a device substrate. In some examples, the engineered template does not include barrier layers and/or adhesion layers. In some examples, the engineered template comprises a conductive portion to assist with selective electroplating. Furthermore, the same engineered template may be reused to form multiple MILs, having the same design. During the transfer, the engineered template and device substrate are stacked together and then separated while the MIL is transitioned from the engineered template to the device substrate.

公开(公告)号：US07569134B2

公开(公告)日：2009-08-04

申请号：US11424170

申请日：2006-06-14

申请人： Paul Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai

发明人： Paul Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine Manens ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23H5/06 ,  C25D17/00

CPC分类号： H01L21/32125 ,  B23H5/08 ,  B24B37/046 ,  B24B37/24 ,  B24B53/017

摘要： Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

摘要翻译： 用于电化学处理衬底的系统和方法。 接触元件限定在处理期间可定位成接触衬底的衬底接触表面。 在一个实施例中，接触元件包括线元件。 在另一个实施例中，接触元件是旋转构件。 在一个实施例中，接触元件包括贵金属。

公开(公告)号：US07303662B2

公开(公告)日：2007-12-04

申请号：US10210972

申请日：2002-08-02

申请人： Rashid Mavliev ,  Stan Tsai ,  Yongqi Hu ,  Paul Butterfield ,  Antoine Manens ,  Liang-Yuh Chen

发明人： Rashid Mavliev ,  Stan Tsai ,  Yongqi Hu ,  Paul Butterfield ,  Antoine Manens ,  Liang-Yuh Chen

IPC分类号： C25F3/16 ,  C25F3/30 ,  C25F7/00

CPC分类号： B23H5/08 ,  B24B37/046 ,  B24B37/20 ,  H01L21/32125

摘要： Systems and methods for electrochemically processing. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.

摘要翻译： 电化学处理的系统和方法。 接触元件限定在处理期间可定位成接触衬底的衬底接触表面。 在一个实施例中，接触元件包括线元件。 在另一个实施例中，接触元件是旋转构件。 在一个实施例中，接触元件包括贵金属。

公开(公告)号：US20070099552A1

公开(公告)日：2007-05-03

申请号：US11555145

申请日：2006-10-31

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai ,  You Wang ,  Jie Diao ,  Renhe Jia ,  Lakshmanan Karuppiah ,  Robert Ewald

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai ,  You Wang ,  Jie Diao ,  Renhe Jia ,  Lakshmanan Karuppiah ,  Robert Ewald

IPC分类号： B23F21/03

CPC分类号： B24B37/046 ,  B24B27/0023 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34 ,  B82Y30/00

摘要： An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.

摘要翻译： 提供了一种用于处理基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括具有至少部分导电的抛光表面的主体的抛光制品。 电极设置在其间具有介电材料的抛光表面下方。 可以在抛光表面和电介质材料中形成多个孔，以至少部分地将电极暴露于抛光表面。 可以在电极和抛光表面之间设置膜，其可透过离子和电流，以促进电极和抛光表面之间的连续性。

公开(公告)号：US20070066201A1

公开(公告)日：2007-03-22

申请号：US11556011

申请日：2006-11-02

申请人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

发明人： Liang-Yuh Chen ,  Yuchun Wang ,  Yan Wang ,  Alain Duboust ,  Daniel Carl ,  Ralph Wadensweiler ,  Manoocher Birang ,  Paul Butterfield ,  Rashid Mavliev ,  Stan Tsai

IPC分类号： B23F21/03

CPC分类号： B82Y30/00 ,  B24B37/046 ,  B24B37/24 ,  B24B37/26 ,  B24D3/34

摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.

摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 电极还通过多个穿孔的至少一部分暴露于抛光表面。 制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。

公开(公告)号：US06991526B2

公开(公告)日：2006-01-31

申请号：US10244697

申请日：2002-09-16

申请人： Lizhong Sun ,  Liang-Yuh Chen ,  Siew Neo ,  Feng Q. Liu ,  Alain Duboust ,  Stan D. Tsai ,  Rashid Mavliev

发明人： Lizhong Sun ,  Liang-Yuh Chen ,  Siew Neo ,  Feng Q. Liu ,  Alain Duboust ,  Stan D. Tsai ,  Rashid Mavliev

IPC分类号： B24B1/00 ,  C25F7/00

CPC分类号： B24B37/042 ,  B23H5/08

摘要： Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate comprises a counter-electrode and a pad positioned between a substrate and the counter-electrode and a pad positioned between a substrate and the counter-electrode. A dielectric insert is positioned between the counter-electrode and the substrate. The dielectric insert has a plurality of zones, each zone permitting a separate current density between the counter-electrode and the substrate. In another embodiment, an apparatus for polishing a substrate that include a conductive layer comprises a counter-electrode to the material layer. The counter-electrode comprises a plurality of electrically isolated conductive elements. An electrical connector is separately coupled to each of the conductive elements.

摘要翻译： 本发明的各方面通常提供使用电化学沉积技术来抛光衬底的方法和装置。 一方面，用于研磨衬底的装置包括对电极和位于衬底和对电极之间的衬垫以及位于衬底和对电极之间的衬垫。 电介质插入件位于对电极和衬底之间。 电介质插入件具有多个区域，每个区域允许在对电极和衬底之间分开的电流密度。 在另一个实施例中，用于抛光包括导电层的衬底的装置包括与材料层相对的对电极。 对电极包括多个电绝缘的导电元件。 电连接器分别耦合到每个导电元件。

公开(公告)号：US20050229426A1

公开(公告)日：2005-10-20

申请号：US11054336

申请日：2005-02-09

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B05D3/02 ,  F26B3/00 ,  H01L21/00 ,  H01L21/306

CPC分类号： H01L21/02052 ,  H01L21/67034

摘要： In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.

摘要翻译： 在第一方面中，提供了干燥基板的第一种方法。 第一种方法包括以下步骤：（1）以第一速率提升衬底通过空气/流体界面; （2）在提升衬底期间在空气/流体界面处引导干燥蒸汽; 和（3）当衬底的一部分保留在空气/流体界面中时，降低衬底的剩余部分通过空气/流体界面提升到第二速率的速率。 干燥蒸气可以与空气/流体界面形成约23°的角度和/或第二速率可以为约2.5mm / sec。

公开(公告)号：US20050092620A1

公开(公告)日：2005-05-05

申请号：US10957199

申请日：2004-10-01

申请人： Rashid Mavliev ,  Alain Duboust ,  Stan Tsai

发明人： Rashid Mavliev ,  Alain Duboust ,  Stan Tsai

IPC分类号： B23H5/08 ,  B24B37/04 ,  B24B57/02 ,  C25F3/02 ,  H01L21/321 ,  B23H3/00

CPC分类号： B24B37/345 ,  B23H5/08 ,  B24B37/042 ,  B24B57/02 ,  C25F3/02 ,  H01L21/32125

摘要： Polishing compositions and methods for removing conductive material and barrier layer materials from a substrate surface are provided. Generally, variable amounts of abrasive particles are used for removing conductive material and barrier layer materials. In one aspect, a process is provided including providing an polishing composition between the first electrode and the substrate, wherein the polishing composition comprises a first concentration of abrasive particles, applying a bias between the first electrode and the second electrode, providing relative motion between the substrate and the polishing article, removing conductive layer material from the substrate, introducing abrasive particles to the polishing composition to form a second concentration of abrasive particles greater than a first concentration of abrasive particles, and removing barrier layer material from the substrate. The abrasive particles may be incrementally introduced or pulsed during a polishing process.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料和阻挡层材料的方法。 通常，可用量的磨料颗粒用于去除导电材料和阻挡层材料。 在一个方面，提供了一种方法，包括在第一电极和衬底之间提供抛光组合物，其中抛光组合物包含第一浓度的磨料颗粒，在第一电极和第二电极之间施加偏压， 衬底和抛光制品，从衬底移除导电层材料，将磨料颗粒引入抛光组合物以形成大于第一浓度的磨料颗粒的第二浓度的磨料颗粒，以及从衬底去除阻挡层材料。 研磨颗粒可以在抛光过程中递增地引入或脉冲。

公开(公告)号：US11125673B2

公开(公告)日：2021-09-21

申请号：US16889647

申请日：2020-06-01

申请人： Rashid Mavliev

发明人： Rashid Mavliev

IPC分类号： G01N15/14 ,  G01N21/05 ,  G01N15/02 ,  G01N21/53 ,  G01N15/00

摘要： Described are systems and methods for optical characterization of inclusions, such as solids and liquids, in liquid samples. An inclusion characterization system may include a radiation source, a radiation detector, a sample optical cell, and a sample delivery mechanism. The radiation detector may be configured to perform time resolved measurements. The sample may be delivered to the sample optical cell by the sample delivery mechanism at a flow rate set for preserving the sample integrity (i.e., the transport rate). The inclusion characterization in the sample may be performed at flow rates set for sample analysis (i.e., the analysis rate). The analysis rate may differ from the transport rate. The rate difference may be achieved by diverting only a portion of the overall sample into the sample optical cell. Also provided are examples of disengagement of sample transport and analysis flow rates.